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1. 发明专利

JPH06132640A SOLDER CONNECTING METHOD FOR FINE PITCH PADS TO COMPONENT LEADS 失效
公开(公告)号：JPH06132640A
公开(公告)日：1994-05-13
申请号：JP30160992
申请日：1992-10-15
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC , FUJITSU LTD
发明人： FUKUNAGA TAKAO , SHIROISHI HIROKAZU , FUSE KENICHI , FUJIWARA TAKAHIRO , KATAYAMA NORIKO , KONO MASANAO , TOTANI MAKOTO , OGATA KINUKO , KASHIWABARA HIROTAKA
IPC分类号： H05K3/34
摘要： PURPOSE:To improve an external appearance and to improve connecting reliability by using lead-rich precoating solder as to obtain a desired solder alloy composition resulting from fusion with tin and tin alloy plated on component leads. CONSTITUTION:In order to form solder for finally connecting component leads to pads to alloy composition (normally eutectic alloy) as a target, it is effective to use lead-rich precoating solder on the pad. The lead content in the solder is decided by considering sizes of component leads 1 and pads 2 and plated thickness of the leads. Thus, a quantity of a plating material of the lead and a quantity of the precoating solder are obtained. The composition of the precoating solder is so decided that the final connecting solder becomes a desired composition. When a substitution of organic acid lead salt with tine is utilized. even if the composition of the precoating solder is made constant, the composition of the final connecting solder can be controlled.

2. 发明专利

JPH04208588A FLEXIBLE PRINTED BOARD MODULE AND THREE-DIMENSIONAL CIRCUIT MODULE USING THE SAME 失效
公开(公告)号：JPH04208588A
公开(公告)日：1992-07-30
申请号：JP34105790
申请日：1990-11-30
申请人： FUJITSU LTD , FURUKAWA ELECTRIC CO LTD
发明人： AZUMAGUCHI YUTAKA , HOSOGAI MASAO , OGATA KINUKO , FUSE KENICHI , SHIROISHI HIROKAZU , AMANO TOSHIAKI
IPC分类号： H01R13/639 , H05K1/00 , H05K1/02 , H05K9/00
摘要： PURPOSE:To mount printed boards in high density by engaging recesses formed in a mold integrally formed with a flexible printed board for placing components with protrusions to be secured. CONSTITUTION:Molding materials 21A-21E of injection molding are simultaneously formed integrally on the rear surface of a flexible printed board 22, circuit components are placed on the board 22, and folded at connecting seams of the materials 21A-21E. Protrusions 23 and recesses 24 are provided on the materials 21A-21E provided on the board 22, and the protrusions 23 are engaged with the recesses 24. Thus, the folding fixture of the board 22 can be facilitated by fixedly connecting by the engagements of the protrusions 23 with the recesses 24. Thus, components of twice or more as compared with conventional module can be mounted in high density, and a profile shape can be reduced to 1/2 or less.

3. 发明专利

JPH0669369A MOUNTING METHOD FOR LEADLESS PACKAGE 失效
公开(公告)号：JPH0669369A
公开(公告)日：1994-03-11
申请号：JP22100792
申请日：1992-08-20
申请人： FUJITSU LTD
发明人： OGATA KINUKO , TANIZAWA HIDENORI
IPC分类号： H01L23/12 , H05K3/34
摘要： PURPOSE:To raise the reliability on junction and besides, remove the fear of a solder bridge occurring, concerning the mounting method for a leadless pack age. CONSTITUTION:An inner solder bump 23 is provided on the inner pad 21 of a board 20, and also an outer solder bump 24, whose apex is right below the center of an outer land 16 and whose height is lower by a desired amount than the apex of the inner solder bump 23, is provided on the outer pad 22 of the board 20, and a leadless package 10 is pressed against the board 20 and is heated, whereby it is soldered.

4. 发明专利

JPH05217603A HIGHPOLYMER BATTERY AND ITS PACKAGE STRUCTURE 失效
公开(公告)号：JPH05217603A
公开(公告)日：1993-08-27
申请号：JP2219792
申请日：1992-02-07
申请人： FUJITSU LTD
发明人： OGATA KINUKO , UEHARA EIKO , AZUMAGUCHI YUTAKA , TANIZAWA HIDENORI , INAGAKI MITSUO
IPC分类号： H01M4/64 , H01M2/02 , H01M10/04 , H01M10/05 , H01M10/058 , H01M10/48
摘要： PURPOSE:To check the remaining capacity of a highpolymer battery with no use of any particular measuring instrument by ocularly inspecting color change on the surface of a positive electrode where the highpolymer battery body is formed while a certain part of a case to accommodate the highpolymer body is constructed from a clear material. CONSTITUTION:A highpolymer battery body consisting in a laminate of positive electrode 1, separator 3, and negative electrode 2 is accommodated in a case 15, wherein the part of case 15 in tight contact with the positive electrode 1 through a positive electrode lead 11 is constructed from a clear material. This enables ocularly discerning color change on the surface of the positive electrode 1 without requiring use of any particular measuring instrument to allow checking the remaining capacity of the battery.

