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    • 13. 发明专利
    • Manufacture of semiconductor by organic metal vapor growth method
    • 有机金属蒸汽生长法制备半导体
    • JPS5975622A
    • 1984-04-28
    • JP18702582
    • 1982-10-25
    • Nippon Sanso Kk
    • UMENO MASAYOSHISAKAI SHIROU
    • H01L31/04C23C16/30C23C16/44C30B25/02H01L21/205
    • C23C16/301C23C16/4404H01L21/02546H01L21/0262
    • PURPOSE:To produce heterogeneous surface bonding of high performance by efficient removal of trace amount of oxygen or water content remained in the gas pipe or contained in the air or the material gas entering into by leakage by purging with aluminum alkyl supplied for supplying pipes of various material gas and for an oven heated up to a specified temperature. CONSTITUTION:Trimethylaluminum is introduced into a gas pipe and an oven where temperature is kept at 70-300 deg.C, more preferably 100-150 deg.C, and then hydrogen gas is introduced to cleanse said pipe and oven. After that the temperature is raised up to predetermined crystal growth temperature, approximate 800 deg.C and a material gas desired according to a crystal to be grown in the same way as in conventional method is introduced into an oven F with being accompanied by hydrogen gas properly. When trimethylaluminum is introduced into the pipes and the oven F in advance of crystal growth operation as described above, trimethylaluminum adheres to walls of the pipes and the oven F so that oxygen and water content contained in various material gas flowing in the pipes or the oven after said introduction take place furious reaction with residual trimethylaluminum and are continuously removed. Consequently crystal growth is made excellently and elements of higher performance are obtained.
    • 目的:通过有效去除气体管道中残留的痕量氧气或水分含量,或通过用供应各种管道的管道的烷基铝的净化而被空气或通过泄漏进入的材料气体,产生高性能的异质表面粘合 材料气体和加热到指定温度的烘箱。 构成:将三甲基铝引入气体管道和温度保持在70-300℃,更优选为100-150℃的烘箱中,然后引入氢气以清洁所述管道和烘箱。 之后,将温度提高到预定的晶体生长温度,将大约800摄氏度,按照与常规方法相同的方式生长的根据晶体所需要的材料气体被引入到伴随有氢气的烘箱F中 正常。 当三甲基铝在如上所述的晶体生长操作之前被引入管道和烘箱F中时,三甲基铝粘附到管道和炉子F的壁上,使得在管道或烤箱中流动的各种原料气体中含有的氧气和水分含量 在引入后,与残留的三甲基铝发生激烈反应,并连续除去。 因此,晶体生长得到了很好的提高,并且获得了更高性能的元件。