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1. 发明专利

JP2003303850A Manufacturing method for semiconductor device 审中-公开
标题翻译：半导体器件的制造方法
公开(公告)号：JP2003303850A
公开(公告)日：2003-10-24
申请号：JP2002109905
申请日：2002-04-12
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HONMA HIROSHI , ODAJIMA HITOSHI
IPC分类号： H01L21/60 , H01L23/50
CPC分类号： H01L2224/14 , H01L2224/1403 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method wherein damage to a semiconductor device and a connection failure are suppressed when a plurality of semiconductor devices are simultaneously jointed under pressure and heat. SOLUTION: A bump of a semiconductor component is jointed to a lead wire of a lead frame, and the lead frame is cut for each semiconductor component. Dies, of which the heights of bumps are within a constant range, may be taken out of a diced wafer and aligned to be jointed to the lead frame, or semiconductor components in a range of a×b (2 COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种制造方法，其中当多个半导体器件在压力和热下同时接合时，可以抑制对半导体器件的损坏和连接故障。解决方案：将半导体部件的凸块接合到引线框架的引线，并且针对每个半导体部件切割引线框架。凸块的高度在恒定范围内的模具可以从切割的晶片中取出并对齐以与引线框架或半导体器件接合在一个×b（2

2. 发明专利

JP2007042087A Rfid tag and production method therefor 审中-公开
标题翻译： RFID标签及其生产方法
公开(公告)号：JP2007042087A
公开(公告)日：2007-02-15
申请号：JP2006180602
申请日：2006-06-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： INOUE KOSUKE , HONMA HIROSHI , ODAJIMA HITOSHI , ISADA NAOYA , UEDA KIE
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To supply a high-reliability RFID tag wherein an antenna and a bump electrode of an RFID chip are connected without using an anisotropic conductive sheet or the like and wherein excellent electric conduction is established between them, at low cost. SOLUTION: In this RFID tag having the antenna formed by electroconductive paste containing an electroconductive filler such as silver flake on a substrate, and the RFID chip connected to the antenna, after hardening a pattern of the antenna shaped by the electroconductive paste, the bump electrode of the RFID chip is brought into contact with the antenna, and they are heated to connect the RFID chip to the antenna by thermoplastic resin contained in the electroconductive paste. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种高可靠性RFID标签，其中RFID芯片的天线和突起电极连接而不使用各向异性导电片等，并且在它们之间建立良好的导电，低成本。解决方案：在具有由基板上含有银薄片等导电性填充剂的导电性胶料形成的天线的RFID标签和连接于天线的RFID芯片之后，在通过导电性糊料形成的天线的图形硬化后， RFID芯片的突起电极与天线接触，并且它们被加热以将RFID芯片与包含在导电浆料中的热塑性树脂连接到天线。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2000077452A Manufacture and equipment of semiconductor device 有权
标题翻译：半导体器件的制造和设备
公开(公告)号：JP2000077452A
公开(公告)日：2000-03-14
申请号：JP27178099
申请日：1999-09-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ODAJIMA HITOSHI , HASEGAWA HIROSHI , KAWARADA MASAYUKI , FUKAZAWA HIDEYUKI
IPC分类号： H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To enable conductive granules such as solder balls to be surely transferred onto a semiconductor device at high speed by a method, wherein conductive granules housed in a vessel are agitated by air flow or an inert gas and then fed to a mounting jig.
SOLUTION: A hopper 5001 of an depositing head 500 is mounted and fixed to a glass jig 4, so as to enable solder balls as conductive granules to be sucked in through the holes provided in the glass jig 4 from above, and a required number of separate solder balls are fed to the hopper 5001 by a separator through the use of compressed air. At this point, the compressed air is discharged through a gap provided between the lower part of the hopper 5001 and the glass jig 4, and the solder balls are kept in the hopper 5001. Then this compressed air is stopped, compressed air of prescribed pressure is fed through a hose 5019 to agitate solder balls in the hopper 5001, and solder balls are sent into holes provided to the glass jig 4 at a flow velocity of compressed air.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了使诸如焊料球之类的导电颗粒能够通过一种方法可靠地转移到半导体器件上，其中容纳在容器中的导电颗粒通过空气流或惰性气体搅动，然后被馈送到安装夹具解决方案：沉积头500的料斗5001安装并固定到玻璃夹具4上，以使得能够通过上方设置在玻璃夹具4中的孔吸入作为导电颗粒的焊球，并将所需数量的单独的焊球通过使用压缩空气通过分离器供给到料斗5001。此时，压缩空气通过设置在料斗5001的下部与玻璃夹具4之间的间隙排出，焊球保持在料斗5001中。然后，压缩空气停止，规定压力的压缩空气通过软管5019进给以搅拌料斗5001中的焊球，并且以压缩空气的流速将焊球送入设置到玻璃夹具4的孔中。

