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1. 发明专利

JP2005268231A Image evaluating method and microscope 有权
标题翻译：图像评估方法和显微镜
公开(公告)号：JP2005268231A
公开(公告)日：2005-09-29
申请号：JP2005136787
申请日：2005-05-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISHITANI TORU , SATO MITSUGI , TODOKORO HIDEO , OTAKA TADASHI , IIIZUMI TAKASHI , TAKANE ATSUSHI
IPC分类号： H01J37/22 , H01J37/04 , H01J37/28
摘要： PROBLEM TO BE SOLVED: To provide an image evaluating method to objectively evaluate image resolution of a microscope image.
SOLUTION: The image evaluating method is characterized in that resolution in partial regions of an image is obtained over an entire area of the image or a portion of the image, averaged over the entire area of the image or the portion of the image, and the averaged value is established as the resolution evaluated value of the entire area of the image or the portion of the image. The constitution eliminates subjective impressions of an evaluator from evaluating microscope image resolution, therefor image resolution evaluated values attaining high accuracy and good repeatability.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种客观评价显微镜图像的图像分辨率的图像评估方法。解决方案：图像评估方法的特征在于，在图像的整个区域或图像的整个区域上的图像的整个区域或图像的整个区域上的部分区域获得图像的部分区域中的分辨率并且平均值被建立为图像的整个区域或图像的部分的分辨率评估值。该结构消除了评估者对评估显微镜图像分辨率的主观印象，因此图像分辨率评估值达到高精度和良好的重复性。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2003065743A Determination method for projection/recession of sample surface 审中-公开
标题翻译：用于投影/表征样品表面的测定方法
公开(公告)号：JP2003065743A
公开(公告)日：2003-03-05
申请号：JP2001259127
申请日：2001-08-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MIZUNO TAKESHI , KOJIMA TAKEKI , IIIZUMI TAKASHI
IPC分类号： G01B15/00 , G01B15/08 , H01J37/147 , H01J37/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a determination method for projection/recession of sample surface correctly identifying both a line section and a space section on a semiconductor wafer.
SOLUTION: The method aslant irradiates a sample with an electron beam to obtain a secondary electron and then forms a line profile based on the obtained secondary electron. If a half bandwidth of the line profile on slanted side is wider, it is determined to be a projection pattern, or determined to be a recession pattern if the half bandwidth of the line profile on the opposite side is wider.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种正确地识别半导体晶片上的线路部分和空间部分的样品表面的投影/凹陷的确定方法。解决方案：该方法用电子束照射样品以获得二次电子，然后基于获得的二次电子形成线轮廓。如果倾斜侧的线轮廓的半带宽较宽，则如果相对侧的线轮廓的半带宽较宽，则确定为投影图案，或者确定为凹陷图案。

3. 发明专利

JP2007207763A Charged-particle beam microscope, image formation method, and computer for evaluating image resolution 有权
标题翻译：充电颗粒光束显微镜，图像形成方法和计算机，用于评估图像分辨率
公开(公告)号：JP2007207763A
公开(公告)日：2007-08-16
申请号：JP2007038076
申请日：2007-02-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISHITANI TORU , SATO MITSUGI , TODOKORO HIDEO , OTAKA TADASHI , IIIZUMI TAKASHI , TAKANE ATSUSHI
IPC分类号： H01J37/22 , G01B15/00 , G01N23/225 , H01J37/24 , H01J37/28
摘要： PROBLEM TO BE SOLVED: To provide an image evaluation method capable of evaluating the image resolution of a microscope image objectively. SOLUTION: In the image evaluation method, resolution in partial regions of an image is obtained over an entire area of the image or a portion of the image, averaging is performed over the entire area of the image or the portion of the image, and the averaged value is established as the resolution evaluation value of the entire area of the image or the portion of the image. This method eliminates the subjective impressions of the evaluator from evaluation of microscope image resolution, so image resolution evaluation values of high precision and good repeatability can be obtained for the evaluation value of the image resolution. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够客观地评价显微镜图像的图像分辨率的图像评价方法。解决方案：在图像评估方法中，在图像的整个区域或图像的一部分上获得图像的部分区域中的分辨率，在图像的整个区域或图像的一部分上执行平均并且平均值被建立为图像的整个区域或图像的部分的分辨率评估值。该方法消除了评估者对显微镜图像分辨率评估的主观印象，因此可以获得图像分辨率评估值的高精度和良好重复性的图像分辨率评估值。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007081411A Remote maintenance method, industrial equipment, and semiconductor device 有权