5. 发明专利

JPH06102374A WRIST WATCH TYPE APPARATUS 失效
公开(公告)号：JPH06102374A
公开(公告)日：1994-04-15
申请号：JP24845792
申请日：1992-09-18
申请人： FUJITSU LTD
发明人： UEHARA EIKO , AZUMAGUCHI YUTAKA , OGATA KINUKO , HOSOGAI MASAO
IPC分类号： G04G17/06 , H01M2/10 , H05K1/00 , H05K1/14 , H05K3/32 , G04G1/00
摘要： PURPOSE:To miniaturize an apparatus main body and couple it with an arm for use by connecting the wrist watch type main body section having a display section and small modules having desired functions via a flexible power distribution panel concurrently serving as an arm band. CONSTITUTION:A switching switch and an adjusting/correcting button 2 are fitted at the edge of a wrist watch type main body 1 stored with a display section such as an LCD, an LCD driving circuit, and an external interface on a main body package 40, and the main body 1 and a flexible power distribution panel 5 are connected. The power distribution panel 5 is stuck with a fine-width copper foil on the surface of a belt-like base film 51 to form a conductor pattern 52, it is covered with a cover film 53, and high-tension fibers are sealed to provide the function as a band. An IC 20 having the functions of an electronic note and a transcriber or a battery is stored in the package 11 to form multiple small modules 10, they are connected to the power distribution panel 5 via a via hole 13 penetrating a bottom section, and the end section of the power distribution plate 5 is fixed to the main body package 40.

6. 发明专利

JPH03234084A CIRCUIT BOARD 失效
公开(公告)号：JPH03234084A
公开(公告)日：1991-10-18
申请号：JP3104090
申请日：1990-02-09
申请人： FUJITSU LTD
发明人： GOTO SHIGERU , OGATA KINUKO
IPC分类号： H05K3/40 , H05K3/10
摘要： PURPOSE:To improve the wiring efficiency of a wiring pattern by forming wiring patterns including component lands for mounting surface mounting components on the front and rear surface of a conductive polymer board by doping or laser light ray emitting, and conductive spots for conductively connecting the patterns on the front and rear surfaces through the board in the lands. CONSTITUTION:A circuit board 1 is formed with wiring patterns 1a-1, 1a-4 including component lands 1a-2 for mounting surface mounting components 2 indicated by two-dotted chain lines on the front and rear surfaces of a conductive polymer board 1a made of polypyrrole, polyaniline, etc., and wiring patterns 1a-1 of the front and rear surfaces through the board 1 in the lands 1a-2, i.e., conductive spots 1a-3 for conductively connecting the lands 1a-2, and surface mounting components 2 such as chip resistors are solder-connected. Thus, since the wiring efficiency of the board is improved, the mounting efficiency of the components is improved, and a high density mounting can be promoted.

7. 发明专利

JPH0682507A INSPECTION METHOD FOR WIRING BOARD 失效
公开(公告)号：JPH0682507A
公开(公告)日：1994-03-22
申请号：JP23504792
申请日：1992-09-03
申请人： FUJITSU LTD
发明人： UEHARA EIKO , NOKIMURA HITOSHI , OGATA KINUKO , AZUMAGUCHI YUTAKA
IPC分类号： G01R31/02
摘要： PURPOSE:To allow accurate inspection of conduction and impurities by irradiating one point of a wiring pattern with an electron beam while another point with a positive ion beam and then detecting emitted electrons. CONSTITUTION:In the inspection of a wiring pattern 5 on a wiring board 4, one point of the wiring pattern is irradiated with an electron beam generated from a generating means 1 while a different point is irradiated with a positive ion beam generated from a generating means 2 and then the quantity or energy of electrons emitted therefrom is measured through a detecting means 3. When the wiring is conducting, potential drop due to the electron beam is offset by potential rise due to the positive ion beam to keep the potential on the wiring pattern 5 constant thus increasing the secondary electron emission quantity as compared with nonconducting state. Consequently, discrimination can be made between conduction and nonconduction. Furthermore, Auger electrons are also emitted. Since the energy thereof is determined depending on the combination of target substance and the type of particles used in the irradiation, the impurities are detected and the substance is specified based on the measurement of energy.

