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1. 发明专利

JP2014232801A 回路基板用の修復部材、回路基板の製造方法、及び回路基板用の修復部材の製造方法有权
标题翻译：电路板修复会员，电路板制造工序及电路板修复会员流程
公开(公告)号：JP2014232801A
公开(公告)日：2014-12-11
申请号：JP2013113077
申请日：2013-05-29
申请人：富士通株式会社 , Fujitsu Ltd
发明人： HATANAKA KIYOYUKI , NAKAMURA NAOKI , IRIGUCHI SHIGEO , ABE MITSUNORI , KANAI AKIRA , TAKETOMI NOBUO
IPC分类号： H05K3/28
摘要：【課題】回路基板用の修復部材、回路基板の製造方法、及び回路基板用の修復部材の製造方法において、欠損したソルダレジスト層を簡単に修復できるようにすること。【解決手段】シート21と、シート21の上に設けられ、所定の平面形状に整形された樹脂層22とを有し、樹脂層22が、修復対象の回路基板1に貼付可能な粘着性を有し、かつ、シート21から剥離可能である回路基板用の修復部材20による。【選択図】図4
摘要翻译：要解决的问题：为了能够容易地恢复用于电路板的恢复部件的缺陷的阻焊层，制造电路板的工艺以及制造用于电路板的恢复部件的工艺。用于从片材21剥离的电路板的修复部件20包括：片材21; 以及设置在片材21上的成形为预定平面形状的树脂层22。树脂层22具有可以粘贴到电路板1上以便恢复的粘合性。

