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41. 发明专利

JP4401834B2 Exposure apparatus and alignment method 有权
公开(公告)号：JP4401834B2
公开(公告)日：2010-01-20
申请号：JP2004084615
申请日：2004-03-23
申请人：株式会社アドテックエンジニアリング
发明人：本一範橋
IPC分类号： G01B11/00 , G03F9/00 , G03F7/00 , H05K3/00

42. 发明专利

JP4308351B2 Exposure apparatus and exposure method 有权
公开(公告)号：JP4308351B2
公开(公告)日：2009-08-05
申请号：JP35442098
申请日：1998-12-14
申请人：株式会社アドテックエンジニアリング
发明人：宮勝也三 , 川渉中 , 田良一井
IPC分类号： G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a drive are an exposure method in which no foreign matter sticks to be exposed on a mask, to suppress generation of defects in exposure, and without possibility of possibility the mask surface being flawed. SOLUTION: A protective film 1 is interposed between a film mask F and a substrate K and taken out by a take-up roll 3 each time exposure is carried out to interpose the protection film 1 which is always clean between the film mask F and substrate K. This protective film 1 prevents resist and foreign matter of the substrate K from sticking on the side of the film mask F, thereby preventing a defects in exposure from being generated.

43. 发明专利

JP2009109553A Exposure apparatus and correcting device for substrate 有权
标题翻译：曝光装置和基板校正装置
公开(公告)号：JP2009109553A
公开(公告)日：2009-05-21
申请号：JP2007278850
申请日：2007-10-26
申请人： Adtec Engineeng Co Ltd , 株式会社アドテックエンジニアリング
发明人： HARA TAKAYUKI
IPC分类号： G03F7/20
摘要： PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of correcting warpage or distortion of a substrate for print wiring. SOLUTION: A packing 3 is stretched by applying a positive pressure and brought into contact with an exposure table 1 to generate a sealed space 90; the sealed space 90 is vacuumed up by a vacuum suction hole 40 and a vacuum pump 4; and a plate 20 is pressed by the atmospheric pressure to apply load on a substrate 99 by the plate 20 and the exposure table 1 to correct the substrate 99. After the substrate suction pressure by the suction pump 11 reaches a prescribed setting, the vacuum pump 4 is stopped; the packing 3 is shrunk; a conveyance device 2 is retracted onto a carrying in conveyer 53; and exposure is carried out. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够校正用于印刷布线的基板的翘曲或变形的曝光装置。解决方案：通过施加正压拉伸填料3并与曝光台1接触以产生密封空间90; 密封空间90由真空抽吸孔40和真空泵4抽真空; 并且通过大气压力压板20，通过板20和曝光台1对基板99施加负载以校正基板99.在抽吸泵11的基板吸入压力达到规定的设定值之后，真空泵 4停了包装3收缩; 输送装置2缩回到输送机53的输送机构上; 并进行曝光。版权所有（C）2009，JPO＆INPIT

44. 发明专利

JP2009092723A Double-sided exposure apparatus 审中-公开
标题翻译：双面曝光装置
公开(公告)号：JP2009092723A
公开(公告)日：2009-04-30
申请号：JP2007260580
申请日：2007-10-04
申请人： Adtec Engineeng Co Ltd , 株式会社アドテックエンジニアリング
发明人： ASAMI MASATOSHI
IPC分类号： G03F7/20 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a double-sided exposure apparatus capable of exposing both of top and back faces of a substrate under the same exposure conditions without requiring complicated adjustment or control. SOLUTION: The light from a light source lamp 10 is condensed by an elliptical mirror 11, made to return by a reflection mirror 12, focused at a fly-eye lens 13, split into reflected light and transmitted light by a spectral mirror 20, controlled for the luminous energy by a light source shutter 21, reflected by a collimation mirror 3 to produce parallel beams, and transmitted through a photomask 51 and a photomask 52 to irradiate top and back sides of a substrate 50. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在相同的曝光条件下能够曝光基板的顶面和背面的双面曝光装置，而不需要复杂的调节或控制。解决方案：来自光源灯10的光被椭圆镜11聚光，由反射镜12返回，聚焦在飞眼透镜13处，分成反射光并通过光谱镜透射光 20，由光源快门21控制，由准直镜3反射以产生平行光束，并通过光掩模51和光掩模52透射以照射基板50的顶侧和背面。（C）2009，JPO＆INPIT