8. 发明专利

JPH0352244A SEMICONDUCTOR-CHIP MOUNTING STRUCTURE 失效
公开(公告)号：JPH0352244A
公开(公告)日：1991-03-06
申请号：JP18813789
申请日：1989-07-20
申请人： FUJITSU LTD
发明人： OGATA KINUKO , KURODA YASUHIDE , KUMAI TOSHIO
IPC分类号： H01L21/60
摘要： PURPOSE:To reduce the occupying area for mounting and to make it possible to mount electronic parts in high density by connecting the outer tip parts of the leads of a tape carrier to the corresponding conductor patterns of a circuit board through the high conductivity lead patterns of a conductive macromolecular film frame. CONSTITUTION:The shape of a conductive macromolecular film frame 20 is approximately equal to the square frame formed of outer tip parts 11b of leads 11 of a tape carrier 10. Respective high conductivity lead patterns 21 are overlapped on the ends of conductor patterns 2. The outer tip parts 11a of the leads 11 are overlapped on the high conductivity lead patterns 21. Such a state is maintained. Therefore, conductive macromolecular film frame 20 is sufficiently smaller than a conventional resin film frame which is provided at the outside of the outer tip parts 11b of the leads 11 in an outer frame shape. Thus, the occupying area for mounting on the semiconductor chip 3 becomes small, and the high mounting density of electronic parts can be achieved.

9. 发明专利

JPH0555398A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0555398A
公开(公告)日：1993-03-05
申请号：JP20967791
申请日：1991-08-22
申请人： FUJITSU LTD
发明人： ABE MITSUNORI , AZUMAGUCHI YUTAKA , OGATA KINUKO
IPC分类号： H01L23/12 , H01L23/36 , H01L23/40
摘要： PURPOSE:To enable a semiconductor chip to be enhanced in heat dissipating properties by a method wherein a circuit board is formed in a composite structure composed of a ceramic board and a multilayer resin board. CONSTITUTION:A board 1 where a semiconductor chip 5 is mounted with its face upward is composed of a ceramic board 2 and a multilayer resin board 3 which is formed by alternately providing low dielectric constant resin layers 31 and conductor patterns 32 onto the surface of the ceramic board 2. A heat conductive pad 8 provided with windows 8B where outer lead bonding pads 7 are arranged in line is provided to the surface of the multilayer resin board 3, a heat conductive plate 40 is attached thereon, furthermore a semiconductor chip 5 is die-bonded to a central square section 40A of the heat conductive plate 40, and a frame-shaped heat dissipating body 50 is mounted surrounding the semiconductor chip 5. Therefore, the heat released from the semiconductor chip 5 is transmitted to the heat dissipating body 50 large in heat dissipating area through the intermediary of heat conduction plate 40 and discharged into the air from the heat dissipating body 50, so that the semiconductor chip 5 is improved in heat dissipating properties.

10. 发明专利

JPH03292797A BOARD STRUCTURE AND LAMINATION OF CONDUCTOR LAYER AND INSULATION LAYER ONTO BOARD 失效
公开(公告)号：JPH03292797A
公开(公告)日：1991-12-24
申请号：JP9385990
申请日：1990-04-11
申请人： FUJITSU LTD
发明人： HOSOGAI MASAO , OTAGURO HIROYUKI , UEHARA EIKO , KASHIWABARA HIROTAKA , OGATA KINUKO
IPC分类号： B05C1/02 , H01L21/312 , H01L23/12 , H01L23/15 , H05K3/46
摘要： PURPOSE:To obtain a board structure adapted for the formation of a thin film of liquid resin on it through a spin coater and to enable the lamiation of a thin film to be easily checked by a method wherein a circular or a square protrusion is provided to the rear of a board, and recesses used for checking the lamination state of a thin film are provided to the front of the board. CONSTITUTION:A circular protrusion 12 is formed on the rear of a square ceramic board 10. It can easily be manufactured through such 4 process that a ceramic green sheet is formed into this shape and burned. Recesses 16 used for checking the lamination state of a multilayer wiring thin film are provided to the front of the board 10. As the protrusion 12 is provided to the rear of the board 10, the board 10 is placed on a plane desk or a table making the protrusion 10 face downward, whereby the board 10 can be kept horizontal even if polyimide adheres to the rear of the board 10, and the adhered polyimide has no adverse effect on a light exposure process. The height of the protrusion 12 is set larger than the thickness of polyimide which adheres to the rear of the board.

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