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1. 发明专利

JP2009075687A Rfid tag 审中-公开
标题翻译： RFID标签
公开(公告)号：JP2009075687A
公开(公告)日：2009-04-09
申请号：JP2007241732
申请日：2007-09-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： DAIROKU NORIYUKI , ISADA NAOYA , SHINDO HIDEHIKO , KAMISAKA KOICHI
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： G06K19/07749
摘要： PROBLEM TO BE SOLVED: To provide an RFID tag for allowing heightening of communication accuracy between a circuit chip and its external circuit through an antenna while keeping the circuit chip and the antenna of a tag sheet in a non-contact state, and allowing sticking even to any object. SOLUTION: In this RFID tag, the circuit chip formed with a loop-like antenna coil on its principal face and the tag sheet formed with an antenna pattern on its principal face are prepared, and the circuit chip is mounted on the principal face of the tag sheet such that the circuit chip does not overlap the antenna pattern. The circuit chip is disposed close to the antenna pattern, and preferably, at least a half round of the principal face thereof is made to face to the antenna pattern. Thereby, because transfer of a signal or power between the circuit chip (the antenna coil) and the antenna pattern is certainly performed, the high-performance and strong RFID tag can be obtained by only roughly aligning the circuit chip and the tag sheet. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种RFID标签，用于通过天线提高电路芯片和其外部电路之间的通信精度，同时保持电路芯片和标签片的天线处于非接触状态，以及允许粘贴甚至任何物体。解决方案：在该RFID标签中，准备在其主面上形成有环状天线线圈的电路芯片和在其主面上形成有天线图案的标签片，并且将电路芯片安装在主体上使得电路芯片不与天线图案重叠。电路芯片靠近天线图案设置，并且优选地，其主面的至少半个圆形面对天线图案。因此，由于可靠地进行电路芯片（天线线圈）和天线方向图之间的信号或电力的传递，所以只要将电路芯片和标签片材大致对准即可得到高性能，强大的RFID标签。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008034317A Image display device 审中-公开
标题翻译：图像显示设备
公开(公告)号：JP2008034317A
公开(公告)日：2008-02-14
申请号：JP2006209035
申请日：2006-07-31
申请人： Hitachi Displays Ltd , Hitachi Ltd , 株式会社日立ディスプレイズ , 株式会社日立製作所
发明人： TACHIHARA HIROYUKI , HATORI AKIRA , DAIROKU NORIYUKI
IPC分类号： H01J31/12 , H01J29/86
CPC分类号： H01J31/123 , H01J29/862 , H01J2329/862
摘要： PROBLEM TO BE SOLVED: To achieve downsizing and weight reduction of an image display device by specifying the frame width dimension of a frame body in a flat type image display device in which an image signal electrode and a scanning signal electrode are arranged in a matrix shape via an insulating film, in which the rear substrate arranging an electron source in the vicinity of an intersection part of both electrodes, and the front substrate having a phosphor layer and a positive electrode are airtightly sealed with a sealing member via the frame body to form a sealing frame, and in which a display region surrounded by the frame body is made to have a vacuum atmosphere.
SOLUTION: The frame width of the frame body on the long side is made wider than that on the short side.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了通过在其中布置图像信号电极和扫描信号电极的平面型图像显示装置中指定框体的框架宽度尺寸来实现图像显示装置的小型化和重量减轻经由绝缘膜的矩阵形状，其中在两个电极的交叉部分附近布置电子源的后基板和具有荧光体层和正极的前基板经由框架被密封地密封从而形成密封框架，并且使由框体包围的显示区域具有真空气氛。
解决方案：长边的框体的框架宽度比短边的宽。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007017799A Display panel and its manufacturing method 审中-公开
标题翻译：显示面板及其制造方法
公开(公告)号：JP2007017799A
公开(公告)日：2007-01-25
申请号：JP2005200686
申请日：2005-07-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： DAIROKU NORIYUKI
IPC分类号： G09F9/00 , H01J9/26 , H01J29/86 , H01J31/12
摘要： PROBLEM TO BE SOLVED: To provide technique of sticking together a front substrate and a back substrate in an appropriate position in a display panel constituted by sticking together both the substrates across a frame held therebetween.
SOLUTION: The sticking together of the front substrate and the back substrate is performed while the warpage and distortion of the frame are straightened by pressing down the frame. For this purpose, the frame is formed with the areas (for example, where the corners of the frame are provided with recesses) for pressing down the frame to the front substrate or the back substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供将前基板和后基板粘合在由两个基板粘合在一起的显示面板中的适当位置的技术。