标题翻译：远程维护方法，工业设备和半导体器件
公开(公告)号：JP2007081411A
公开(公告)日：2007-03-29
申请号：JP2006252026
申请日：2006-09-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ARIMA JUNTARO , INABA MASAAKI , AIZONO TAKEO , IIIZUMI TAKASHI
IPC分类号： H01L21/02 , G06Q50/00 , G06Q50/10 , H04Q9/00
摘要： PROBLEM TO BE SOLVED: To provide a remote maintenance method, a remote maintenance system, and industrial equipment which realize control according to the content of remote maintenance work and the client of maintenance, detailed service, and charging. SOLUTION: In the remote maintenance method of a system, a semiconductor manufacturing device 123 for carrying out a specific treatment and a work device 113 for maintaining the semiconductor manufacturing device 123 are connected via a network. The work device 113 sends order information representing the order of maintenance to the semiconductor manufacturing device 123. The semiconductor manufacturing device 123 carries out a treatment according to the received order information, and holds attribute information representing the attribute of the user of the work device 113 and condition information representing the condition of the attribute required for carrying out the treatment according to the order information. The attribute information and the condition information are read out when the order information is received from the work device 113. The treatment according to the order information is carried out only in the case where the attribute in the attribute information satisfies the condition of the condition information. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供远程维护方法，远程维护系统和工业设备，根据远程维护工作的内容和客户的维护，详细的服务和收费实现控制。解决方案：在系统的远程维护方法中，用于执行特定处理的半导体制造装置123和用于维持半导体制造装置123的工作装置113经由网络连接。作业装置113向半导体制造装置123发送表示维护顺序的订单信息。半导体制造装置123根据接收到的订单信息进行处理，并且保存表示作业装置113的使用者的属性的属性信息以及表示根据订单信息进行处理所需的属性的条件的条件信息。当从工作装置113接收到订单信息时，会读出属性信息和条件信息。仅在属性信息中的属性满足条件信息的条件的情况下才执行根据订单信息的处理。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007012624A Pattern matching method and apparatus 有权
标题翻译：图案匹配方法和装置
公开(公告)号：JP2007012624A
公开(公告)日：2007-01-18
申请号：JP2006188798
申请日：2006-07-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YAMAGUCHI SATOSHI , IIIZUMI TAKASHI , KOMURO OSAMU , MOROKUMA HIDETOSHI , MAEDA TATSUYA , ARIMA JUNTARO , OZAWA YASUHIKO
IPC分类号： H01J37/22 , G01N23/225
摘要： PROBLEM TO BE SOLVED: To make a scanning electron microscope operate with high precision at high speed by reducing a process for inspection alignment, inputting work or the like.
SOLUTION: The scanning electron microscope having a function specifying a desired position based on a pattern registered beforehand, comprises a means for setting information about the type of the pattern, spaces between a plurality of parts forming the pattern and the size of parts forming the pattern, and a means for forming a pattern image formed of a plurality of the parts based on information acquired by the setting means.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过减少检查对准，输入工作等的处理，使扫描电子显微镜以高精度高速运行。解决方案：具有基于预先登记的图案指定期望位置的功能的扫描电子显微镜包括用于设置关于图案的类型的信息的装置，形成图案的多个部件与部件的尺寸之间的间隔形成图案，以及用于基于由设置装置获取的信息形成由多个部分形成的图案图像的装置。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006319351A Pattern inspection method and pattern inspection device 审中-公开
标题翻译：模式检验方法和图案检测装置
公开(公告)号：JP2006319351A
公开(公告)日：2006-11-24
申请号：JP2006171190
申请日：2006-06-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YAMAGUCHI ATSUKO , TERASAWA TSUNEO , OTAKA TADASHI , IIIZUMI TAKASHI , KOMURO OSAMU
IPC分类号： H01L21/66 , G01B15/04 , G01B15/08
摘要： PROBLEM TO BE SOLVED: To provide a pattern edge shape inspection method and a pattern inspection device which quantitatively analyze, by the nondestructive inspection, line edge shapes of a micropattern featuring materials, processes and exposure optical systems, and find out faults in manufacturing processes and image distortions.
