PROBLEM TO BE SOLVED: To improve the moisture resistance reliability and prevent the package crack from being developed by sealing with an org. material the front surface of a package and IC chip with part of a support frame exposed and back side of a circuit board exposed; the frame fixing and supporting the board. SOLUTION: A BGA package has an IC chip, laminate circuit board 2 having leading electrodes 3 and metal bumps to be outer electrodes bonded to the electrodes 3 on a mounting surface and support frame for fixing it. The support frame has a board-fixing frame 7 having through-holes 8 at parts to be adhered to the circuit board 2 with adhesives 13. The top and side face of the board 2 mounting the IC chip is sealed with a resin 12 to protect, with leaving the tops of the through-holes 8 exposed on the board-fixing frame 7. Thus, the water content in the adhesives 13 is quickly removed through the through-holes 8.