解决方案：通过按下框架来使框架的翘曲和变形矫直，执行前基板和后基板的粘合。为此，框架形成有用于将框架按压到前基板或后基板的区域（例如，框架的拐角设置有凹部）。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006179296A Image display device 审中-公开
标题翻译：图像显示设备
公开(公告)号：JP2006179296A
公开(公告)日：2006-07-06
申请号：JP2004371031
申请日：2004-12-22
申请人： Hitachi Displays Ltd , Hitachi Ltd , 株式会社日立ディスプレイズ , 株式会社日立製作所
发明人： SASAMOTO TOSHIO , KODERA YOSHIE , HIRASAWA SHIGEMI , KIJIMA YUICHI , DAIROKU NORIYUKI
IPC分类号： H01J31/12 , H01J29/94
摘要： PROBLEM TO BE SOLVED: To provide an image display device enhanced in reliability by installing a getter room without increasing thickness of the whole display device.
SOLUTION: The getter room BGX having an opening AP opened to an airtightly sealed inner part is installed by intervening it between a back substrate SUB1 and a front substrate SUB2 in the vicinity of a sealing frame MFL for sticking the back substrate SUB1 and the front substrate SUB2 to each other. A getter (not shown in Figs.) is previously housed in the getter room GBX; the inside of a vacuum vessel is evacuated with a vacuum pump or the like; and thereafter the getter is heated from the outside of the vacuum vessel to adsorb residual gas thereto.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过在不增加整个显示装置的厚度的情况下安装吸气室来提供可靠性增强的图像显示装置。解决方案：将具有向气密密封内部开口的开口AP的吸气室BGX安装在密封框架MFL附近的背面基板SUB1和前基板SUB2之间，用于粘贴背面基板SUB1和前基板SUB2彼此。吸气剂（图中未示出）预先容纳在吸气室GBX中; 真空容器的内部用真空泵等抽真空; 然后从真空容器的外部加热吸气剂以吸附残余气体。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004295466A Wireless authentication device 有权
公开(公告)号：JP2004295466A
公开(公告)日：2004-10-21
申请号：JP2003086914
申请日：2003-03-27
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： DAIROKU NORIYUKI , HONOKI HIDEYUKI , HONMA HIROSHI
IPC分类号： G06K19/07 , G06K19/077 , H01Q9/26
摘要： PROBLEM TO BE SOLVED: To improve omnidirectionality (omnidirectivity) with a single dipole antenna. SOLUTION: A wireless authentication device has the flat dipole antenna and a semiconductor chip connected to the dipole antenna, and receives power and a signal from a radio wave received by the dipole antenna and emits an output from the dipole antenna. The dipole antenna is folded back to such angles as the semiconductor chip is displaced from the directions of extension of the dipole antenna. COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2003179183A SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2003179183A
公开(公告)日：2003-06-27
申请号：JP2002367453
申请日：2002-12-19
申请人： HITACHI LTD
发明人： YAMAGUCHI YOSHIHIDE , TENMYO HIROYUKI , INOUE KOSUKE , DAIROKU NORIYUKI , HOZOJI HIROYUKI , TSUNODA SHIGEHARU , ISADA NAOYA , MINAGAWA MADOKA , ANJO ICHIRO , NISHIMURA ASAO , UJIIE KENJI , YAJIMA AKIRA
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To realize a semiconductor device capable of flip-chip connection requiring no underfill. SOLUTION: The semiconductor device comprises a semiconductor element, an insulation layer formed by mask printing an insulation material containing particles on the semiconductor element, and an external connection terminal formed on the insulation layer and connected electrically with the electrode of the semiconductor element. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2002141326A METHOD AND DEVICE OF LIQUID TREATMENT OF PLATE MATERIAL 失效
公开(公告)号：JP2002141326A
公开(公告)日：2002-05-17
申请号：JP2000339145
申请日：2000-11-01
申请人： HITACHI LTD
发明人： SAEKI TOMONORI , TAKAHARA YOICHI , DAIROKU NORIYUKI , TANAKA YUICHIRO , AIUCHI SUSUMU , OKA HITOSHI
IPC分类号： B08B1/04 , B08B3/02 , B08B3/04 , B08B3/08 , B08B5/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To solve the problem that liquid adhered to a plate opposing a plate material is not removed at the time of a gas treatment in a method of treating the material surface by consecutively supplying liquid and gas between the plate material and the plate opposed to it. SOLUTION: The periphery of the opposing plate is heated by imbedding heaters around it, irradiating it by a lamp, supplying heated liquid to it or by other methods to speed up the evaporation of the adhered liquid.

