专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH05136551A SOLDER-COATED PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH05136551A
公开(公告)日：1993-06-01
申请号：JP31974191
申请日：1991-11-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , FUSE KENICHI , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , AZUMAGUCHI YUTAKA
IPC分类号： H05K3/34 , H05K1/11 , H05K3/40
摘要： PURPOSE:To prevent the leads of components from slipping down between metal conductor pads when the leads of the components are placed on solders and to stabilize the positions of the components by a method wherein a multitude of holes are formed in the metal conductor pads for component mounting use and the solders are respectively applied on the parts other than the holes of the pads. CONSTITUTION:A multitude of square holes 19 are formed in copper foil pads 13 on an insulating substrate 11 in a mesh form to form the pads 13 in a lattice type and solders 15 are respectively applied on the surfaces of the pads. When these soldered materials are used, the solders 15 are precipitated only on conductor parts of the pads 13 and are not precipitated on the parts of the holes 19. Therefore, the solders 15 are also formed in a lattice and bumps of the solders 15 become almost equal on the whole surfaces of the pads. Accordingly, face connecting the tops of the bumps of the solders 15 become almost flat and even if leads of components are placed on the solders, such a matter as the leads slip down between the pads is eliminated. As a result, the positions of the components are stabilized and an accurate soldering can be conducted.

2. 发明专利

JPH04280655A HIGH DENSITY HYBRID CIRCUIT BOARD 失效
公开(公告)号：JPH04280655A
公开(公告)日：1992-10-06
申请号：JP6777091
申请日：1991-03-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , FUSE KENICHI , SHIROISHI HIROKAZU , HIKASA KAZUTO , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , TOTANI MAKOTO , OTAGURO HIROYUKI
IPC分类号： H01L23/12 , H01L25/00 , H05K1/03 , H05K3/34 , H05K3/40
摘要： PURPOSE:To prevent a gold plated pad from being contaminated by solder by a method wherein the gold plated pad and a solder pad are formed directly on a ceramic board or through the intermediary of a polyimide insulating layer, the polyimide insulating layer protruding higher than the surface of the pad is provided, and a solder layer is provided onto the solder pad. CONSTITUTION:A wire bonding gold plated pad 12 and a solder connection solder pad 14 are formed directly on a ceramic board 11 or through the intermediary of a polyimide insulating layer. A polyimide insulating layer 16a protrudent higher than the surface of the pads concerned is provided between the gold plated pad 12 and the solder pad 14 provided adjacent to each other, and a solder layer 18 precipitation out of a solder precipitation composition which contains organic acid lead and tin powder is provided onto the solder pad 14. Furthermore, the solder pad 14 is surrounded with the polyimide insulating layer 16a, and the surface of the solder layer 18 precipitated on the solder pad 14 is lower than that of the polyimide insulating layer 16a in level.

3. 发明专利

JPH07336032A MANUFACTURE OF CIRCUIT BOARD WITH PRECOATING SOLDER LAYER 失效
公开(公告)号：JPH07336032A
公开(公告)日：1995-12-22
申请号：JP14878094
申请日：1994-06-08
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC , FUJITSU LTD
发明人： HIKASA KAZUTO , FUKUNAGA TAKAO , SHIROISHI HIROKAZU , KUMAMOTO SATOSHI , FUJIWARA TAKAHIRO , KATAYAMA NORIKO , INAGAKI MITSUO , TOTANI MAKOTO
IPC分类号： B23K35/363 , H05K1/11 , H05K3/24 , H05K3/34
摘要： PURPOSE:To form solder layers each having uniform thickness on pads by forming the same lengths (areas) of the pads to be exposed after solder resist is printed even if printing of the resist is slightly deviated. CONSTITUTION:When solder resist 4 is printed on a region except the pad arraying region of a circuit board 1, the region not printed with the resist is coated with pastelike solder precipitated composition, and then heated to form solder layers on the respective pads, the lengths of the pads 2a-2d in the same pad arraying region are formed longer than the length to be formed with the solder layer, and solder resist is so printed as to cover both the ends of the pads 2a-2d with the resist 4.