SOLUTION: The pattern inspection method involves inspecting a pattern shape from the two-dimensional distribution information (42) of a secondary electron intensity or a reflected electron intensity obtained by the observation (41) of the pattern formed on a substrate by a scanning microscope using charged particle beams, and comprises a step (45) of detecting a set of edge points expressing the edge points of the pattern in a two-dimensional surface by the threshold value method, a step (48) of obtaining an approximate line for the set of the detected edge points, and a step of determining an edge roughness shape and characteristic by calculating (49) a difference between the set of the edge points and the approximate line, wherein as the threshold value used in the threshold method, a plurality of values are used.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种图案边缘形状检查方法和图案检查装置，其通过非破坏性检查定量分析具有材料，工艺和曝光光学系统的微图案的线边缘形状，并且发现缺陷制造过程和图像扭曲。解决方案：图案检查方法包括从二维电子强度的二维分布信息（42）检测图案形状或通过由基板上形成的图案的观察（41）获得的二次电子强度或反射电子强度来检查图案形状使用带电粒子束的扫描显微镜，并且包括通过阈值法检测表示二维表面中的图案的边缘点的一组边缘点的步骤（45）;获得近似线的步骤（48）对于所检测的边缘点的集合，以及通过计算（49）边缘点的集合和近似线之间的差异来确定边缘粗糙度形状和特性的步骤，其中作为阈值方法中使用的阈值，使用多个值。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005191017A Scanning electron microscope 审中-公开
标题翻译：扫描电子显微镜
公开(公告)号：JP2005191017A
公开(公告)日：2005-07-14
申请号：JP2005087469
申请日：2005-03-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OSHIMA TAKU , TAKATO ATSUKO , HIRANUMA MASAYUKI , KANDA KIMIO , OTAKA TADASHI , IIIZUMI TAKASHI
IPC分类号： H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28
摘要： PROBLEM TO BE SOLVED: To enable high precision and high resolving power observation in a short time without expertise even toward an easily electrified testpiece by having a function to sense and report an electrification phenomenon causing precision deterioration or resolving power lowering and by simplifying a countermeasure against electrification.
SOLUTION: A scanning electron microscope senses the electrification phenomenon with a surface potential observing measure of an observed sphere of the testpiece or with a monitoring measure of the image change by that, and has a display measure of that effect. The countermeasure against electrification is actuated on the basis of the observed effect of the surface potential, the monitored effect of the image, or sorting items of those effects.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过具有感测和报告导致精度劣化或分解功率降低的通电现象的功能，能够在短时间内无需专门技术来实现高精度和高分辨率的观察，即使是易于带电的试样，电气化的对策。解决方案：扫描电子显微镜利用被测试物体的观察球体的表面电位观察测量值或通过图像变化的监视度量来感测通电现象，并具有该效果的显示度量。基于观察到的表面电位效应，图像的监视效果或者这些效果的排序项目来启动对抗电气的对策。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2007128913A Image evaluation method and microscope 有权
标题翻译：图像评估方法和显微镜
公开(公告)号：JP2007128913A
公开(公告)日：2007-05-24
申请号：JP2007024988
申请日：2007-02-05
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISHITANI TORU , SATO MITSUGI , TODOKORO HIDEO , OTAKA TADASHI , IIIZUMI TAKASHI , TAKANE ATSUSHI
IPC分类号： H01J37/28 , H01J37/22 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide an image evaluation method to objectively evaluate image resolution of a microscope image.
