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1. 发明专利

JPH08197280A SOLDER FOIL FOR PACKAGING MULTI TERMINAL FACE 失效
公开(公告)号：JPH08197280A
公开(公告)日：1996-08-06
申请号：JP662895
申请日：1995-01-19
申请人： HITACHI LTD
发明人： YAMAMOTO KENICHI , SOGA TASAO , ISHIDA TOSHIHARU , SHIMOKAWA HIDEYOSHI , NAKATSUKA TETSUYA , SERIZAWA KOJI , HONDA MICHIHARU , NISHI KUNIHIKO
IPC分类号： B23K35/26 , H01L21/60 , H01L23/12 , H05K3/34 , H01L21/321
摘要： PURPOSE: To provide a multi terminal packaging solder foil which can easily and integrally form a solder bump in an uniform height on a grid alley package, and can realize batch connection of a substrate having grid alley terminals or the LSI package. CONSTITUTION: In a multi terminal face packaging solder foil 4 which has plural holes formed in a grid alley like and fusion parts between respective holes and which is separated at the fusion part 6 by the surface tension of the solder and the wetting, expanding force an each mounted terminal, in progress of heating and melting, the solder foil is a Pb-Sn-Bi base, and the composition is ranged in 48wt.%

2. 发明专利

JPH08115916A METHOD OF FORMING SOLDER BUMP 失效
公开(公告)号：JPH08115916A
公开(公告)日：1996-05-07
申请号：JP24906794
申请日：1994-10-14
申请人： HITACHI LTD
发明人： SAKATA TOMOAKI , SUZUKI TAKAMICHI , ODAJIMA HITOSHI , TANAKA KATSUHISA , MURASE TOMOHIKO , INOUE KOSUKE , HONMA HIROSHI , HONDA MICHIHARU
IPC分类号： H01L21/60 , H05K3/34 , H01L21/321
摘要： PURPOSE: To form an inexpensive solder bump without a chip by sucking a solder ball by vacuum from the rear of a mask when making the mask adsorb the solder ball, and also, adding force in the direction orthogonal to the direction the vacuum suction to the solder ball in the vicinity of an installation hole so as to agitating it. CONSTITUTION: Solder balls 16 are placed in holes 3 of an a line-up jig 1. Vacuum suction 20 is performed while giving agitation force 21 to the solder balls 16b within a cover 8 by air flow, and the solder balls 16 are put in order in the holes 3. Vacuum suction 18 is connected, and a line-up jig 1 is inverted, and solder balls 18 are retained downward and carried to a liquid storage container 40, and the tip of the solder ball 16 is soaked in fixing liquid 43. The solder balls 16 wetted with the fixing liquid 43 are positioned to terminals 51. The vacuum suction 18 of a hose 7 is changed over to air blow 52. The transcription onto a terminal electrode 51 of solder balls 16 is terminated. A solder bump 53 is made by fusing the solder ball 16.

3. 发明专利

JPH0864947A SOLDER SUPPLY METHOD AND DEVICE 失效
公开(公告)号：JPH0864947A
公开(公告)日：1996-03-08
申请号：JP20209394
申请日：1994-08-26
申请人： HITACHI LTD
发明人： AMANO YASUO , HONDA MICHIHARU , KAWAKAMI NOBORU
IPC分类号： C23C26/00 , H01L23/12 , H01L23/50 , H05K3/06 , H05K3/34
摘要： PURPOSE: To provide a solder supply method capable of corresponding to the mounting of high-density electronic parts. CONSTITUTION: Flux 6 is attached to a lead 2 by a stamping method in which a lead 2 of LSI1 is placed on thin film y flux 6 formed on a plate. In succession, by utilizing this adhesion of the flux, solder powder 7 is attached to the lead 2. It is placed as it were on a plate 8 having good heat conduction, and the plate is heated from its bottom side with a heating block 9 and the solder is melted. After melting, the heating block 9 is separated from the plate 8 and cooled by cooling air 10 and the older is hardened.

