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    • 7. 发明公开
    • Method of manufacturing a MESFET
    • 赫尔斯特朗·赫斯特伦
    • EP0718877A3
    • 1997-01-15
    • EP95120152.4
    • 1995-12-20
    • MURATA MANUFACTURING CO., LTD.
    • Yoshida, Kazuhiro
    • H01L21/338H01L21/285
    • H01L29/66863H01L21/0272H01L21/28587Y10S148/10Y10S438/948
    • A semiconductor device manufacturing method with which a GaAs MESFET and an integrated circuit using the same can be manufactured cheaply and with high yield by accurately forming a mushroom-shaped gate electrode with inexpensive equipment and a short process. The method includes the steps of: depositing a first mask layer 16 on a semiconductor substrate; forming an opening 16a in the first mask layer 16; causing the first mask layer 16 to flow by heat-treating the semiconductor substrate; depositing a second mask layer 17 on the first mask layer; forming in the second mask layer 17 an opening 17a larger than the opening 16a in the first mask layer 16 and exposing the opening 16a in the first mask layer 16; and forming a gate electrode 19 in the opening 17a in the second mask layer 17.
    • 可以通过以便宜的设备和短的工艺精确地形成蘑菇状栅电极,能够廉价地制造GaAs MESFET和使用该GaAs MESFET的集成电路的半导体器件制造方法。 该方法包括以下步骤:在半导体衬底上沉积第一掩模层16; 在第一掩模层16中形成开口16a; 通过热处理半导体衬底使第一掩模层16流动; 在第一掩模层上沉积第二掩模层17; 在第二掩模层17中形成大于第一掩模层16中的开口16a的开口17a,并暴露第一掩模层16中的开口16a; 并在第二掩模层17的开口17a中形成栅电极19