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1. 发明专利

JP2011119616A Method for manufacturing printed wiring board, printed wiring board, and electronic device 审中-公开
标题翻译：制造印刷线路板，印刷线路板和电子设备的方法
公开(公告)号：JP2011119616A
公开(公告)日：2011-06-16
申请号：JP2009277892
申请日：2009-12-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKETOMI NOBUO , KIKUCHI SHUNICHI , NAKAMURA NAOKI , HATANAKA KIYOYUKI , SUGINO SHIGERU , KANAI AKIRA
IPC分类号： H05K3/46
CPC分类号： H05K3/4694 , H05K1/0269 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09918 , H05K2201/09972 , H05K2203/061 , H05K2203/063 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board that has a smooth surface, and is made partially multilayered and has high degree of freedom of design.
SOLUTION: A method for manufacturing the printed circuit board includes the processes of: laterally-aligning a first inner-layer substrate in which first insulation layers and first conductor layers are laminated and integrated, and a second inner-layer substrate in which second insulation layers and second conductor layers are laminated and integrated and which has the number different from the number of the layer of the first inner-layer substrate; placing the laterally-aligned first inner-layer substrate and second inner-layer substrate between a pair of third insulation layers and pressing them in a thickness direction of a pair of surface-layer substrates; and printing a conductor pattern on surfaces of the pair of third insulation layers respectively.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有光滑表面并且部分多层并具有高自由度设计的印刷线路板。解决方案：印刷电路板的制造方法包括：将第一绝缘层和第一导体层层叠并一体化的第一内层基板横向排列的工序;第二内层基板，其中第二绝缘层和第二导体层被层叠并整合，其数量与第一内层基板的层数不同; 将横向排列的第一内层基板和第二内层基板放置在一对第三绝缘层之间，并在一对表面层基板的厚度方向上按压它们; 以及分别在所述一对第三绝缘层的表面上印刷导体图案。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011243897A Multilayer printed board and method of manufacturing the same 审中-公开
标题翻译：多层印刷板及其制造方法
公开(公告)号：JP2011243897A
公开(公告)日：2011-12-01
申请号：JP2010117011
申请日：2010-05-21
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KANAI AKIRA , KIKUCHI SHUNICHI , NAKAMURA NAOKI , SUGINO SHIGERU , HATANAKA KIYOYUKI , TAKETOMI NOBUO
IPC分类号： H05K3/46
CPC分类号： H05K1/185 , H01L23/4985 , H01L23/5389 , H01L24/73 , H01L2224/0401 , H01L2224/06181 , H01L2224/16225 , H01L2224/32225 , H01L2224/33181 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H05K1/186 , H05K3/4602 , H05K3/4691 , H05K2201/10681 , H05K2201/10734 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed board that allows wiring patterns of the board to be designed in high density without restricting the location of terminals of a semiconductor device, and to provide a method of manufacturing the same.SOLUTION: A multilayer printed board 2 comprises a semiconductor package 1 including a flexible wiring layer 14b with a free-end edge, and the flexible wiring 14 b is electrically connected to an inner wiring layer 24c in the printed board.
摘要翻译：要解决的问题：提供一种多层印刷电路板，其允许在不限制半导体器件的端子的位置的情况下高密度地设计电路板的布线图案，并提供其制造方法。解决方案：多层印刷电路板2包括半导体封装1，其包括具有自由端边缘的柔性布线层14b，并且柔性布线14b与印刷电路板中的内部布线层24c电连接。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2010199372A Flexible printed board 有权
标题翻译：柔性印刷板
公开(公告)号：JP2010199372A
公开(公告)日：2010-09-09
申请号：JP2009043738
申请日：2009-02-26
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI , SUGINO SHIGERU , TAKETOMI NOBUO , KANAI AKIRA
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/118 , H05K1/0281 , H05K1/117 , H05K2201/09709 , H05K2201/09727 , H05K2201/09781 , H05K2201/2009
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed board which can restrain cracks in a wiring pattern.
SOLUTION: A first wiring pattern 43 extends at a relatively small third width W3 between second conductive pads 47, 47. A reinforcing layer 54 reinforces a reinforcing region A including a boundary between a first conductive pad 42 and a first wiring pattern 43, which relatively tend to generate cracks. The reinforcing layer 54 partially reinforces a flexible printed board 29 in this way. Generation of stress is restrained in the reinforcing region A. The generation of cracks is restrained in the first wiring pattern 43. The strength of the flexible printed board 29 is averaged all over the flexible printed board 29. Furthermore, first and second conductive pads 42, 47 define relatively large first width W1 and second width W2 outside the reinforcing region A. Accordingly, even if stress is generated in the first and second conductive pads 42, 47 outside the reinforcing region A, generation of cracks is restrained.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供可以抑制布线图案中的裂纹的柔性印刷电路板。解决方案：第一布线图案43在第二导电焊盘47,47之间以相对小的第三宽度W3延伸。加强层54加强包括第一导电焊盘42和第一布线图案43之间的边界的加强区域A ，其相对倾向于产生裂纹。加强层54以这种方式部分地加强柔性印刷板29。在加强区域A中约束产生应力。在第一布线图形43中抑制裂纹的产生。柔性印刷电路板29的强度在柔性印刷电路板29的整个周围被平均化。此外，第一和第二导电焊盘42 47限定加强区域A外的相对较大的第一宽度W1和第二宽度W2.因此，即使在加强区域A外的第一导电焊盘42,447中产生应力，也抑制裂纹的产生。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JPH07250354A MATRIX BOARD FOR AUTOMATIC MDF 失效
公开(公告)号：JPH07250354A
公开(公告)日：1995-09-26
申请号：JP3897794
申请日：1994-03-10
申请人： FUJITSU LTD
发明人： MITAMURA FUMIO , TAKAGI HIROFUMI , SUGANE MITSUHIKO , SUGINO SHIGERU , YAMAMOTO YOSHITADA
IPC分类号： H05K1/02 , H04Q1/14 , H05K1/00 , H05K3/28
摘要： PURPOSE:To recognize an accurate position for reference holes and other holes by not applying black coloring to a metallic pattern of a 1st inner layer of a matrix board of a Main Distributing Frame (MDF) system so as to obtain a specific reflectance. CONSTITUTION:A matrix board of the MDF system is made up of a resin plate 3, a surface layer L1, layers L2-L5 of a copper pattern 4, and a rear layer L6 or the like and they are roughly positioned based on a reference hole H'1 and a ring metallic pin is inserted automatically to other hole 1 to connect a subscriber line to an intra-station equipment. Metallic pattern by gold plating is not is existence in the layer L1 and in layer L2 around the hole 21 a pattern 4 is increased in the degree of contact with a resin, no black color processing is made by oxidation to improve the adhesive performance and a high reflectance is maintained, positions of the holes 1,2 with a low reflectance are accurately recognized and occurrence of a damaged insertion pin or the like is simply prevented.

