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1. 发明专利

JPH05136551A SOLDER-COATED PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH05136551A
公开(公告)日：1993-06-01
申请号：JP31974191
申请日：1991-11-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , FUSE KENICHI , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , AZUMAGUCHI YUTAKA
IPC分类号： H05K3/34 , H05K1/11 , H05K3/40
摘要： PURPOSE:To prevent the leads of components from slipping down between metal conductor pads when the leads of the components are placed on solders and to stabilize the positions of the components by a method wherein a multitude of holes are formed in the metal conductor pads for component mounting use and the solders are respectively applied on the parts other than the holes of the pads. CONSTITUTION:A multitude of square holes 19 are formed in copper foil pads 13 on an insulating substrate 11 in a mesh form to form the pads 13 in a lattice type and solders 15 are respectively applied on the surfaces of the pads. When these soldered materials are used, the solders 15 are precipitated only on conductor parts of the pads 13 and are not precipitated on the parts of the holes 19. Therefore, the solders 15 are also formed in a lattice and bumps of the solders 15 become almost equal on the whole surfaces of the pads. Accordingly, face connecting the tops of the bumps of the solders 15 become almost flat and even if leads of components are placed on the solders, such a matter as the leads slip down between the pads is eliminated. As a result, the positions of the components are stabilized and an accurate soldering can be conducted.

2. 发明专利

JPH04280655A HIGH DENSITY HYBRID CIRCUIT BOARD 失效
公开(公告)号：JPH04280655A
公开(公告)日：1992-10-06
申请号：JP6777091
申请日：1991-03-08
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： FUKUNAGA TAKAO , FUSE KENICHI , SHIROISHI HIROKAZU , HIKASA KAZUTO , KASHIWABARA HIROTAKA , OCHIAI RYOICHI , TOTANI MAKOTO , OTAGURO HIROYUKI
IPC分类号： H01L23/12 , H01L25/00 , H05K1/03 , H05K3/34 , H05K3/40
摘要： PURPOSE:To prevent a gold plated pad from being contaminated by solder by a method wherein the gold plated pad and a solder pad are formed directly on a ceramic board or through the intermediary of a polyimide insulating layer, the polyimide insulating layer protruding higher than the surface of the pad is provided, and a solder layer is provided onto the solder pad. CONSTITUTION:A wire bonding gold plated pad 12 and a solder connection solder pad 14 are formed directly on a ceramic board 11 or through the intermediary of a polyimide insulating layer. A polyimide insulating layer 16a protrudent higher than the surface of the pads concerned is provided between the gold plated pad 12 and the solder pad 14 provided adjacent to each other, and a solder layer 18 precipitation out of a solder precipitation composition which contains organic acid lead and tin powder is provided onto the solder pad 14. Furthermore, the solder pad 14 is surrounded with the polyimide insulating layer 16a, and the surface of the solder layer 18 precipitated on the solder pad 14 is lower than that of the polyimide insulating layer 16a in level.

3. 发明专利

JPH0921931A OPTICAL MODULE CONNECTOR 失效
公开(公告)号：JPH0921931A
公开(公告)日：1997-01-21
申请号：JP16983295
申请日：1995-07-05
申请人： FUJITSU LTD
发明人： OCHIAI RYOICHI , MIURA KAZUNORI , SASAKI MASAMI , NAKAGAWA KOJI
IPC分类号： G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To reduce a manufacturing cost by making automatic soldering possible and to make handling on production site easy and to improve the packaging efficiency of a printed circuit board by shortening the length of optical fiber with an optical module connector for connecting an optical module for carrying out photoelectric conversion to an optical fiber. SOLUTION: A connecting means 5 consists of a second ferrule 5a, a C type sleeve 5b, etc., and a first ferrule 2 of a photoelectric conversion means is fitted into the C type sleeve 5b and comes into contact with the second ferrule 5a of the connecting means 5. Light transmittance is eventually executed between the second optical fiber 4 and the first optical fiber 1. The soldering of the photoelectric conversion means 3 to the printed circuit board is carried out before the connecting means 5 is connected to the photoelectric conversion means 3. Namely, the second optical fiber 4 having low heat resistance is not packaged yet in the case of soldering and, therefore, the soldering may be executed in an automatic soldering stage.

4. 发明专利

JPS63257279A PHOTOELECTRIC CONVERSION DEVICE 失效
公开(公告)号：JPS63257279A
公开(公告)日：1988-10-25
申请号：JP9140287
申请日：1987-04-14
申请人： FUJITSU LTD
发明人： OCHIAI RYOICHI , FUKUOKA AKIRA
IPC分类号： H01L23/34 , H01L31/02 , H01L31/0232
摘要： PURPOSE:To make a small-sized and low-cost photoelectric conversion device by a method wherein an opto-semiconductor element photo-coupled to an optical fiber is mounted inside a housing equipped with a cooling fin and this housing and a semiconductor component are arranged to be face to face with each other on both faces of a ceramic substrate. CONSTITUTION:A housing 15 which is equipped with a cooling fin 30 and is composed of a material having the coefficient of high heat-transfer and a semiconductor component 2 are mounted to be face to face with each other on both faces of a ceramic substrate 1 with good thermal conductivity; an opto- semiconductor element 11 is mounted inside the housing 15; the opto- semiconductor element 11 is connected electrically to the semiconductor component 2 via a circuit inside the ceramic substrate 1. In addition, an opto-connector 20 is attached to the housing 15; an optical fiber 21 is photo-coupled to the opto-semiconductor element 11. Accordingly, a signal circuit composed of the semiconductor component 2, the opto-semiconductor element 11 and the optical fiber 21 is constituted; the heat generated by the semiconductor component 2 is conducted through the ceramic substrate 1, the housing 15 and the cooling fin 30 and is radiated.

