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41. 发明专利

JP2000031180A PRODUCTION OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000031180A
公开(公告)日：2000-01-28
申请号：JP18105599
申请日：1999-06-28
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , KANEDA AIZO , TSUNODA SHIGEHARU , YOSHIDA ISAMU , NISHI KUNIHIKO
IPC分类号： H01L21/56 , B29C45/02 , B29C45/14 , B29C45/26
摘要： PROBLEM TO BE SOLVED: To enhance both production efficiency and product quality by mounting a lead frame on a die comprising a plurality of pots and a plurality of cavities, throwing resin into each pot, and then pressing a plurality of plungers thereby injecting resin into the cavity in the die. SOLUTION: A plurality of pots 2 for press feeding mold resin are conducted through a conduction path 10 and resin is fed from each pot 2 before a semiconductor element is mounted. The pot 2 is provided with a runner 3 and a first gate 4 is located at the forward end thereof. The first gate 4 is connected with a first cavity 5 and then connected with second and third cavities 7, 9 through second and third gates 6, 8. A lead frame 11 is then mounted on such a die and each pot 2 is pressed by means of a plurality of plungers 17 thus injecting resin into the cavities 5, 7, 9 in the die.

42. 发明专利

JPH11340358A SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF 失效
公开(公告)号：JPH11340358A
公开(公告)日：1999-12-10
申请号：JP14866798
申请日：1998-05-29
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , TSUNODA SHIGEHARU , SAEKI JUNICHI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a mounting structure thereof in which flatness of a flexible board is ensured at the time of pasting a reinforcing frame to the flexible board while preventing air entrained to an adhesive face from expanding during process for mounting a semiconductor device onto a mounting board to cause short circuit or open circuit of solder ball. SOLUTION: The semiconductor device comprises a frame-like flexible board 2 having a surface arranged with a wiring pattern and a window for receiving a semiconductor element 1, the semiconductor element 1 being set in the window of the board and having electrodes to be connected with the wiring pattern, a resin sealing part 5 for sealing the joint of the wiring pattern and the circuit face of the semiconductor element 1 arranged with the electrode, a reinforcing plate 6 for supporting the flexible board 2, and an adhesive 7 for pasting the rear surface of the frame-like flexible board 2 to the reinforcing plate 6 while dividing.

43. 发明专利

JPH1140704A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1140704A
公开(公告)日：1999-02-12
申请号：JP18945597
申请日：1997-07-15
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , TSUNODA SHIGEHARU , SAEKI JUNICHI
IPC分类号： H01L23/28 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To drain the expanded water content, without breaking a resin layer, to ensure a reliability of the semiconductor device by using a porous adhesive sheet for adhering semiconductor elements to a die pad; part of the sheet is exposed from a resin seal of the device. SOLUTION: A semiconductor element 1 is adhered to a die pad of a lead frame through a porous adhesive film 3 as adhesives, and connected to inner leads of the lead frame through Au wires 4, etc., and sealed with a resin 5. The film 3 is exposed from the resin seal within an extent not influencing on the wire bonding. If absorbed water content is expanded at mounting of a semiconductor device, the water content is drained through fibers or holes connected to outside of the film 3, thereby hardly causing the peel of a resin layer or substrate or package cracks.

44. 发明专利

JPH1131711A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1131711A
公开(公告)日：1999-02-02
申请号：JP18796497
申请日：1997-07-14
申请人： HITACHI LTD
发明人： HOZOJI HIROYUKI , TSUNODA SHIGEHARU , SAEKI JUNICHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To make feasible stabilizing the power supply voltage without reducing the package density, by a method wherein a ball electrode is mounted on a flexible substrate to provide a reinforcement frame on the backside of this substrate further mounting a chip capacitor connecting to the power supply part of a semiconductor element on this reinforcement frame. SOLUTION: A semiconductor element 1 connected to an electrode on a flexible substrate 2 and connecting part is sealed with a sealing resin 3. This flexible substrate 2 is provided with solder bumps 4 melted with balls for connecting the semiconductor substrate with a package substrate. Furthermore, a reinforcement frame 5 is stuck to the backside of the substrate 2 for securing the flatness of the bumps 4. Besides, a compact capacitor 6 is mounted on the reinforcement frame 5 for stabilizing the power supply voltage. In such a constitution, the fluctuation in the voltage, etc., can be satisfactorily suppressed even if the connecting distance between the semiconductor element 1 and the capacitor for stabilizing the power support voltage is short and the signal switching is made rapid.