4. 发明专利

JP2004153270A Method and equipment for separating semiconductor devices and method for mounting semiconductor devices 审中-公开
公开(公告)号：JP2004153270A
公开(公告)日：2004-05-27
申请号：JP2003365449
申请日：2003-10-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ODAJIMA HITOSHI , FUTAKI KAZUYUKI , MATSUOKA MASATO
IPC分类号： H01L21/67 , H01L21/301 , H01L21/68 , H01L21/683
CPC分类号： H01L2221/6839
摘要： PROBLEM TO BE SOLVED: To provide a method and equipment for separating semiconductor devices in which a thin semiconductor wafer, which is stuck to an adhesive sheet, is cut into pieces of thin semiconductor devices, and the group of thin-semiconductor devices is taken off the adhesive sheet at a high speed, without being scratched or cracked, then a specified number of semiconductor devices are picked up and separated from the others of the group. SOLUTION: This method includes a separation process for attaching a semiconductor wafer to an adhesive sheet of which circumference is secured to a frame, for cutting the semiconductor wafer into pieces of semiconductor devices, for positioning the group of semiconductor devices and holding it with a chuck 150 of cutting off the rim of the adhesive sheet around the group of semiconductor devices, and for peeling the adhesive sheet away from the group of semiconductor devices; and a receiving process for picking up a specified number of semiconductor devices from the group of semiconductor devices held by the chuck, and of receiving them in a tray 2. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2002152076A RADIO COMMUNICATION APPARATUS AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2002152076A
公开(公告)日：2002-05-24
申请号：JP2000342297
申请日：2000-11-09
申请人： HITACHI LTD
发明人： DAIROKU NORIYUKI , ODAJIMA HITOSHI , INOUE KOSUKE , HONMA HIROSHI
IPC分类号： G06K19/07 , G06K19/077 , H01Q1/40 , H01Q9/16 , H01Q13/08 , H01Q23/00 , H04B1/38 , H04B1/3822 , H04B1/59 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a small radio communication apparatus which has thin and flexible general structure and can inexpensively be manufactured while sufficient connection reliability is secured. SOLUTION: The radio communication apparatus is provided with a radio IC chip 101 where an integrated circuit part except for a connection terminal part 104a is molded by mold resin 105 and an outer antenna 312 where metal foil arranged in a sheet substrate 310 is formed in an antenna. The outer antenna 312 is connected to the connection terminal part 104a of the radio IC chip 101 by soldering, conductive adhesive joint, ultrasonic wave pressure welding joint and conductive filling material paste joint.

6. 发明专利

JP2002028896A DIE WITH SEE-THROUGH OPTICAL SYSTEM AND POSITIONING METHOD 失效
公开(公告)号：JP2002028896A
公开(公告)日：2002-01-29
申请号：JP2000217223
申请日：2000-07-13
申请人： HITACHI LTD
发明人： MATSUMOTO TAKASHI , ODAJIMA HITOSHI , WAI SHINICHI
IPC分类号： B42D15/10 , B26D5/34
摘要： PROBLEM TO BE SOLVED: To dispense with the positioning mark printing and boring on the surface by using the function of a see-through optical system in the die-cutting of a laminated film material having circuits or the like on an inner layer for an IC card or the like. SOLUTION: Light is applied from a light source 9 to a nontransparent laminated sheet 1 from below inner marks in Fig. 4, the mark 12 is detected by a camera 10 and automatically matched with the mark 16 for positioning at the same time, and punching is applied by the shearing of an upper die 3 and a lower die 2 after the camera 10 is moved to the outside. A printing process of the positioning mark and a boring process on the surface of the sheet material can be omitted, and the card with high-quality inner layer can be manufactured by applying high-precision see-through positioning.

7. 发明专利

JP2001257222A SEMICONDUCTOR MOUNTING DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001257222A
公开(公告)日：2001-09-21
申请号：JP2000070989
申请日：2000-03-09
申请人： HITACHI LTD
发明人： INOUE KOSUKE , ODAJIMA HITOSHI
IPC分类号： B42D15/10 , G06K17/00 , G06K19/07 , G06K19/077 , G06K19/10 , H01L21/301 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To solve a problem in which it is hard to handle a semiconductor chip of small thickness, so that a non-contact recognition device in which the above semiconductor chip is built is low in capability for assembling mass- production, and the cost of a security management for prevention of the forgery of the non-contact recognition device is high. SOLUTION: A film 15 is expanded to be enlarged in area so as to enhance a semiconductor chip array in space between semiconductor chips 2 before the semiconductor chips 2 are transferred onto the tape 3 from the film 15, by which the semiconductor chips 2 are directly transferred and mounted on the tape 3 without using a suction nozzle 91. Furthermore, a random number holder 8 which holds uncreatable random numbers is provided inside a non- contact recognition device 6, and the numbers are registered on a data base 32 just before the non-contact recognition device 6 is used.