5. 发明专利

JP2015008217A バックアップピンの設置方法およびプリント基板ユニットの製造方法有权
标题翻译：备用引脚安装方法和制造印刷电路板单元的方法
公开(公告)号：JP2015008217A
公开(公告)日：2015-01-15
申请号：JP2013132799
申请日：2013-06-25
申请人：富士通株式会社 , Fujitsu Ltd
发明人： MAENO YOSHINOBU , SUGINO SHIGERU
IPC分类号： H05K3/34
摘要：【課題】電子部品を搭載したプリント基板のリフローを行う際に、簡易に、半田の接続不良を抑制するための技術を提供する。【解決手段】半田ペーストが供給された第1主面に電子部品を載置した状態のプリント基板を加熱して半田付けを行うリフロー時に、プリント基板を支持するためのバックアップピンを支持装置の基台に設置する方法であって、プリント基板の自重およびプリント基板に搭載される電子部品の重量によってプリント基板に発生する撓みが、リフローの加熱によって発生する電子部品の熱反りに沿って形成されるようにバックアップピンを設置する。【選択図】図18
摘要翻译：要解决的问题：提供一种在安装有安装有电子板的印刷电路板的回流时简单地抑制焊接连接故障的技术。解决方案：公开了一种用于将用于支撑印刷电路板的支撑销安装在当将电子部件放置在第一主表面接收焊膏上的状态下的印刷电路板加热并进行焊料回流时的支撑装置。安装备用引脚，使得印刷电路板的自重和安装在印刷电路板上的电子部件的重量在印刷电路板上产生的弯曲形成为通过回流加热产生的电子部件的热翘曲。

6. 发明专利

JP2011198908A Semiconductor device, circuit board, and method for manufacturing the circuit board 有权
标题翻译：半导体器件，电路板及制造电路板的方法
公开(公告)号：JP2011198908A
公开(公告)日：2011-10-06
申请号：JP2010062320
申请日：2010-03-18
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MIZUTANI DAISUKE , SUGINO SHIGERU
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board having high reliability in connecting a metal pattern with a via.SOLUTION: This semiconductor device has: a metal pattern 13 formed on an insulating film 12; a hole 11a which penetrates the insulating film 12 and the metal pattern 13; and a via 14 which is formed in the hole 11a, jointed to the metal pattern 13 in the hole 11a, and also has one end contiguous to an opposite face of the insulating film 12 of the metal pattern 13.
摘要翻译：要解决的问题：提供一种在将金属图案与通孔连接方面具有高可靠性的电路板。解决方案：该半导体器件具有：形成在绝缘膜12上的金属图案13; 穿透绝缘膜12和金属图案13的孔11a; 以及通孔14，其形成在孔11a中，与孔11a中的金属图案13接合，并且还具有与金属图案13的绝缘膜12的相对面相邻的一端。