45. 发明专利

JP4212094B2 Exposure device 有权
公开(公告)号：JP4212094B2
公开(公告)日：2009-01-21
申请号：JP2003101068
申请日：2003-04-04
申请人：株式会社アドテックエンジニアリング
发明人：谷川幸司長
IPC分类号： G03F7/20 , H05K3/00

46. 发明专利

JP2008051727A Trace type circuit board inspection device 有权
标题翻译：跟踪型电路板检查装置
公开(公告)号：JP2008051727A
公开(公告)日：2008-03-06
申请号：JP2006230020
申请日：2006-08-28
申请人： Adtec Engineeng Co Ltd , 株式会社アドテックエンジニアリング
发明人： KOBAYASHI MITSUAKI , FURUMI TADASHI , SHIMIZU TOMOHISA , HIKI TATSUYA
IPC分类号： G01R31/02 , G01R31/28 , G02F1/13 , G02F1/1343 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a trace type circuit board inspection device capable of preventing unsymmetric wearing of electrodes.
SOLUTION: When a contact I and a contact N are set on and other contacts are set off, the current from a constant-current source 31 will flow through the contact I, a needle 11, a circuit pattern 51, a needle 13, and the contact N, and the polarity of the needle 11 is positive, while the polarity of the needle 13 is set negative. A voltage measuring instrument 36 measures the voltage between the needle 11 and the needle 13, and a determination device 4 determines normality or abnormality. When a contact M and a contact J are set on and other contacts are set off, the current from the constant-current source 31 will flow through the contact M, the needle 13, the circuit pattern 51, the needle 11, and the contact J, and the polarity of the needle 13 is positive, while the polarity of the needle 11 is set negative. Change in polarity to a switch matrix 2 is performed by a command from a controller 5, in response to the instructions or other commands from an operator.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够防止电极不对称磨损的迹线型电路板检查装置。
解决方案：当触点I和触点N置于其他触点上时，来自恒流源31的电流将流过触点I，针11，电路图案51，针 13，触点N，针11的极性为正，针13的极性为负。电压测量装置36测量针11和针13之间的电压，并且确定装置4确定正常或异常。当触点M和触点J被置于其他触点上时，来自恒流源31的电流将流过触点M，针13，电路图形51，针11和触头 J，针13的极性为正，而针11的极性设定为负。响应于来自操作者的指令或其他命令，通过来自控制器5的命令来执行对开关矩阵2的极性的改变。版权所有（C）2008，JPO＆INPIT

47. 发明专利

JP2008016758A Marking apparatus in manufacturing multi-layer circuit board 审中-公开
标题翻译：制造多层电路板的标记装置
公开(公告)号：JP2008016758A
公开(公告)日：2008-01-24
申请号：JP2006188972
申请日：2006-07-10
申请人： Adtec Engineeng Co Ltd , 株式会社アドテックエンジニアリング
发明人： NAKAGAWA WATARU
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K3/4679 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/064 , H05K3/4652 , H05K2201/0969 , H05K2201/09781 , H05K2201/09918
摘要： PROBLEM TO BE SOLVED: To provide a marking apparatus which efficiently forms an alignment mark for accurately aligning layers in manufacturing a multi-layer circuit board.
SOLUTION: Reference marks 50, 51 formed on a core substrate 60 of a substrate 5 are image-formed on a fluorescent plate 12 by being irradiated with X rays from an X-ray generator 11, and this is imaged by a visible light CCD camera 13 to simultaneously detect positions of the reference marks 50, 51. With the detected positions of the reference marks 50, 51 as criteria, ultraviolet rays are radiated from mirrors 22, 23 onto a dry film resist layer 55, and marks drawn on photo-masks 24, 25 are printed on the dry film resist layer 55.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在制造多层电路板时有效地形成用于精确对准层的对准标记的标记装置。解决方案：通过用X射线发生器11的X射线照射在基板5的芯基板60上形成的参考标记50,51在荧光板12上成像，并且通过可见光光CCD摄像机13同时检测参考标记50,51的位置。以参考标记50,51的检测位置作为标准，将紫外线从反射镜22,23辐射到干膜抗蚀剂层55上，光掩模24,25印刷在干膜抗蚀剂层55上。版权所有（C）2008，JPO＆INPIT