2. 发明专利

JP2011119616A Method for manufacturing printed wiring board, printed wiring board, and electronic device 审中-公开
标题翻译：制造印刷线路板，印刷线路板和电子设备的方法
公开(公告)号：JP2011119616A
公开(公告)日：2011-06-16
申请号：JP2009277892
申请日：2009-12-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKETOMI NOBUO , KIKUCHI SHUNICHI , NAKAMURA NAOKI , HATANAKA KIYOYUKI , SUGINO SHIGERU , KANAI AKIRA
IPC分类号： H05K3/46
CPC分类号： H05K3/4694 , H05K1/0269 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09918 , H05K2201/09972 , H05K2203/061 , H05K2203/063 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board that has a smooth surface, and is made partially multilayered and has high degree of freedom of design.
SOLUTION: A method for manufacturing the printed circuit board includes the processes of: laterally-aligning a first inner-layer substrate in which first insulation layers and first conductor layers are laminated and integrated, and a second inner-layer substrate in which second insulation layers and second conductor layers are laminated and integrated and which has the number different from the number of the layer of the first inner-layer substrate; placing the laterally-aligned first inner-layer substrate and second inner-layer substrate between a pair of third insulation layers and pressing them in a thickness direction of a pair of surface-layer substrates; and printing a conductor pattern on surfaces of the pair of third insulation layers respectively.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有光滑表面并且部分多层并具有高自由度设计的印刷线路板。解决方案：印刷电路板的制造方法包括：将第一绝缘层和第一导体层层叠并一体化的第一内层基板横向排列的工序;第二内层基板，其中第二绝缘层和第二导体层被层叠并整合，其数量与第一内层基板的层数不同; 将横向排列的第一内层基板和第二内层基板放置在一对第三绝缘层之间，并在一对表面层基板的厚度方向上按压它们; 以及分别在所述一对第三绝缘层的表面上印刷导体图案。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2009231596A Multilayer wiring board, multilayer wiring board unit, and electronic device 审中-公开
标题翻译：多层接线板，多层接线板单元和电子设备
公开(公告)号：JP2009231596A
公开(公告)日：2009-10-08
申请号：JP2008076173
申请日：2008-03-24
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI
IPC分类号： H05K3/46
CPC分类号： H05K1/115 , H05K1/113 , H05K3/4652 , H05K2201/0347 , H05K2201/0394 , H05K2201/09509 , H05K2201/09518 , H05K2201/0959 , H05K2201/096
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board of which the cost is suppressed, a multilayer wiring board unit constituted by mounting electronic components on such a multilayer wiring board, and to provide an electronic device which has such multilayer wiring board unit built therein.
SOLUTION: A multilayer wiring board 300 includes a two-layer-skip via 350, in a shape of recesses along an inner surface, constituted of a conductor covering the inner surface of a hole, penetrating through insulating layers for three layers and having a bottom on a wiring layer 312 of a surface 300a side of a core layer 310, from a wiring layer 322 of the surface 300a side; and a three-layer-skip via 360 in the shape of recess along the inner surface composed of a conductor covering the inner surface, penetrating through insulating layers for four layers reaching the wiring layer 312 of the surface 300a side of the core layer 310, from a wiring layer 322 of a back surface side 300b and having a bottom whose position mates the bottom of the hole, corresponding to the two-layer-skip via 350 in the wiring layer 312 of the surface side 300a of the core layer 310.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供抑制成本的多层布线板，通过在这种多层布线板上安装电子部件而构成的多层布线基板单元，并且提供具有这种多层布线基板的电子设备单位内建解决方案：多层布线板300包括沿着内表面形成为凹陷形状的双层通孔350，该导体由覆盖孔内表面的导体穿过三层绝缘层构成，在芯层310的表面300a侧的布线层312上具有从表面300a侧的布线层322的底部; 以及沿着由覆盖内表面的导体构成的内表面的凹陷形状的三层跳过通孔360，穿过穿过芯层310的表面300a侧的布线层312的四层的绝缘层，来自背面侧300b的布线层322，其底部的位置与孔的底部配合，对应于芯层310的表面侧300a的布线层312中的双层通孔350。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2005322807A Wiring board and its manufacturing method 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2005322807A
公开(公告)日：2005-11-17
申请号：JP2004140253
申请日：2004-05-10
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI
IPC分类号： H05K1/02 , H05K1/11 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H05K1/0245 , H05K1/0222 , H05K1/115 , H05K3/429 , H05K3/4623 , H05K2201/09236 , H05K2201/09536 , H05K2201/09627 , H05K2201/09809 , Y10T29/49117 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a wiring board of a multilayered structure in which various transmission forms of a differential transmission, etc. in a via are possible, and to provide its manufacturing method. SOLUTION: Insulating substrates (substrates 42, 43) are used. This wiring board comprises first via holes (44, 441, 442, 443, 444, 445) formed in this insulating substrate and containing a plurality of circumferential face parts (50, 52), and a plurality of second via holes (46, 48, 461, 462, 463) formed via an insulator (insulating layer 60) in the first via hole and having concentric circles with the circumferential face parts. Thus, a differential wiring structure or coaxial structures (66, 68) are constituted. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种多通路结构的布线板，其中通孔中的差动传动等的各种传动形式可能，并提供其制造方法。
解决方案：使用绝缘基板（基板42,43）。该布线板包括形成在该绝缘基板中并包含多个周面部分（50,52）的第一通孔（44,44,444,444,444,455）和多个第二通孔（46,48），461,462,463），其通过第一通孔中的绝缘体（绝缘层60）形成，并且与圆周面部分具有同心圆。因此，构成差动布线结构或同轴结构（66,68）。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2014060350A Printed circuit board, crack prediction device, and crack prediction method 有权
标题翻译：印刷电路板，裂纹预测装置和裂纹预测方法
公开(公告)号：JP2014060350A
公开(公告)日：2014-04-03
申请号：JP2012205868
申请日：2012-09-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： IRIGUCHI SHIGEO , NAKAMURA NAOKI , SUGINO SHIGERU , MUKOUYAMA NARUHIDE , KANAI AKIRA , TAKETOMI NOBUO , HATANAKA KIYOYUKI
IPC分类号： H05K3/46 , H05K1/11
CPC分类号： G01R31/046 , G01R31/2805 , H05K1/0268 , H05K1/0271 , H05K1/0298 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of predicting the occurrence of cracks of through holes, and to provide a crack prediction device and a crack prediction method.SOLUTION: A printed circuit board includes: a lamination body where multiple wiring layers are laminated; a first through hole which electrically connects at least two or more wiring layers with each other; and a second through hole having strength against the expansion/contraction of the lamination body which is smaller than that of the first through hole.
摘要翻译：要解决的问题：提供能够预测通孔裂纹发生的印刷电路板，并提供裂纹预测装置和裂纹预测方法。解决方案：印刷电路板包括：层叠体，其中多个布线层层压; 使至少两个以上的布线层彼此电连接的第一通孔; 以及具有抵抗层叠体的膨胀/收缩强度小于第一通孔的强度的第二通孔。