4. 发明专利

JPH07273246A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH07273246A
公开(公告)日：1995-10-20
申请号：JP2209795
申请日：1995-02-09
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , YOSHIDA ISAMU , OJI KAZUYA , HONDA MICHIHARU , KITANO MAKOTO , YONEDA NAE , EGUCHI KUNIYUKI , NISHI KUNIHIKO , ANJO ICHIRO , OTSUKA KENICHI
IPC分类号： B29C33/40 , B29C45/34 , B29C45/37 , H01L21/56 , H01L23/12 , H01L23/28
摘要： PURPOSE:To provide a method of manufacturing a BGA package structure excellent in productivity. CONSTITUTION:Semiconductor parts such as an IC chip 1, a board 2, and others are supported as fixed with a support frame 5 and others. These components are sealed up with a resin 14. Discrete parts and a board having projections with cured rubber resin or a releasing material formed by attaching releasing agent to the surface of electrodes are provided besides a molding die. The components are sealed up with resin, whereby a package is improved in reliability and enhanced in heat radiating efficiency. Furthermore, a semiconductor device of this constitution is capable of easily coping with a case that a large number of pins are provided to it, and a molding process can easily be automated or reduced in number of operators, so that a resin-sealed BGA package stable in productivity and high in reliability can be obtained at a low cost. Moreover, by the use of this molding die structure, a BGA package of this constitution can be protected against voids and resin burrs generated on the surface of a substrate electrode.

5. 发明专利

JPH04196388A ELECTRONIC COMPONENT MOUNTING DEVICE 失效
公开(公告)号：JPH04196388A
公开(公告)日：1992-07-16
申请号：JP32277590
申请日：1990-11-28
申请人： HITACHI LTD
发明人： SATO ISAO , YOSHINAGA SHIGESHI , HONDA MICHIHARU
IPC分类号： H05K3/34
摘要： PURPOSE:To prevent an electronic component mounted on a printed board from deviating from a land by a method wherein the vicinity of the lead terminals of an electronic component positioned on the land which is printed with solder paste is separately irradiated with a light beam emitted from a radiation heating unit, and the lead terminals are tentatively heated. CONSTITUTION:An infrared beam emitted from a heat source lamp 7 is converged by an elliptical mirror 8, and the converged light beam is guided to the vicinity of a suction head 12 of an electronic component mounting device through a optical fiber 9. When an electronic component is positioned on a land 6 formed by printing solder paste 3,a light beam irradiates a part of the vicinity of lead terminals 13 to heat solder paste up to a preheating temperature (generally, 150 deg.C) or below in a non-contact manner. As mentioned above, components are separately, tentatively fixed to a board at the same time when they are mounted, so that electronic components are prevented from getting out of position due to vibration or shock generated at the mounting of components or at the transfer of a board.

6. 发明专利

JPH04127964A SOLDER SUPPLYING SHEET 失效
公开(公告)号：JPH04127964A
公开(公告)日：1992-04-28
申请号：JP24969090
申请日：1990-09-19
申请人： HITACHI LTD
发明人： AOMORI KOKICHI , HONDA MICHIHARU
IPC分类号： B23K3/00 , B23K3/06 , H05K3/34
摘要： PURPOSE:To decrease the fluctuations in the amt. of the solder to be supplied to pad parts by forming thin-film patterns meeting the shapes of the pad parts mounted with surface packaging parts on the main surface of the solder supplying sheet. CONSTITUTION:The parts 6 of a package 7 are removed to expose the pads 8 for mounting the parts. An adhesive 9 for adhering the pads 8 and the patterns 3 on the supplying sheet 1 is applied on the pads 8 of the package 7. Further, the patterns 3 of the solder supplying sheet 1 are superposed on the pads 8 of the package 7 and are press welded under heating by a heat tool 10; thereafter, the heat tool 10 is detached. The patterns 3 are supplied on the pads 8 by detaching a base film after the temp. of the solder supplying sheet 1 and the package 7 fall.

7. 发明专利

JPH03255935A METHOD AND INSTRUMENT FOR MEASURING VISCOELASTICITY OF PASTE 失效
公开(公告)号：JPH03255935A
公开(公告)日：1991-11-14
申请号：JP5361590
申请日：1990-03-07
申请人： HITACHI LTD
发明人： HONDA MICHIHARU
IPC分类号： G01B21/32 , G01N19/04
摘要： PURPOSE:To allow the quantitative recognition of the viscoelastic properties of solder paste by measuring the compressive load curve of a probe by compressing-stopping-pulling actions on a test plate printed with the paste at a prescribed diameter and thickness. CONSTITUTION:A load converter 15 of both compressing and pulling types of a strain gage system and a lifting machine 16 thereof as well as a driving control section 17 thereof, a direction changing section 18 of the lifting machine 16, and a bench 20 for fixing a sample are integrated to a device housing 21. A sample plate 29 printed with the solder paste 28 is held on the bench 20 and is lowered at a specified speed set with the lifting machine 16 to compress the paste 28. The compressing is stopped at the prescribed compressive load value and thereafter, the lowering is changed to ascending by the direction changing section 18. The voltage or load value outputted in the process of compressing-stopping-ascending is recorded or stored. The quantitative recognition of the viscoelastic behavior of the paste 28 is executed in this way and the contribution to the improvement in the paste performance is made.