5. 发明专利

JPS63156398A PRINTED WIRING BOARD UNIT STRUCTURE 失效
公开(公告)号：JPS63156398A
公开(公告)日：1988-06-29
申请号：JP30460686
申请日：1986-12-19
申请人： FUJITSU LTD
发明人： OCHIAI RYOICHI
IPC分类号： H05K9/00 , H05K7/14

6. 发明专利

JPS634694A MULTILAYER PRINTED BOARD 失效
公开(公告)号：JPS634694A
公开(公告)日：1988-01-09
申请号：JP14927086
申请日：1986-06-24
申请人： FUJITSU LTD
发明人： NOKIMURA HITOSHI , OCHIAI RYOICHI , ONISHI HIROSHI
IPC分类号： H05K3/46

7. 发明专利

JPS6221252A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6221252A
公开(公告)日：1987-01-29
申请号：JP15988085
申请日：1985-07-19
申请人： FUJITSU LTD
发明人： ONISHI HIROSHI , OCHIAI RYOICHI , NOKIMURA HITOSHI
IPC分类号： H01L23/50 , H05K3/34
摘要： PURPOSE:To realize a semiconductor device which is excellent in mechanical strength and easy to handle, by integrally fixing a plurality of lead pins extending outwardly from the substrate portion. CONSTITUTION:A flat pack LSI 110 is brought to the setting position on a circuit substrate 117, and a heating chip 119 is moved along lead pins 113 while pressing the pins 113 with a heating chip 121, removing an excess of solder. Then, again spare solder 115 is heated by the heating chip and thermocompression bonding is performed in a normal manner, whereby the flat pack LSI 110 is soldered to the circuit substrate 117 with an appropriate amount of solder. With this, a semiconductor device is realized which is excellent in mechanical strength and easy to handle.

8. 发明专利

JPS61102797A Printing for solder pad 失效
标题翻译：打印焊膏
公开(公告)号：JPS61102797A
公开(公告)日：1986-05-21
申请号：JP22612884
申请日：1984-10-26
申请人： Fujitsu Ltd
发明人： OCHIAI RYOICHI , ONISHI HIROSHI
IPC分类号： H05K3/34 , H05K3/12

9. 发明专利

JP2002208657A SEMICONDUCTOR DEVICE AND BOARD FOR MOUNTING THE SAME 审中-公开
公开(公告)号：JP2002208657A
公开(公告)日：2002-07-26
申请号：JP2001363019
申请日：2001-11-28
申请人： FUJITSU LTD
发明人： AZUMAGUCHI YUTAKA , INAGAKI MITSUO , KUMAI TOSHIO , OCHIAI RYOICHI , TEJIMA YASUHIRO , SHINJO MAMORU , KOBAYASHI YASUSHI , TAMURA HIDEAKI , IIMURA HIROSHI , CHIBA KIYOSHI , SEKIYA YUKIO , IGARASHI SHUZO , ICHIHARA YASUHIRO
IPC分类号： H05K1/18 , H01L23/12 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To enhance reliability of an electric connecting part (solder connecting part) after mounting in a semiconductor device having an electronic component, such as a semiconductor chip or the like supported by a circuit board. SOLUTION: The semiconductor device comprises a package 60, a bump 62 supported onto a prescribed surface of the package 60, a semiconductor chip supported to the package 60, and a plurality of tabs 64 supported on the prescribed surface of the package 60 and higher than the height of the bump 62. In this case, the distance between the prescribed surface of the package 60 and the circuit board is held at a prescribed length by the tabs 62, in a state of being mounted on the board.

10. 发明专利

JPH0926529A OPTICAL MODULE 失效
公开(公告)号：JPH0926529A
公开(公告)日：1997-01-28
申请号：JP17380395
申请日：1995-07-10
申请人： FUJITSU LTD
发明人： MIURA KAZUNORI , SASAKI MASAMI , OCHIAI RYOICHI , SUMIYOSHI HIDEO , NAKAGAWA KOJI
IPC分类号： G02B6/38 , G02B6/42 , H04B10/00 , H04B10/25 , H04B10/12 , H04B10/13 , H04B10/135 , H04B10/14
摘要： PROBLEM TO BE SOLVED: To facilitate production and to obtain constitution having high reliabil ity by providing a packaging substrate with a groove extending in an optical axis direction and providing this groove with a perpendicular wall intersecting orthogonally with the optical axis direction and facing the end of an optical fiber. SOLUTION: An insulating film 20 of SiO2 is formed over the entire surface on the packaging substrate 21 consisting of silicon, etc. The V-groove 31 housing the optical fiber 30 is formed nearly at the center in the central part (optical axis direction) of the longitudinal direction of the packaging substrate 21. A solder layer 23 is formed near the short side direction (the direction orthogonal with the optical axis direction) of the V-groove 31. Further, an electrode 22 extends from this solder layer 23. A marker 24 for positioning a laser diode 28 is formed near the Vgroove 31. Further, the inside of the V-groove 31 is provided with the perpendicular wall 29a near the end in the short side direction of the V-groove 31. This perpendicular wall 29a functions as a positioning stopper in the optical axis direction of the optical fiber 30.

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