6. 发明专利

JP2013205485A Method and device for mounting light emission member 有权
标题翻译：用于安装光发射构件的方法和装置
公开(公告)号：JP2013205485A
公开(公告)日：2013-10-07
申请号：JP2012071794
申请日：2012-03-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： HIROSHIMA YOSHIYUKI , NAKAMURA NAOKI , MATSUI AKIKO , YAMADA TETSUO , OI YOSHIHIRO , NAGARA KOHEI
IPC分类号： G02B6/42 , G02B6/122 , H01S5/022
CPC分类号： G02B6/4201 , G02B6/4214 , G02B6/4224 , G02B6/4225 , G02B6/4232
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for mounting a light emission member by preventing the light emission member from being displaced relative to a base plate.SOLUTION: A method for mounting a light emission member 36 includes bringing a friction sheet 62 into contact with between a base plate 16 and the light emission member while aligning the light emission member with the base plate by using light from a light emission component 40 of the light emission member 36. When solder 42 is fused, an action of friction force of the friction sheet 62 prevents displacement of the light emission member 36 relative to the base plate 16.
摘要翻译：要解决的问题：提供一种通过防止发光构件相对于基板移位来安装发光构件的方法和装置。解决方案：一种用于安装发光构件36的方法包括：使摩擦片62 通过使用来自发光构件36的发光构件40的光将发光构件与基板对准，同时与基板16和发光构件接触。当焊料42熔合时，摩擦力的作用摩擦片62防止发光构件36相对于基板16的位移。

7. 发明专利

JP2013195642A Optical coupling structure and optical transmission device 有权
标题翻译：光耦合结构与光传输装置
公开(公告)号：JP2013195642A
公开(公告)日：2013-09-30
申请号：JP2012061873
申请日：2012-03-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAGARA KOHEI , NAKAMURA NAOKI , MATSUI AKIKO , YAMADA TETSUO , HIROSHIMA YOSHIYUKI , OI YOSHIHIRO
IPC分类号： G02B6/42 , G02B6/122
CPC分类号： G02B6/26 , G02B6/4214 , G02B6/4232 , G02B6/4245 , G02B6/428
摘要： PROBLEM TO BE SOLVED: To suppress transmission loss of an optical coupling structure caused by a mirror.SOLUTION: An optical coupling structure includes a light source 1 and an optical waveguide 2. The light source 1 emits light 4. The optical waveguide 2 has a mirror surface 3 for reflecting the light 4 emitted from the light source 1 at one end 5. The optical waveguide 2 guides the light 4 reflected by the mirror surface 3 to the other end 6. The traveling direction of the light 4 emitted from the light source 1 tilts to a normal direction N-N of the mirror surface 3 at an angle larger than 45° toward the one end 5 of the optical waveguide 2. Further, the traveling direction of the light 4 emitted from the light source 1 tilts to the normal direction N-N of the mirror surface 3 at an angle satisfying a condition of total reflection of the light 4 on the mirror surface 3. Furthermore, the traveling direction of the light 4 emitted from the light source 1 tilts to the normal direction N-N of the mirror surface 3 at an angle satisfying a condition of total reflection of the light 4 in the optical waveguide 2.
摘要翻译：要解决的问题：抑制由镜子引起的光耦合结构的传输损耗。解决方案：光耦合结构包括光源1和光波导2.光源1发光4.光波导2具有镜面3用于在一端5反射从光源1发射的光4.光波导2将由镜面3反射的光4引导到另一端6.从光发射的光4的行进方向光源1朝向光波导2的一端5以大于45°的角度倾斜到镜面3的法线方向NN。此外，从光源1发射的光4的行进方向倾斜到正常镜面3的方向NN以满足反射面3上的光4的全反射条件的角度。此外，从光源1射出的光4的行进方向倾斜到法线方向以满足光波导2中的光4的全反射条件的角度的镜面3的N-N。

