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    • 51. 发明专利
    • GRINDING DEVICE
    • JP2001287141A
    • 2001-10-16
    • JP2000106519
    • 2000-04-07
    • DISCO ABRASIVE SYSTEMS LTD
    • KOMA YUTAKASEKIYA KAZUMA
    • B24B7/04B24B7/22B24B37/04B24B41/06
    • PROBLEM TO BE SOLVED: To perform high accurate grinding by stably supporting a holding table for holding a work piece by a method capable of keeping high throughput without causing heaviness or largeness, in the grinding device for grinding surfaces of the work piece such as a semiconductive wafer. SOLUTION: The grinding device 10 comprises the holding table 17 for holding the work piece, a holding table positioning means 18 that includes at least a carry-in region used for carrying the work piece to the holding table 17, a grinding region used for grinding the work piece held by the holding table 17, and a delivery region used for delivering the work piece from the holding table, and positioning the holding table 17 to the carry-in region, the grinding region, or the delivery region, and a support base 41 for supporting the holding table 17 positioned to the grinding region by the holding table positioning means 18. The holding table 17 is supported by the support base 41 with high rigidity during grinding.