SOLUTION: The image evaluation method is characterized in that resolution in partial regions of an image is obtained over an entire area of the image or a portion of the image and averaged over the entire area of the image or the portion of the image, and that average is to be a resolution evaluation value of the entire area of the image or the portion of the image. With this structure, this method eliminates subjective impressions of an evaluator in evaluation of microscope image resolution, so that image resolution evaluation values of high accuracy and good repeatability can be obtained.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种客观评价显微镜图像的图像分辨率的图像评价方法。解决方案：图像评估方法的特征在于，在图像的整个区域或图像的一部分上获得图像的部分区域中的分辨率，并在图像的整个区域或图像的一部分上进行平均并且该平均值是图像的整个区域或图像的部分的分辨率评估值。通过这种结构，该方法消除了评估者在显微镜图像分辨率评估中的主观印象，从而可以获得高精度和良好重复性的图像分辨率评估值。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2003037139A Pattern inspecting method and apparatus 有权
标题翻译：图案检查方法和装置
公开(公告)号：JP2003037139A
公开(公告)日：2003-02-07
申请号：JP2001224017
申请日：2001-07-25
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YAMAGUCHI ATSUKO , TERASAWA TSUNEO , OTAKA TADASHI , IIIZUMI TAKASHI , KOMURO OSAMU
IPC分类号： G01B15/00 , G01N21/956 , G01N23/225 , G03F7/20 , G06T7/00 , H01L21/66
CPC分类号： G01N23/2251 , G01N21/95684 , G03F7/70616 , G06T7/0004 , G06T2207/30148 , H01J2237/2817
摘要： PROBLEM TO BE SOLVED: To provide a pattern edge shape inspecting method for quantitatively analyzing a line edge shape of a micro pattern for representing characteristics of materials, processes and an optical system in a semiconductor manufacturing process by using a nondestructive test, and finding defects in the manufacturing process and image distortion of an observing apparatus.
SOLUTION: The method for inspecting the pattern shape by using information of a two-dimensional distribution of secondary electron intensity or reflecting electron intensity (42) obtained by observing the pattern formed on a substrate by using a scanning microscope utilizing a charged particle beam (41), is provided with a process for detecting a set of edge points for indicating edge locations of the pattern in a two-dimensional plane by using a threshold method (45), a process for obtaining an approximate line related to the set of the edge points (48), and a process for finding the shape and property of edge roughness by calculating a difference between the set of the edge points and the approximate line (49). The threshold method uses a plurality of thresholds.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种图案边缘形状检查方法，用于通过使用非破坏性测试来定量分析用于表示材料，工艺和半导体制造过程中的光学系统的特征的微图案的线边缘形状，并且发现缺陷观察装置的制造过程和图像失真。解决方案：使用通过使用带电粒子束（41）的扫描显微镜观察形成在基板上的图案而获得的二次电子强度或反射电子强度（42）的二维分布的信息来检查图案形状的方法）具有用于通过使用阈值方法（45）来检测用于指示二维平面中的图案的边缘位置的一组边缘点的处理，用于获得与所述边缘的集合相关的近似线的处理点（48），以及通过计算边缘点集合和近似线条（49）之间的差异来求出边缘粗糙度的形状和性质的处理。阈值方法使用多个阈值。

10. 发明专利

JP2003173948A MANUFACTURING PROCESS MONITORING METHOD AND SYSTEM FOR THE SAME 审中-公开
公开(公告)号：JP2003173948A
公开(公告)日：2003-06-20
申请号：JP2002036131
申请日：2002-02-14
申请人： HITACHI LTD
发明人： TANAKA MAKI , SHISHIDO CHIE , TAKAGI YUJI , YOSHITAKE YASUHIRO , MATSUMOTO SHUNICHI , KOMURO OSAMU , IIIZUMI TAKASHI , MOROKUMA HIDETOSHI , WATANABE MASAHIRO
IPC分类号： G03F7/20 , H01L21/02 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To solve the problem that there is no method of detecting variations in conditions (deviation of exposure and focus) of an exposure system at a product wafer level in a lithography process. SOLUTION: The calculation results of features such as electron beam images, line profiles, and sizes for various exposures and focal value are previously stored as libraries, and the calculation result and the electron beam image of a product wafer is compared with each other, so that a variation in exposure and focus can be easily detected, and a comparison result can be easily verified on an image screen. COPYRIGHT: (C)2003,JPO

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