4. 发明专利

JPH06132640A SOLDER CONNECTING METHOD FOR FINE PITCH PADS TO COMPONENT LEADS 失效
公开(公告)号：JPH06132640A
公开(公告)日：1994-05-13
申请号：JP30160992
申请日：1992-10-15
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC , FUJITSU LTD
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , FUSE KENICHI , FUJIWARA TAKAHIRO , KATAYAMA NORIKO , KONO MASANAO , TOTANI MAKOTO , OGATA KINUKO , KASHIWABARA HIROTAKA
IPC分类号： H05K3/34
摘要： PURPOSE:To improve an external appearance and to improve connecting reliability by using lead-rich precoating solder as to obtain a desired solder alloy composition resulting from fusion with tin and tin alloy plated on component leads. CONSTITUTION:In order to form solder for finally connecting component leads to pads to alloy composition (normally eutectic alloy) as a target, it is effective to use lead-rich precoating solder on the pad. The lead content in the solder is decided by considering sizes of component leads 1 and pads 2 and plated thickness of the leads. Thus, a quantity of a plating material of the lead and a quantity of the precoating solder are obtained. The composition of the precoating solder is so decided that the final connecting solder becomes a desired composition. When a substitution of organic acid lead salt with tine is utilized. even if the composition of the precoating solder is made constant, the composition of the final connecting solder can be controlled.

5. 发明专利

JP2002303381A UNDERGROUND BURIED CONDUIT 审中-公开
公开(公告)号：JP2002303381A
公开(公告)日：2002-10-18
申请号：JP2002002225
申请日：2002-01-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , SADAMITSU KAZUO , KISHI NORIO , ONO KISABURO , UENO TAKAHIRO
IPC分类号： E02B9/06 , E02F5/10 , F16L1/024 , F16L1/038 , F16L3/10 , F16L3/22 , F16L3/223 , H02G1/06 , H02G9/06
摘要： PROBLEM TO BE SOLVED: To provide an underground buried conduit, in which work for burying a pipe under the ground is easily performed, and the pipe is not susceptible to damage. SOLUTION: A groove 21 is formed on an upper face of a lower side block 11. End faces of a lot of lower side blocks 11 are brought into abutment with each other so that each of the groove 21 is continuously disposed. A long pipe 45 stretches over a lot of lower sides blocks so that a lower semicircle portion of the pipe is laid in the grooves 21. On the lower side blocks, end faces of a lot of upper side blocks 13, of which lower faces have grooves 25, are brought into abutment with each other so that the grooves 25 cover an upper semicircular portion of the pipe 15. Recesses 49 for housing a sleeve 47 connecting the pipe 45 are disposed to the grooves 21, 25 of the lower side blocks 11 and upper side blocks 13.

6. 发明专利

JPH09105479A UNDERGROUND BURIED PIPE LINE 失效
公开(公告)号：JPH09105479A
公开(公告)日：1997-04-22
申请号：JP20498896
申请日：1996-08-02
申请人： FURUKAWA ELECTRIC CO LTD
发明人： FUKUNAGA TAKAO , SADAMITSU KAZUO , KISHI NORIO , ONO KISABURO , UENO TAKAHIRO
IPC分类号： F16L3/22 , F16L1/024 , F16L3/00 , F16L3/223
摘要： PROBLEM TO BE SOLVED: To a provide an underground buried pipe line capable of burying a number of pipes in a compact manner in a ground, simplifying a burying work, and besides hardly damaging the pipes. SOLUTION: A number of lower blocks 11 having a plurality of parallel grooved 21 formed in an upper surface are arranged in such a manner that end faces are brought into abutment against each other so as to continue grooves. A long pipe 15 positioned astride a number of the lower blocks 11 is laid in such a manner that the lower half peripheral part thereof is contained in the groove 21. A number of upper blocks 13 having a plurality of grooves 25 paralleling each other formed in an under surface are arranged in such a state that end faces are brought into abutment against each other with the upper half peripheral part of the pipe 15 covered with the grooves 25.

