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1. 发明专利

JPH08306267A MATRIX BOARD 失效
公开(公告)号：JPH08306267A
公开(公告)日：1996-11-22
申请号：JP11047595
申请日：1995-05-09
申请人： FUJITSU LTD
发明人： MITAMURA FUMIO , ABE TOSHIO , TAKAGI HIROFUMI
IPC分类号： H01H27/00 , H04Q1/14 , H05K1/00
摘要： PURPOSE: To reduce the manhours of the work so as to improve the yield, to lower the cost, and to facilitate the insertion of a connecting pin into a cross point pin hole by overlapping and fixing a four-layered printed wiring board and a guide board with a mechanical means. CONSTITUTION: A guide board 20 is laminated on the surface side of a four- layered printed wiring board 40, and fixed to the printed board 40 by a mechanical fixing means 90. A cross point hole 3 is drilled in each cross point, in which an A-line X-directional pattern 1-1 (B-line X-directional pattern 1-2) and an A-line Y-directional pattern 2-1 (B-line Y-directional pattern 2-2) three- dimensionally cross each other. A part of this hole 3 in the surface side of the board 20 is formed into the taper-shaped hole for enlargement so that a connecting pin 15 is easily inserted. When the connecting pin 15 is inserted into the hole 3, the pattern 1-1 and the pattern 2-1 are connected to each other through a ring-like conductor 15A, and the pattern 1-2 and the pattern 2-2 are connected to each other through a ring-like conductor 15B. The manhours of the work is thereby reduced, and the pin 15 can be easily inserted into the hole 3.

2. 发明专利

JPH08205207A MATRIX BOARD 失效
公开(公告)号：JPH08205207A
公开(公告)日：1996-08-09
申请号：JP698795
申请日：1995-01-20
申请人： FUJITSU LTD
发明人： MITAMURA FUMIO , NOKIMURA HITOSHI , TAKAGI HIROFUMI
IPC分类号： H01R11/01 , H04Q1/14
摘要： PURPOSE: To attain miniaturization and the improvement of crosstalk characteristics concerning the matrix board for connecting subscriber's lines and the terminals of channel switches. CONSTITUTION: Concerning the matrix board for which plural wirings 4-1, 4-2, 5-1 and 5-2 are formed on insulated substrates 1 of plural layers so as to respectively parallel and to cross among the respective layers, inserting holes for inserting connecting pins are formed at the crossing parts of wirings, the wirings at the crossing part are connected by inserting the connecting pin to that inserting hole and the wirings at the crossing part are disconnected by pulling out the connecting pin, areas 6-1 and 6-2 with different wiring lengths and grid dimensions are formed by setting the wiring interval between the wiring 4-1 connected to a first connector 2-1 on the side of an input line and the wiring 5-1 connected to a first connector 3-1 on the side of an output line narrower than the wiring interval between the wiring 4-2 connected to a second connector 2-2 on the side of an output line and the wiring 5-2 connected to a second connector 3-2 on the side of the output line.

3. 发明专利

JPH0637412A PRINTED WIRING BOARD 失效
公开(公告)号：JPH0637412A
公开(公告)日：1994-02-10
申请号：JP18816692
申请日：1992-07-15
申请人： FUJITSU LTD
发明人： TAKAGI HIROFUMI , SHIRAI MAMORU , SUGANE MITSUHIKO , YAMAMOTO YOSHITADA
IPC分类号： H05K1/02 , H01P5/08 , H05K3/24 , H05K3/46
摘要： PURPOSE:To provide a printed wiring board easily obtaining stable characteristic impedance regarding the printed wiring board proper to a high-frequency circuit. CONSTITUTION:A printed wiring board is composed of a substrate 11, a grounding layer 12 formed on the first surface of the substrate 11 so as to cover approximately the whole surface, a signal line 13 shaped on the second surface of the substrate 11 and first and second grounding lines 14, 15, which are formed on both sides of the signal line 13 and top faces of which are more projecting than the top face of the signal line 13.