7. 发明专利

JP2008091552A Printed circuit board, printed board unit, and electronic equipment 审中-公开
标题翻译：印刷电路板，印刷电路板和电子设备
公开(公告)号：JP2008091552A
公开(公告)日：2008-04-17
申请号：JP2006269662
申请日：2006-09-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI , SUGINO SHIGERU , KANAI AKIRA
IPC分类号： H05K1/02 , H05K3/28 , H05K3/34
CPC分类号： H05K1/0271 , H05K3/28 , H05K3/3415 , H05K3/3452 , H05K2201/068 , H05K2201/09136 , H05K2201/09363 , H05K2201/09781 , H05K2203/0588 , H05K2203/1572 , Y10T29/4913 , Y10T29/49147
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board which can surely prevent a poor connection between a terminal pad and a terminal of an electronic component. SOLUTION: In the printed circuit board 17, specific regions 42a-42d are located on the rear side of an electronic component mounting region for bearing the electronic component. In the specific regions 42a-42d, a conductive film 39 is formed according to the ratio of the surface area of the board and the area of the conductive material which is defined by the electronic component mounting region. The ratio of the surface area of the board 28 and the area of the conductive material 39 is adapted to each electronic component by the electronic component mounting region and the specific regions 42a-42d. Thus, the warping of the printed circuit board 17 can be suppressed during heating in the reflow process. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够可靠地防止端子焊盘与电子部件的端子之间的连接不良的印刷电路板。解决方案：在印刷电路板17中，特定区域42a-42d位于用于承载电子部件的电子部件安装区域的后侧。在特定区域42a-42d中，根据由电子部件安装区域限定的基板的表面积和导电材料的面积的比例，形成导电膜39。电路板28的表面积与导电材料39的面积之比通过电子部件安装区域和特定区域42a-42d适应于各电子部件。因此，在回流工序中加热时能够抑制印刷电路板17的翘曲。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007324315A Manufacturing device of printed circuit board 有权
标题翻译：印刷电路板制造设备
公开(公告)号：JP2007324315A
公开(公告)日：2007-12-13
申请号：JP2006151794
申请日：2006-05-31
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUGINO SHIGERU
IPC分类号： H05K3/34 , B23K1/00 , B23K3/06 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To surely prevent the occurrence of connection failures or the like in a manufacturing device of a printed circuit board.
SOLUTION: The manufacturing device of the printed circuit board solders a packaged component 2 on a printed wiring board 1. The printed circuit board is constituted of a preparatory treatment device 6 for supplying high density unmelted solder 5 to a gap between a through-hole 3 of the printed wiring board 1 and a lead 4 of a through-hole packaged component 2A, and a solder melting device 7 for melting and hardening the solder 5.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了确保防止印刷电路板的制造装置中的连接故障等的发生。解决方案：印刷电路板的制造装置将印刷电路板1上的封装部件2焊接。印刷电路板由用于将高密度未熔化焊料5提供到贯通孔之间的间隙的预备处理装置6构成印刷电路板1的孔3和通孔封装元件2A的引线4和用于熔化和硬化焊料5的焊料熔化装置7.版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2004288989A Multilayer printed circuit board and method for producing the same 有权
公开(公告)号：JP2004288989A
公开(公告)日：2004-10-14
申请号：JP2003080942
申请日：2003-03-24
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SUGINO SHIGERU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To directly and surely connect only specific inner layers IVH with each other.
SOLUTION: A method for producing a multilayer printed circuit board where a plurality of IVH boards are laminated inserting an insulator layer previously clogs the inner layer sites of via holes IVHa and IVHb connecting respective IVH boards 10A and 10B with each other, and arranges a conductive paste 33 through at the same coordinates as those of the via hole of the insulator layer 30. In the case of laminating, the method connects the inner layer lands of the respective via holes IVHa and IVHb with the conductive paste 33.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2014060350A Printed circuit board, crack prediction device, and crack prediction method 有权
标题翻译：印刷电路板，裂纹预测装置和裂纹预测方法
公开(公告)号：JP2014060350A
公开(公告)日：2014-04-03
申请号：JP2012205868
申请日：2012-09-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： IRIGUCHI SHIGEO , NAKAMURA NAOKI , SUGINO SHIGERU , MUKOUYAMA NARUHIDE , KANAI AKIRA , TAKETOMI NOBUO , HATANAKA KIYOYUKI
IPC分类号： H05K3/46 , H05K1/11
CPC分类号： G01R31/046 , G01R31/2805 , H05K1/0268 , H05K1/0271 , H05K1/0298 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of predicting the occurrence of cracks of through holes, and to provide a crack prediction device and a crack prediction method.SOLUTION: A printed circuit board includes: a lamination body where multiple wiring layers are laminated; a first through hole which electrically connects at least two or more wiring layers with each other; and a second through hole having strength against the expansion/contraction of the lamination body which is smaller than that of the first through hole.
摘要翻译：要解决的问题：提供能够预测通孔裂纹发生的印刷电路板，并提供裂纹预测装置和裂纹预测方法。解决方案：印刷电路板包括：层叠体，其中多个布线层层压; 使至少两个以上的布线层彼此电连接的第一通孔; 以及具有抵抗层叠体的膨胀/收缩强度小于第一通孔的强度的第二通孔。

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