48. 发明专利

JP2007254030A Film peeling-off device 审中-公开
标题翻译：薄膜剥离装置
公开(公告)号：JP2007254030A
公开(公告)日：2007-10-04
申请号：JP2006076622
申请日：2006-03-20
申请人： Adtec Engineeng Co Ltd , 株式会社アドテックエンジニアリング
发明人： IGARASHI AKIRA
IPC分类号： B65H41/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a film peeling-off device not generating the folding and bending of the end of a board during peeling off a film. SOLUTION: After auxiliary peeling-off is performed by an auxiliary peeling-off device 4, when an exposed part 91 comes at the tip of a clamp part 10, the feeding of a printed wiring board 90 is stopped and the exposed part 91 is clamped by the clamping part 10. A slide part 11 for retaining the clamp part 10 is slid in a conveying direction, an adhesion roller 2 is rotated to stick a film 93, and the tip of the film 93 is peeled off. Further, the gripping of the exposed part 91 is released, a conveying roller 55 is driven, and the adhesion roller 2 is also rotated and driven to continue the peeling-off of the film 93. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在剥离膜时不产生板的端部的折叠和弯曲的膜剥离装置。解决方案：辅助剥离装置4执行辅助剥离之后，当暴露部分91进入夹紧部分10的末端时，停止印刷线路板90的馈送，并且暴露部分 91由夹持部10夹持。用于保持夹持部10的滑动部11沿输送方向滑动，粘合辊2旋转以粘贴膜93，并且膜93的前端被剥离。此外，释放暴露部分91的夹持，驱动输送辊55，并且粘合辊2也被旋转和驱动以继续剥离膜93.版权所有（C）2008， JPO＆INPIT

49. 发明专利

JP3802309B2 The alignment device and exposure device in the multi-layer circuit board manufacturing 有权
公开(公告)号：JP3802309B2
公开(公告)日：2006-07-26
申请号：JP2000087927
申请日：2000-03-28
申请人：株式会社アドテックエンジニアリング
发明人：宮勝也三 , 田良一井 , 瀬克己百 , 田道知行
IPC分类号： G03F7/20 , H05K3/46 , B23K26/00 , B23K26/02 , B23K26/38 , B23K101/42 , G03F9/00 , H05K1/02 , H05K3/00
CPC分类号： H05K3/4679 , G03F9/00 , G03F9/7076 , G03F9/7084 , H05K1/0269 , H05K3/0008 , H05K3/0082 , H05K3/4652 , H05K2201/09918
摘要： The Xray irradiation device 1 issues Xrays to board mark 7 and projects the image of the board mark 7 on the fluorescence screen 3, the fluorescence face 39 of which visibly displays the image of the board mark 7 that can be captured by the CCD camera 2. The CCD camera 2 images the board mark 7 and the mask mark 5 depicted on the photo mask 4 overlapping together. The board 6 and the photo mask 4 are aligned by exposure stage 8 so as to the board mark 7 and the mask mark 5 coincide.

50. 发明专利

JP3643572B2 Projection exposure apparatus and alignment device 有权
公开(公告)号：JP3643572B2
公开(公告)日：2005-04-27
申请号：JP2002158614
申请日：2002-05-31
申请人：株式会社アドテックエンジニアリング
发明人：林洋一平 , 本徳嘉松
IPC分类号： G01B11/00 , G03F7/20 , G03F9/00 , H01L21/027
CPC分类号： G03F9/7088 , G03F9/7011 , G03F9/7019 , G03F9/7065

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