45. 发明专利

JPH10242343A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH10242343A
公开(公告)日：1998-09-11
申请号：JP4186397
申请日：1997-02-26
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , ISADA NAOYA , TSUNODA SHIGEHARU , MIYANO ICHIRO , YAMAKURA HIDEO
IPC分类号： B29C45/40 , B29C45/02 , B29L31/34 , H01L21/56 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To seal even a thin semiconductor device with resin by a low-cost mold and then release it from the die by a method wherein a cushioning material is adhered to the semiconductor device and leads and the semiconductor device are electrically connected and then the semiconductor device is so resin- sealed that the cushioning material may be exposed. SOLUTION: A runner to supply resin thorough is formed between an upper mold 1 and a lower mold 2 and gates 4 are formed at the ends of the runner to form a cavity 5 for forming a semiconductor device. In the cavity 5, a lead frame 6 is located and a semiconductor device 7 is electrically connected to the lead frame 6 by means of bumps 8. Then, a cushioning material 9 is fixed to the semiconductor device 7, being brought into contact with the bottom face of the cavity 5. At the bottom face of the cavity 5 under the suctioning material 9, ejector pins 10 to be used when releasing the device from the mold after resin-sealed are installed. When the device is released from the mold, the cushioning material 9 absorbs a shock from the ejector pins 10 and thereby a defective molding which means the cracking of the semiconductor device 7 can be prevented.

46. 发明专利

JPH10163369A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH10163369A
公开(公告)日：1998-06-19
申请号：JP32243496
申请日：1996-12-03
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , HOZOJI HIROYUKI , HARUTA AKIRA , ICHITANI MASAHIRO , YAMAGUCHI TOSHIHIRO
IPC分类号： H01L23/28 , H01L21/60 , H01L23/12 , H01L23/14 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To improve the moisture resistance reliability and prevent the package crack from being developed by sealing with an org. material the front surface of a package and IC chip with part of a support frame exposed and back side of a circuit board exposed; the frame fixing and supporting the board. SOLUTION: A BGA package has an IC chip, laminate circuit board 2 having leading electrodes 3 and metal bumps to be outer electrodes bonded to the electrodes 3 on a mounting surface and support frame for fixing it. The support frame has a board-fixing frame 7 having through-holes 8 at parts to be adhered to the circuit board 2 with adhesives 13. The top and side face of the board 2 mounting the IC chip is sealed with a resin 12 to protect, with leaving the tops of the through-holes 8 exposed on the board-fixing frame 7. Thus, the water content in the adhesives 13 is quickly removed through the through-holes 8.

47. 发明专利

JPH10116962A SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH10116962A
公开(公告)日：1998-05-06
申请号：JP3737697
申请日：1997-02-21
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , HOZOJI HIROYUKI , SERIZAWA KOJI , OGAWA TOSHIO , KUMAZAWA TETSUO
IPC分类号： H01L25/07 , H01L21/56 , H01L23/31 , H01L23/433 , H01L23/495 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To manufacture a semiconductor device, with high reliability due to resin sealing, in which an external connection terminal is assigned almost vertically. SOLUTION: Using a plate 6 with positioning hole for mounting a semiconductor part, such as a power semiconductor element, etc., comprising an other part 1, a substrate 4, a heat radiating plate 5, a main terminal 2 and a control terminal 3, and sealing them with a resin 7, a resin sealing type power semiconductor module structure of low cost and high reliability is achieved. In a molding die, etc., using a structure in which a heat resistant adhesive tape 26 and a flexible material, etc., are provided at a terminal inserting part of an upper die 20, or using a dam part for terminal parts 2 and 3, the resin sealing type power semiconductor module structure of low cost and high reliability is achieved. Further, in the case where the main terminal 2 part employs screwing connection, it is easily integrated with a sealing resin by using a screw part, thereby achieving the resin sealing type power semiconductor module structure of low cost and high reliability.