8. 发明专利

JPH0364095A HEATING FURNACE 失效
公开(公告)号：JPH0364095A
公开(公告)日：1991-03-19
申请号：JP20081389
申请日：1989-08-01
申请人： HITACHI LTD , KOKI KK
发明人： HACHIYA TOSHIHIRO , HONDA MICHIHARU , SATO KAORU , IMAI KYOJI
IPC分类号： B23K1/008 , B23K3/04 , F27B9/40 , H05K3/34
摘要： PURPOSE:To eliminate excessive or insufficient solder melting by measuring a temperature distribution reaching in a preheating zone before a preheating final zone immediately before the melting zone of solder, and heating by predetermined stopping if the distribution is insufficient. CONSTITUTION:A conveyor 2 for conveying a printed board from a first preheating zone A to a cooling zone E is provided at a heating furnace body 1. The first and second preheating zones A, B are composed of a blowing fan 3 and a heater 4, and fan heaters 5, 6 are provided at a third preheating final zone C and a melting zone D. A temperature detection signal of a printed board 7 measured by a temperature sensor 17 is processed by a microcomputer. The conveyor 2 and a carrier 9 conveying motor are stopped until the temperatures in the zone C and the board 7 fall within a predetermined temperature difference, and the conveyor 2 and the carrier 9 are conveyed by a signal in which the temperature difference falls within a predetermined value.

9. 发明专利

JPH02139990A METHOD AND APPARATUS FOR SOLDERING 失效
公开(公告)号：JPH02139990A
公开(公告)日：1990-05-29
申请号：JP29337688
申请日：1988-11-19
申请人： HITACHI LTD
发明人： SATO ISAO , HONDA MICHIHARU , WATABE TAKEYASU
IPC分类号： H05K3/24 , H05K3/34
摘要： PURPOSE:To apply flux uniformly and stably by a method wherein a flux coating stabilizer which controls the temperature of a printed board to be the optimum temperature for soldering is provided in a pre-stage. CONSTITUTION:When a substrate temperature is low, a flux coating stabilizer 10 composed of a temperature control blower 11 which is equipped with a heater for blowing out temperature-controlled hot air and a panel heater 12 is driven to heat a printed board. When the substrate temperature is high, the temperature control blower 11 which is also equipped with a cooler blowing out temperature-controlled cold air is driven to cool the printed board by switching. The printed board whose substrate temperature is controlled to be the optimum temperature by the flux coating stabilizer 10 like this is coated with bubbling flux 3 by a bubbling flux coater 7 and, after pre-heated by a pre-heater 8, transferred to a solder bath 9.

10. 发明专利

JPS62267065A METHOD AND DEVICE FOR CONTROLLING SOLDER JET WAVE HEIGHT 失效
公开(公告)号：JPS62267065A
公开(公告)日：1987-11-19
申请号：JP10841786
申请日：1986-05-14
申请人： HITACHI LTD
发明人： SATO ISAO , HONDA MICHIHARU
IPC分类号： B23K1/08 , B23K3/06 , H05K3/34
摘要： PURPOSE:To enable the control of a solder jet wave height in high accuracy to the set wave height and prevent a soldering defect by making the wave height cross section of the solder jet jetted from a jet nozzle in a visible image and measuring the wave height of the solder jet from the visible image. CONSTITUTION:With driving a jet pump 4 by a pump speed control mechanism 9 the molten solder 2 inside a solder tank 1 is forcibly fed, jetting from a jet nozzle 3. The wave height 7 of the solder jet 6 of the solder 2 is adjusted by controlling the revolutions of the pump 4. The solder jet wave height cross section of the solder 2 is reflected on a heat resistant transparent plate 5 and made in a visible image. The solder jet wave height 7 can correctly be measured with non-contact by an image sensor 13 from the solder jet wave height cross section reflected on the transparent plate 5. The measured data 14 thereof is fed to a data processing means 16 and inputted into CPU16 by performing A/D conversion. The CPU16 compares with the set wave height decided in advance, outputting the deviation value 20 thereof to a pump speed mechanism 9.

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