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1. 发明专利

JP2007263681A Pressure detection device and intake path of internal combustion engine 有权
标题翻译：内燃机的压力检测装置和进气道
公开(公告)号：JP2007263681A
公开(公告)日：2007-10-11
申请号：JP2006087974
申请日：2006-03-28
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： SAITO KAZUNORI , NISHIKAWA MUTSUO , KAMIYANAGI KATSUMICHI
IPC分类号： G01L23/24 , F02D35/00 , H01L29/84
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a surface pressurizing type pressure detection device and an intake path for an internal combustion engine which can be manufactured economically and with high precision and are resistant to the influence of charged gasoline.
SOLUTION: The pressure detection device is provided with, in a pressure introducing path which is connected in communication with the downstream side of a throttle valve of the intake path of the internal combustion engine, a floating gate of an EPROM formed on a semiconductor substrate positioned with respect to the pressure introducing path through an insulting film. A metallic shield electrode is provided within the insulating film on the floating gate.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于内燃机的表面加压型压力检测装置和进气通道，其可以经济地且高精度地制造并且抵抗带电汽油的影响。解决方案：压力检测装置在与内燃机的进气通道的节流阀的下游侧连通的压力引入路径中设置有形成在内燃机的进气路径的EPROM的浮动门半导体衬底通过绝缘膜相对于压力引入路径定位。金属屏蔽电极设置在浮动栅极上的绝缘膜内。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006308399A Pressure detecting device 有权
标题翻译：压力检测装置
公开(公告)号：JP2006308399A
公开(公告)日：2006-11-09
申请号：JP2005130533
申请日：2005-04-27
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： SAITO KAZUNORI , ICHIMURA YUJI , YAMAGUCHI HIROSHI , KAMIYANAGI KATSUMICHI , SHINODA SHIGERU
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/143 , G01L19/0084 , G01L19/146 , G01L19/147
摘要： PROBLEM TO BE SOLVED: To provide a pressure detecting device with sufficient thermal response by reducing influence on detection property by thermal stress as much as possible.
SOLUTION: The pressure detecting device 100 includes a pressure detecting element 110 for converting distortion generated under pressure to electrical signal to output, a device substrate section 120 including an element storing section 121 for storing the pressure detecting element 110, and a connecting section 129, that intervenes between these pressure detecting element 110 and the element storing section 121, connecting the both with tensile coefficient of extension of ≥ about 400%.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过尽可能减小热应力对检测性能的影响，提供具有足够热响应的压力检测装置。解决方案：压力检测装置100包括用于将压力下产生的失真转换为电信号输出的压力检测元件110，包括用于存储压力检测元件110的元件存储部分121的装置基板部分120和连接该部分129介于这些压力检测元件110和元件存储部分121之间，连接两者的拉伸伸长系数≥大约400％。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006266818A Pressure sensor device 有权
标题翻译：压力传感器装置
公开(公告)号：JP2006266818A
公开(公告)日：2006-10-05
申请号：JP2005084295
申请日：2005-03-23
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： KAMIYANAGI KATSUMICHI , SHINODA SHIGERU , ASHINO KIMIYASU , SAITO KAZUNORI
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability, and improve the precision and reliability of measuring signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 including a diaphragm 45, a piezoresistive element, an amplification circuit, and various regulating circuits is connected to a pedestal member 42 so that the diaphragm 45 faces a through hole 46 of the pedestal member 42. The pedestal member 42 and a metal pipe member 43 are connected so that their through holes 46, 48 communicate with each other. A protective film 60 is formed so that the connection part between the pedestal member 42 and the metal pipe member 43 is covered. The metal pipe member 43 is glued to a resin case 44, and then a signal terminal 58 of the resin case 44 and the pressure sensor chip 41 are electrically connected through wire bonding 59, thereby forming a pressure sensor cell 100. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低成本，提高长期可靠性，提高压力传感器设备中测量信号的精度和可靠性。解决方案：包括隔膜45，压阻元件，放大电路和各种调节电路的压力传感器芯片41连接到基座构件42，使得隔膜45面向基座构件42的通孔46。基座构件42和金属管构件43被连接成使得它们的通孔46,48相互连通。形成保护膜60，使得基座构件42与金属管构件43之间的连接部分被覆盖。将金属管构件43胶合到树脂壳体44，然后树脂壳体44的信号端子58和压力传感器芯片41通过引线接合59电连接，从而形成压力传感器单元100.版权（C）2007，JPO＆INPIT

4. 发明专利

JP2005098976A Pressure sensor unit 有权
标题翻译：压力传感器单元
公开(公告)号：JP2005098976A
公开(公告)日：2005-04-14
申请号：JP2004130368
申请日：2004-04-26