48. 发明专利

JPH08335599A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08335599A
公开(公告)日：1996-12-17
申请号：JP19180196
申请日：1996-07-22
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , KANEDA AIZO , TSUNODA SHIGEHARU , YOSHIDA ISAMU , NISHI KUNIHIKO
IPC分类号： B29C45/26 , B29C45/02 , H01L21/56 , H01L23/50
摘要： PURPOSE: To utilize resin efficiently and equalize pressures in the flow paths of a mold by a method wherein the resin is suuplied from one cavity to the other through resin flow paths which are provided in the parts of a lead frame. CONSTITUTION: Chips 13 are mounted on a lead frame 11 at the positions corresponding to the insides of a first cavity 5, a second cavity 7 and a third cavity 9 and the chips 13 are connected to the lead frame 11 with gold wires 14. An upper mold 12 and a lower mold 1 are closed. Plungers 17 are attached to the rod 15 of a molder with a rigid connection plate 16. Resin is cast into pots 2. By making the rod 15 of the molder descend, the plungers 17 which are linked with the rod 15 with the rigid connection plate 16 are also made to descend in the pots 2. The plungers 17 transfer the resin through pot linking flow paths 10 and runners 3 to fill the gates and cavities provided on the tips of the runners 3 with the resin. With this constitution, both the productivity and the product quality of a resin-molded semiconductor device can be improved significantly.

49. 发明专利

JPH07273246A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH07273246A
公开(公告)日：1995-10-20
申请号：JP2209795
申请日：1995-02-09
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , YOSHIDA ISAMU , OJI KAZUYA , HONDA MICHIHARU , KITANO MAKOTO , YONEDA NAE , EGUCHI KUNIYUKI , NISHI KUNIHIKO , ANJO ICHIRO , OTSUKA KENICHI
IPC分类号： B29C33/40 , B29C45/34 , B29C45/37 , H01L21/56 , H01L23/12 , H01L23/28
摘要： PURPOSE:To provide a method of manufacturing a BGA package structure excellent in productivity. CONSTITUTION:Semiconductor parts such as an IC chip 1, a board 2, and others are supported as fixed with a support frame 5 and others. These components are sealed up with a resin 14. Discrete parts and a board having projections with cured rubber resin or a releasing material formed by attaching releasing agent to the surface of electrodes are provided besides a molding die. The components are sealed up with resin, whereby a package is improved in reliability and enhanced in heat radiating efficiency. Furthermore, a semiconductor device of this constitution is capable of easily coping with a case that a large number of pins are provided to it, and a molding process can easily be automated or reduced in number of operators, so that a resin-sealed BGA package stable in productivity and high in reliability can be obtained at a low cost. Moreover, by the use of this molding die structure, a BGA package of this constitution can be protected against voids and resin burrs generated on the surface of a substrate electrode.

50. 发明专利

JPH07205144A MANUFACTURE OF TABLET 失效
公开(公告)号：JPH07205144A
公开(公告)日：1995-08-08
申请号：JP557394
申请日：1994-01-24
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , YOSHII MASAKI
IPC分类号： B29B9/10 , B29C43/18 , B29C45/00 , B29K63/00 , B29L31/34 , H01L21/56
摘要： PURPOSE:To continuously mold a tablet of high quality by mixing resin powder, melting and kneading it while heating by a heating cylinder, and injecting the kneaded resin to a tablet mold. CONSTITUTION:Resin powder 1 is supplied to a hopper 2, and always agitated by an agitating screw 8 while holding fluidity. The powder is dropped on a constant quantity supply unit 3, fed by a feeding screw 9, and quantitatively supplied into heating cylinder 4. The powder 1 is heated to be melted, a resin reservoir 10 is formed at a front part of the cylinder 4 while being kneaded by a screw 6, and metered in a predetermined quantity. The cylinder 4 in which the reservoir 10 is formed and completely metered is advanced and brought into contact with molds 7, melted resin 5 in the reservoir 10 is injected in the molds 7, and fed to a cavity of the molds 7 to a tablet. Accordingly, since the resin 1 is molded in a tablet in a state near liquid, the tablet can be enhanced in its density, and a shape accuracy is improved by high pressure molding.

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