8. 发明专利

JP2002025970A SUBSTRATE CLEANING METHOD AND ITS APPARATUS 失效
公开(公告)号：JP2002025970A
公开(公告)日：2002-01-25
申请号：JP2000203054
申请日：2000-06-30
申请人： HITACHI LTD
发明人： SAEKI TOMONORI , TAKAHARA YOICHI , DAIROKU NORIYUKI , TANAKA YUICHIRO , AIUCHI SUSUMU
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To solve the problem of establishing a drying method capable of protecting a substrate against contamination caused by liquid attached to the periphery of a cleaning plate in a drying process, where the above problem is caused by the fact that liquid attached to the cleaning plate is apt to contaminate the surface of the substrate in a conventional method of cleaning and drying the surface of the substrate, by continuously feeding liquid and gas to a space between the substrate and the opposed cleaning plate, therefore liquid attached to the cleaning plate is required to be removed quickly after a drying process is started, but liquid attached to the periphery of the cleaning plate is not easily removed. SOLUTION: The cleaning plate larger than the substrate is used, by which the periphery of the cleaning plate where liquid is left is set separate from the substrate. Furthermore, it is effective that a means for keeping distances short between the substrate and the cleaning plate, and a substrate holding part and the cleaning plate respectively is jointly used to decrease liquid left on the surface of the cleaning plate.

9. 发明专利

JP2001358454A SOLDERING METHOD AND DEVICE 失效
公开(公告)号：JP2001358454A
公开(公告)日：2001-12-26
申请号：JP2000180716
申请日：2000-06-12
申请人： HITACHI LTD
发明人： SATO ISAO , DAIROKU NORIYUKI , MIURA KAZUMA , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA
IPC分类号： B23K1/00 , B23K1/008 , B23K3/04 , B23K31/02 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To make soldering junction temperature uniform to an electronic circuit board where various kinds of electronic components having different heat capacity, heat-resistance properties, or the like are mixedly mounted, and to obtain excellent quality in soldering. SOLUTION: A soldering device conveys an electronic circuit board 6 where an electronic component 9 is mounted by a conveyance means, and fuses solder by the heating of a heating oven for joining the electronic component 9. Also, the soldering device is equipped with a means for heating or cooling the electronic component 9 that is mounted onto an electronic circuit board 6, and a means for moving a means 7 for heating and cooling at nearly the same speed as the conveyance speed of the electronic circuit board 6.

10. 发明专利

JP2000277477A SUBSTRATE FLUID PROCESSING METHOD AND EQUIPMENT 失效
公开(公告)号：JP2000277477A
公开(公告)日：2000-10-06
申请号：JP7874099
申请日：1999-03-24
申请人： HITACHI LTD , KOKUSAI ELECTRIC CO LTD
发明人： TAKAHARA YOICHI , SAEKI TOMONORI , DAIROKU NORIYUKI , TANAKA YUICHIRO , AIUCHI SUSUMU , OKA HITOSHI , MORITA FUMIO , FUJISHIRO MASATAKA , YAMAOKA AKINOBU
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To prevent drying marks on a substrate caused by static electricity and water droplets in a device which processes the substrate with fluid as it rotates. SOLUTION: Cleaning plates 3 and 5 sandwiching a substrate 4 between them are formed of conductive material and grounded, by which static electricity is prevented from being generated. In a state where the substrate 4 is rotated, cleaning fluid is supplied to the gaps between the cleaning plates 3 and 5 and the substrate 4 through fluid feed openings 3a and 5a each provided to the centers of the plates 3 and 5 to clean the substrate 4, and the substrate 4 is dried out. By this setup, the substrate 4 can be processed without producing drying marks on its surface.

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