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： KAMIYANAGI KATSUMICHI , SHINODA SHIGERU , ASHINO KIMIYASU , SAITO KAZUNORI
IPC分类号： G01L19/14 , G01L9/00 , G01L9/04 , G01L19/00 , H01L29/84
CPC分类号： G01L19/0084 , G01L19/0038 , G01L19/143 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To reduce a cost, to enhance reliability over a long period, and to enhance the precision and reliability of a measuring signal, in a pressure sensor unit. SOLUTION: A pressure sensor chip 41 including therein a diaphragm 45, a piezoelectric resistance element, an amplification circuit and various kinds of regulation circuits is joined to a pedestal member 42 to face the diaphragm 45 to a through hole 46 of the pedestal member 42. The pedestal member 42 and a metal pipe member 43 are joined to communicate the through hole 46 with a through hole 48 thereof. A metal member 43 is bonded to a resin case 44, a signal terminal 58 of the resin case 44 is electrically connected to the pressure sensor chip 41 by a wireless bonding 59, so as to serve as a pressure sensor cell 100. An O-ring is attached to the metal pipe member 43, and the resin case 44 is pressed from its upper side to fix the pressure sensor cell 100 onto an oil seal block or the like. Alternatively, the pressure sensor cell 100 is fixed onto a member having a screw part by calking structure, and the screw part is screwed in a block or the like. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在压力传感器单元中，为了降低成本，提高长时间的可靠性，提高测量信号的精度和可靠性。解决方案：包括隔膜45，压电电阻元件，放大电路和各种调节电路的压力传感器芯片41接合到基座构件42，以将隔膜45面向基座的通孔46 基座构件42和金属管构件43接合以使通孔46与其通孔48连通。金属部件43与树脂外壳44接合，树脂外壳44的信号端子58通过无线接合59与压力传感器芯片41电连接，作为压力传感器单元100。环附接到金属管构件43，并且树脂壳体44从其上侧被按压以将压力传感器单元100固定在油封块等上。或者，压力传感器单元100通过铆接结构固定在具有螺纹部分的构件上，并且将螺钉部分拧入块等中。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2009294044A Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2009294044A
公开(公告)日：2009-12-17
申请号：JP2008147209
申请日：2008-06-04
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： SAITO KAZUNORI , NISHIKAWA MUTSUO
IPC分类号： G01L9/00 , H01L21/66 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor devices capable of effectively selecting or removing a semiconductor device having a pinhole in a gold film to the semiconductor device including a semiconductor pressure sensor area wherein a lower-layer electrode film is prevented from being corroded by forming the gold film on the top surface of a layered metal film having an aluminum or aluminum alloy electrode film at its lower layer.
SOLUTION: In the method for manufacturing the semiconductor devices has a process of forming a corrosion-resistant dielectric film 4 on the surface of a semiconductor substrate 100a excluding its pad part, and subsequently forming the gold film 6 on the aluminum electrode film 3 which is disposed on the surface of the pad part, through a metal film 5 for improving the degree of adhesion and preventing any mutual diffusion, in order to form the layered metal film, a process is prepared for immersing the semiconductor substrate 100a in an etching solution of aluminum after the process of forming the layered metal film.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体器件的制造方法，其能够有效地选择或去除具有金膜的针孔的半导体器件到半导体器件，该半导体器件包括半导体压力传感器区域，其中下层电极膜为通过在其下层具有铝或铝合金电极膜的层状金属膜的顶面上形成金膜而防止被腐蚀。解决方案：在半导体器件的制造方法中，具有在除了焊盘部分之外的半导体基板100a的表面上形成耐蚀电介质膜4的工序，随后在铝电极膜上形成金膜6 3，其通过金属膜5设置在焊盘部分的表面上，用于提高粘合度并防止任何相互扩散，为了形成层状金属膜，准备将半导体衬底100a浸入在形成层状金属膜的过程之后蚀刻铝的溶液。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2008122182A Pressure sensor apparatus and pressure sensor housing 有权
标题翻译：压力传感器装置和压力传感器外壳
公开(公告)号：JP2008122182A
公开(公告)日：2008-05-29
申请号：JP2006305261
申请日：2006-11-10
申请人： Fuji Electric Device Technology Co Ltd , Hitachi Ltd , 富士電機デバイステクノロジー株式会社 , 株式会社日立製作所
发明人： KAMINAGA TOSHIAKI , KUBO ATSUSHI , SAITO KAZUNORI , ASHINO KIMIYASU , KAMIYANAGI KATSUMICHI
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/0038 , G01L19/0627 , G01L19/141
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor apparatus and a pressure sensor housing capable of preventing the occurrence of frozen moisture, swelling of a gel-like coating member and damage to a pressure sensor element, without causing accumulation of moisture, oil, gasoline or the like on a protective wall even when the pressure sensor apparatus is disposed obliquely caused by the layout etc.