4. 发明专利

JPH05129780A PRINTED WIRING BOARD 失效
公开(公告)号：JPH05129780A
公开(公告)日：1993-05-25
申请号：JP29182391
申请日：1991-11-08
申请人： FUJITSU LTD
发明人： HAGIWARA MARI , SHIRAI MAMORU , TAKAGI HIROFUMI , SUGANE MITSUHIKO
IPC分类号： H05K3/46
摘要： PURPOSE:To provide an adhesion structure which is high in reliability preventing adhesive agent from penetrating into through-holes provided to a printed wiring board composed of two printed wiring board halves where circuits are formed and the through-holes into which press-fit pins are fitted are provided, where the two printed wiring boards are bonded together making their rear sides confront each other. CONSTITUTION:The bonding surface-side openings of through-holes 1 provided to printed wiring board halves 21 and 22 are blocked with thermosetting resin material 4, through-holes 5 are bored in the opposed printed wiring board halves 21 and 22 at points which confront the through-holes 1 or in their vicinities, and a boring 6 larger than the through-hole 5 in diameter is provided to the bonding surface-side opening of the through-hole 5 or a wide groove is provided connecting the adjacent through-holes 5.

5. 发明专利

JPH04280697A PRINTED WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04280697A
公开(公告)日：1992-10-06
申请号：JP6760091
申请日：1991-03-08
申请人： FUJITSU LTD
发明人： TAKAGI HIROFUMI , NAKAMURA KIYONORI
IPC分类号： H01R9/16 , H05K1/14 , H05K3/00 , H05K3/46
摘要： PURPOSE:To enable a printed wiring board to which an electronic circuit can be connected from both sides to be manufactured. CONSTITUTION:Through-holes 8 into which press-fit connectors are inserted are provided to both sides of a printed wiring board, and a through-hole sealing sheet member 10 and the cured prepregs 6a and 6b which are laminated and pressed are interposed between the through-holes 8 provided to the printed wiring boards 4a and 4b. One of the openings of the through-hole 8 is sealed up with the sheet member 10, and the printed wiring boards 4a and 4b are laminated, whereby a blind through-hole 8 prescribed in diameter and depth can be provided to both the sides of the laminated wiring boards 4a and 4b.

6. 发明专利

JPS62241393A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPS62241393A
公开(公告)日：1987-10-22
申请号：JP5816786
申请日：1986-03-18
申请人： FUJITSU LTD
发明人： MOTOHASHI SHOICHIRO , TAKAGI HIROFUMI , YAGI KANJI
IPC分类号： H05K3/28

7. 发明专利

JPS5745296A Method of producing printed board 失效
公开(公告)号：JPS5745296A
公开(公告)日：1982-03-15
申请号：JP11935980
申请日：1980-08-29
申请人： Fujitsu Ltd
发明人： TAKAGI HIROFUMI
IPC分类号： H05K1/02 , H05K1/11 , H05K3/36

8. 发明专利

JPS56139000A METHOD OF TESTING PACKAGE 失效
公开(公告)号：JPS56139000A
公开(公告)日：1981-10-29
申请号：JP4171480
申请日：1980-03-31
申请人： FUJITSU LTD
发明人： HOSAKA AKIHIKO , TAKAGI HIROFUMI
IPC分类号： H05K7/14 , H05K13/08

9. 发明专利

JPS56101794A METHOD OF RESISTING SOLDER OF PRINTED BOARD 失效
公开(公告)号：JPS56101794A
公开(公告)日：1981-08-14
申请号：JP473280
申请日：1980-01-19
申请人： FUJITSU LTD
发明人： TAKAGI HIROFUMI
IPC分类号： H05K3/28 , H05K1/11 , H05K3/40

10. 发明专利

JPH0878855A PRINTED WIRING BOARD 失效
公开(公告)号：JPH0878855A
公开(公告)日：1996-03-22
申请号：JP21348194
申请日：1994-09-07
申请人： FUJITSU LTD
发明人： MITAMURA FUMIO , TAKAGI HIROFUMI , SUGINO SHIGERU
IPC分类号： H05K3/46
摘要： PURPOSE: To prevent generation of interlayer exfoliation at the time of reflow soldering, without baking process, regarding a lamination type printed wiring board in which blind vias are formed. CONSTITUTION: A plurality of dummy through holes 12, 13 are formed which penetrate the laminated layers 1-7 of a printed wiring board and arranged in a matrix type. The dummy through holes 12, 13 are electrically independent of the wiring pattern formed on each of the layers of the printed wiring board. Interlayer exfoliation of the printed wiring board is restrained in a wide range by virture of the eyelet effect.

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