8. 发明专利

JP2011205151A Printed circuit board, printed board unit, and electronic device 审中-公开
标题翻译：印刷电路板，印刷电路板和电子设备
公开(公告)号：JP2011205151A
公开(公告)日：2011-10-13
申请号：JP2011158156
申请日：2011-07-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI , SUGINO SHIGERU , KANAI AKIRA
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing, with certainty, poor connection between a terminal pad and a terminal of an electronic device.SOLUTION: On a printed circuit board 17, specific areas 42a to 42d are specified at a rear side of an electronic component mounting area that receives electronic components. In the specific areas 42a to 42d, a conductive film 39 is formed based on a ratio of the area of the surface of a substrate that is set as an electronic component mounting area and an area of a conductive material. The ratio of the area of the surface of a substrate 28 and the area of the conductive material 39 is adjusted for each electronic component by the electronic device mounting area and the specific areas 42a to 42d. As a result, the warpage of the printed circuit board 17 can be suppressed during heating in a reflow process.
摘要翻译：要解决的问题：提供一种能够确实地防止端子焊盘与电子设备的端子之间的连接不良的印刷电路板。解决方案：在印刷电路板17上，将特定区域42a至42d指定为接收电子部件的电子部件安装区域的后侧。在特定区域42a至42d中，基于设置为电子部件安装区域的基板的表面的面积与导电材料的面积的比率形成导电膜39。通过电子设备安装区域和特定区域42a〜42d，对每个电子部件调整基板28的表面面积与导电材料39的面积的比例。结果，在回流处理中的加热期间可以抑制印刷电路板17的翘曲。

9. 发明专利

JP2011243897A Multilayer printed board and method of manufacturing the same 审中-公开
标题翻译：多层印刷板及其制造方法
公开(公告)号：JP2011243897A
公开(公告)日：2011-12-01
申请号：JP2010117011
申请日：2010-05-21
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KANAI AKIRA , KIKUCHI SHUNICHI , NAKAMURA NAOKI , SUGINO SHIGERU , HATANAKA KIYOYUKI , TAKETOMI NOBUO
IPC分类号： H05K3/46
CPC分类号： H05K1/185 , H01L23/4985 , H01L23/5389 , H01L24/73 , H01L2224/0401 , H01L2224/06181 , H01L2224/16225 , H01L2224/32225 , H01L2224/33181 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H05K1/186 , H05K3/4602 , H05K3/4691 , H05K2201/10681 , H05K2201/10734 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed board that allows wiring patterns of the board to be designed in high density without restricting the location of terminals of a semiconductor device, and to provide a method of manufacturing the same.SOLUTION: A multilayer printed board 2 comprises a semiconductor package 1 including a flexible wiring layer 14b with a free-end edge, and the flexible wiring 14 b is electrically connected to an inner wiring layer 24c in the printed board.

10. 发明专利

JP2011211072A Printed wiring board and method of fabricating printed wiring board 审中-公开
标题翻译：印刷线路板和印刷布线板的制作方法
公开(公告)号：JP2011211072A
公开(公告)日：2011-10-20
申请号：JP2010079159
申请日：2010-03-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAKAMURA NAOKI , TAKETOMI NOBUO , HATANAKA KIYOYUKI , IRIGUCHI SHIGEO
IPC分类号： H05K3/34 , H05K3/28
CPC分类号： H05K3/3452 , H05K3/225 , H05K3/303 , H05K3/3436 , H05K2201/0129 , H05K2203/0574 , H05K2203/0588 , H05K2203/176 , Y02P70/613 , Y10T29/49144
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board and a method of fabricating the printed wiring board that suppress an increase in work man-hour when an electronic component having a plurality of solder junctions is mounted on the printed wiring board.SOLUTION: The printed wiring board includes a printed wiring board body and a resin layer. The printed wiring board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed wiring board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough.
摘要翻译：要解决的问题：提供一种印刷线路板和制造印刷线路板的方法，其抑制当具有多个焊点的电子部件安装在印刷线路板上时的工作时间增加。解决方案：印刷布线板包括印刷线路板主体和树脂层。印刷线路板主体包括多个安装焊盘。含有热塑性树脂的树脂层形成在印刷线路板体的表面上。树脂层包括多个孔，其设置成与安装焊盘的位置一一对准地布置，用于使安装焊盘从中穿过。

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