SOLUTION: A pressure sensor apparatus 100A or a pressure sensor housing 100B comprises a pressure detection chamber 102, into which a gas to be measured for pressuring is introduced; a pressure sensor element 201 for detecting the pressure of the gas; and a protective wall 108 for preventing infiltration of foreign matters into the pressure detection chamber 102. The protective wall 108 has an inclined surface 108a at an angle θ
8a , such that a second angle θ
2 sloping downward is retained in between the horizontal line HL and the inclined surface 108a, when the pressure sensor apparatus 100A is disposed obliquely by a first angle θ
1 , with respect to the horizontal line HL. Another inclined surface 102a is formed on the inner periphery wall of the pressure detection chamber 102, as necessary.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决方案：提供一种压力传感器装置和压力传感器壳体，其能够防止冻结湿气的发生，凝胶状涂层部件的膨胀和压力传感器元件的损坏而不会引起水分积聚，油，汽油等，即使当压力传感器装置由布置等倾斜地布置时。解决方案：压力传感器装置100A或压力传感器壳体100B包括压力检测室102，压力检测室引入要测量的用于加压的气体; 用于检测气体压力的压力传感器元件201; 以及用于防止异物渗透到压力检测室102中的保护壁108.保护壁108具有角度θ<8a>的倾斜表面108a，使得第二角度θ< 当压力传感器装置100A相对于水平线HL倾斜设置第一角度θ 1 时，向下倾斜的保持在水平线HL和倾斜面108a之间。根据需要，在压力检测室102的内周壁上形成另一倾斜面102a。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007086081A Semiconductor sensor device, semiconductor sensor storage container and its manufacturing method 审中-公开
标题翻译：半导体传感器器件，半导体传感器存储容器及其制造方法
公开(公告)号：JP2007086081A
公开(公告)日：2007-04-05
申请号：JP2006284853
申请日：2006-10-19
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： SAITO KAZUNORI , ASHINO KIMIYASU , KAMIYANAGI KATSUMICHI
IPC分类号： G01L9/00 , H01L23/04 , H01L23/057 , H01L23/08 , H01L23/10 , H01L23/24 , H01L23/28 , H01L23/29 , H01L23/31 , H01L29/84
CPC分类号： G01L19/142 , G01L19/147 , H01L23/057 , H01L23/10 , H01L23/24 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor sensor storage container which can eliminate the clearance between the container body and the lead terminal and which prevents the occurrence of pressure leakage.
SOLUTION: In the semiconductor sensor storage container, both the clearance between the container body 31 and the lead terminal 35 and connecting section between the lead terminal 35 and bonding wire 36 are filled with a filler section 46 comprising polyimide resin applied to be cured.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体传感器存储容器，其可以消除容器主体和引线端子之间的间隙，并且防止压力泄漏的发生。解决方案：在半导体传感器存储容器中，容器主体31和引线端子35之间的间隙以及引线端子35和接合线36之间的连接部分填充有包含聚酰亚胺树脂的填充部分46，治愈。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2004361308A Physical quantity detector, and storage case for physical quantity detecting means 审中-公开
标题翻译：物理量检测器和物理量检测机构存储箱
公开(公告)号：JP2004361308A
公开(公告)日：2004-12-24
申请号：JP2003161853
申请日：2003-06-06
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： SAITO KAZUNORI , ASHINO KIMIYASU , KAMIYANAGI KATSUMICHI , SHINODA SHIGERU
IPC分类号： G01L9/00 , G01D11/24 , H01L23/16 , H01L29/84
CPC分类号： G01D11/245 , H01L23/16 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce an influence of an external stress and a stress caused by deformation of a case, in a physical quantity detector provided with a physical quantity detecting means for converting a physical quantity into an electric signal to generate an output.