8. 发明专利

JPH11179878A METHOD AND APPARATUS FOR FORMING PATTERN BY SCREEN PRINTING 失效
公开(公告)号：JPH11179878A
公开(公告)日：1999-07-06
申请号：JP35034597
申请日：1997-12-19
申请人： HITACHI LTD
发明人： OKAMOTO MASAHIDE , ISHIHARA SHOSAKU , KIRIGATANI MASAHITO , KUROKI TAKASHI , ODAJIMA HITOSHI , HIRABAYASHI HISAAKI , TSUTSUI YOSHITAKA
IPC分类号： B41F15/08 , B41F15/40 , B41M1/12 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a pattern for printing with high reliability without breakage of a sheet at the time of releasing a printing screen from a surface of a printing base even if the base is a sheet-like brittle by preventing partial thinning of a pattern film thickness in the case of forming a paste pattern of a fine width on a surface of the base. SOLUTION: The method for forming a pattern by screen printing comprises the steps of arranging patterns at an interval in non-contact state on a printing bas 1, supplying a paste 8 onto a printing screen 3 formed with a predetermined opening pattern in advance, and moving a printing squeegee 6 to form a paste pattern on the surface of the base. In this case, the squeegee is moved to fill the paste in the opening of the screen. The state that the paste is filled is maintained for a predetermined time, then a screen separating plate 7 is moved, and a separating boundary line between the screen and the surface of the base is sequentially moved from one end of the base to the other end of the base.

9. 发明专利

JPH09213854A METHOD OF SEALING LIQUID COOLANT IN MODULE 失效
公开(公告)号：JPH09213854A
公开(公告)日：1997-08-15
申请号：JP1980196
申请日：1996-02-06
申请人： HITACHI LTD
发明人： TAMURA MITSUNORI , DOI HIROYUKI , SHIRAI MITSUGI , ODAJIMA HITOSHI
IPC分类号： H01L23/42 , H01L23/22 , H01L23/44
摘要： PROBLEM TO BE SOLVED: To provide a sealing method of surely filling liquid coolant into a module without leaving air bubbles trapped in gaps inside the module. SOLUTION: A module is composed of a frame 30 and a ceramic wiring board 10 with a recess which is located on its upside and houses an IC 20 such as electronic circuit component, and liquid coolant 70 is poured into the module. The module is housed in a hermetically sealed chamber 100, the chamber 100 is reduced in inner pressure to a first certain pressure to remove air bubbles. Thereafter, inert gas is introduced into the chamber 100 to make the inner pressure of the chamber 100 stay at an intermediate pressure between an atmospheric pressure and the first certain pressure, a lid of cooling structure 40 is placed on the top of the module, then the inner pressure of the chamber 100 is returned to an atmospheric pressure, and liquid coolant is sealed up in the module.

10. 发明专利

JPH09155771A CARRYING METHOD 失效
公开(公告)号：JPH09155771A
公开(公告)日：1997-06-17
申请号：JP31774995
申请日：1995-12-06
申请人： HITACHI LTD , HITACHI TOKYO ELECTRONICS
发明人： KANETOMO MASABUMI , KASHIMA HIDEO , KURODA KATSUHIRO , SUZUKI TAKAMICHI , ODAJIMA HITOSHI , INOUE MICHIYASU , TAJIMA TAKESHI , KOBAYASHI SEIICHIRO
IPC分类号： B25J9/00 , B25J18/06 , B25J19/00 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a means which materializes space saving and carrying at a high speed in regard to wafer carrying. SOLUTION: The moving position to this side of a wafer 1 rested over a holder 2 is made to be located at the rotation center 12 of a driving shaft 5, and movement to the aforesaid position can be performed by elastically deforming a leaf spring 4 combining the holder 2 with the driving shaft. Therefor, since the wafer 1 can be located at its rotation center 12, a driving system and the wafer 1 are to be located above and below, and its setting space can thereby be made small. Besides, since centrifugal force acting on the wafer 1 becomes almost zero at the time of its high speed rotation, its rotational movement can thereby be performed at a high speed.

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