7. 发明专利

JPH0936531A MOUNTING OF LEAD COMPONENT 失效
公开(公告)号：JPH0936531A
公开(公告)日：1997-02-07
申请号：JP17909995
申请日：1995-07-14
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , FUKUNAGA TAKAO , IRIE HISAO , TANAKA HIROSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To eliminate a defective bonding of lead components and to make it possible to mount efficiently the lead components on a circuit board by a method wherein a reflow heating treatment is performed on the board in a state that solders have a surface tension smaller than that of the solders at the time of the formation of solder precoatings to mount the lead components on the conductive parts on the board. SOLUTION: Solder precoatings are respectively formed on conductive parts 12 on a board in a state that solders have a prescribed surface tension. At this time, by setting greatly in comparison the surface tension of the solders 13 at the time of the formation of the solder precoatings, the fluidity of the solders 13 can be reduced. Then, a flux having a temporary fixture is fed on the solder precoatings and lead components 11 are respectively mounted on the solder precoatings. After that, a reflow heating treatment is performed on this board to mount the lead components 11 on the parts 12. At this time, the surface tension of the solders at the time of the reflow heating treatment is set smaller than that of the solders at the time of the formation of the solder precoatings, whereby the fluidity of the solders can be improved.

8. 发明专利

JPH06152121A METHOD FOR COATING PRINTED BOARD WITH SOLDER 失效
公开(公告)号：JPH06152121A
公开(公告)日：1994-05-31
申请号：JP32129392
申请日：1992-11-04
申请人： HARIMA CHEMICALS INC , FURUKAWA ELECTRIC CO LTD
发明人： KUMAMOTO SATOSHI , IRIE HISAO , FUJIWARA TAKAHIRO , FUSE KENICHI , FUKUNAGA TAKAO , HIKASA KAZUTO
IPC分类号： H05K3/24 , H05K3/28 , H05K3/34
摘要： PURPOSE:To apply precoating of solder to a printed board without generating bridges by applying a solder paste all over the pads arranged at fine pitch to form a slodering layer. CONSTITUTION:In a printed board l having a fine-pitch section 4 with a pad- arranging pitch of

9. 发明专利

JPH0564235B2 失效
公开(公告)号：JPH0564235B2
公开(公告)日：1993-09-14
申请号：JP17761086
申请日：1986-07-30
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO
IPC分类号： C23C18/06 , C23C18/08 , C23C18/42 , H05K3/24

10. 发明专利

JPH04297091A SOLDER COATING PRINTED CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04297091A
公开(公告)日：1992-10-21
申请号：JP8438391
申请日：1991-03-26
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： KOSUGE IZUMI , FUSE KENICHI , FUKUNAGA TAKAO , KONO MASANAO , IRIE HISAO
IPC分类号： H05K3/24 , H05K3/34
摘要： PURPOSE:To effectively form a solder layer having a thickness necessary to solder a component in a uniform thickness by forming the solder layer on a pad of a printed circuit board by substitution reaction of organic acid salt of metal having small ionization tendency of solder allay component with powder of metal having large ionization tendency. CONSTITUTION:When a solder layer 3 having a thickness necessary to solder leads of a component is formed on a pad 2 formed on an insulating board 1 by pattern etching of a copper foil, etc., the layer 3 is precipitated by substitution reaction of metal having small ionization tendency of solder alloy component such as organic acid salt of lead with metal having large ionization tendency such as powder of tin. In this case, a protruding height H from the surface of the board 1 of the pad 2 and a width W have a relationship of 2H

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式