SOLUTION: A recessed shape of a case 2 for storing a sensor element 1 is provided to form a clearance part 32 in a portion opposed to an angle part 14 of the sensor element 1, to form a positioning part 31 in the vicinity of the clearance part 32, and to form a recessed part 33 lower than a recessed bottom in a bottom of the clearance part 32.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了减少外部应力和由壳体变形引起的应力的影响，在具有用于将物理量转换为电信号的物理量检测装置的物理量检测器中产生输出。解决方案：设置用于存储传感器元件1的壳体2的凹陷形状，以在与传感器元件1的角部14相对的部分中形成间隙部32，以在附近形成定位部31 并且形成比间隙部32的底部中的凹陷底部低的凹部33。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2008139298A Temperature-sensor-integrated pressure sensor 审中-公开
标题翻译：温度传感器一体式压力传感器
公开(公告)号：JP2008139298A
公开(公告)日：2008-06-19
申请号：JP2007291778
申请日：2007-11-09
申请人： Fuji Electric Device Technology Co Ltd , Hitachi Ltd , 富士電機デバイステクノロジー株式会社 , 株式会社日立製作所
发明人： KAMINAGA TOSHIAKI , KUBO ATSUSHI , SAITO KAZUNORI , ASHINO KIMIYASU , KAMIYANAGI KATSUMICHI
IPC分类号： G01K1/14 , G01D21/02 , G01K13/02 , G01L19/00
CPC分类号： G01K13/02 , G01K1/14 , G01K1/18 , G01K2205/02 , G01L19/0092 , G01L23/24
摘要： PROBLEM TO BE SOLVED: To make it possible to obtain a desired response speed of a temperature sensor without depending on the tilt angle at which a temperature-sensor-integrated pressure sensor is tilted when installed.
SOLUTION: When a temperature-sensor-integrated pressure sensor including a temperature sensor element and a pressure sensor element is installed on a target object at a tilt angle of θ
rg to an ideal installation location where the central axis of the main body of the temperature sensor element is orthogonal to the direction in which gas passes through a measuring object, the tilt angle θ
pos at which the main body of the element is tilted to the original central axis of the main body of the element in this sensor is set in accordance with the following formula: (θ
rq -θ
allow )≤θ
pos ≤(θ
rq +θ
allow ), where θ
allow is a permissible angle from the gas passing direction orthogonal to the central axis of the main body of the element at which a permissible response speed of the temperature sensor element can be obtained.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了使得可以在不依赖于安装温度传感器集成压力传感器倾斜的倾斜角度的情况下获得温度传感器的期望响应速度。解决方案：将包括温度传感器元件和压力传感器元件的温度传感器集成的压力传感器以θ rg 的倾斜角度安装在目标物体上，到理想的安装位置，温度传感器元件的主体的中心轴线与气体通过测量对象的方向正交，元件的主体倾斜到的倾斜角θ 该传感器中的元件的主体的原始中心轴根据以下公式设定：（θ rq -θ允许）≤θ< / SB>≤（θ rq +θ允许），其中θ允许是从与中心轴正交的气体通过方向的允许角度可以获得温度传感器元件的允许响应速度的元件的主体。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2009145063A Method and apparatus for adjusting property of semiconductor pressure sensor 有权
标题翻译：用于调整半导体压力传感器性能的方法和装置
公开(公告)号：JP2009145063A
公开(公告)日：2009-07-02
申请号：JP2007319624
申请日：2007-12-11
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： KURIMATA SHOJIRO , SAITO KAZUNORI , SHINODA SHIGERU
IPC分类号： G01L27/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for adjusting properties of a semiconductor pressure sensor, the method and apparatus for properly adjusting the properties by reducing the effect of the physical stress on a gauge sensor when adjusting the properties of the semiconductor pressure sensor for use in measuring relative or absolute pressure. SOLUTION: In the method for adjusting properties of a semiconductor pressure sensor, a fixture 26a includes a recess for storing a resin case part of an assembled resin cell 10 with a lead terminal integrally assembled. While the resin case part is placed in the recess, a probe 25a for inputting and outputting electrical signals is brought into contact with the lead terminal 7. A movable fixture 22 includes a seal material 23 for sealing a space between one main surface and the other surface of the sensor chip, and a pressure control hole for applying any pressure. A pressure reference chamber is formed by joining the movable fixture 22 to the fixture 26a and introducing required pressure through the pressure control hole, and thereby the properties are adjusted. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于调节半导体压力传感器的性质的方法和装置，该方法和装置通过在调节特性时减小测量传感器上的物理应力的影响来适当地调节特性用于测量相对压力或绝对压力的半导体压力传感器。解决方案：在用于调整半导体压力传感器的性质的方法中，固定件26a包括用于存储组装的树脂电池10的树脂壳体部分的凹部，引线端子整体地组装。当树脂壳体部分放置在凹槽中时，用于输入和输出电信号的探针25a与引线端子7接触。可移动夹具22包括用于密封一个主表面和另一个主表面之间的空间的密封材料23 传感器芯片的表面和用于施加任何压力的压力控制孔。通过将可移动夹具22连接到夹具26a并通过压力控制孔引入所需的压力而形成压力参考室，从而调整其性能。版权所有（C）2009，JPO＆INPIT

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