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1. 发明公开

EP3100598A1 ELEKTRONIKKARTE ZUR STEUERUNG EINER ELEKTRISCHEN MASCHINE 审中-公开
标题翻译：电子板控制的电机
公开(公告)号：EP3100598A1
公开(公告)日：2016-12-07
申请号：EP14805566.8
申请日：2014-11-27
申请人： Robert Bosch GmbH
发明人： MEYER, Christian
IPC分类号： H05K3/28 , G01D11/24
CPC分类号： H05K3/281 , G01D11/245 , H05K2201/0125 , H05K2201/0195 , H05K2201/10189 , H05K2201/10295 , H05K2203/085
摘要： The invention relates to an electronic card (10) for controlling an electric machine (12), electric machine (12) comprising said type of electronic card (10), in addition to a method for producing said type of electronic card (10) comprising a printed circuit board (14) with electric components (16) which are in contact with the printed circuit board (14), a plug (18) which is secured to the printed circuit board (14) and forms a common electric plug contact (20). Said printed circuit board (14) with components (16) and preferably the plug contacts (20), and an end piece (21) of the plug (18), facing the printed circuit board (14), are coated with a protective film (22).

2. 发明公开

EP3042979A1 MULTILAYER THIN FILM, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC PRODUCT INCLUDING THE SAME 审中-公开
标题翻译：维多利亚州DÜNNFILM，VERFAHREN ZUR HERSTELLUNG DAVON UND ELEKTRONISCHES PRODUKT DAMIT
公开(公告)号：EP3042979A1
公开(公告)日：2016-07-13
申请号：EP15200046.9
申请日：2015-12-15
申请人： Samsung Electronics Co., Ltd
发明人： CHO, Jin Hyun , YOO, Hyong Jun , LEE, Seo Joon , JUNG, Min Chul , JUNG, Hyun Jun
IPC分类号： C23C14/35 , C23C14/00 , C23C14/20 , C23C14/06 , C23C14/08 , H05K5/02 , C23C28/00 , H04M1/02
CPC分类号： H05K3/46 , C23C14/0015 , C23C14/0042 , C23C14/0641 , C23C14/08 , C23C14/205 , C23C14/34 , C23C14/352 , C23C28/322 , C23C28/34 , C23C28/345 , H04M1/0283 , H05K3/0041 , H05K2203/085 , H05K2203/095
摘要： A multilayer thin film and a method of depositing a multilayer thin film on a surface of a product is provided. The multilayer thin film includes a first layer including a non-conductive material coupled to an object, a second layer including a metallic material coupled to the first layer, and a third layer including a non-conductive material coupled to the second layer.
摘要翻译：提供多层薄膜和在产品表面上沉积多层薄膜的方法。多层薄膜包括第一层，包括耦合到物体的非导电材料，第二层包括耦合到第一层的金属材料，第三层包括耦合到第二层的非导电材料。

3. 发明公开

EP2949415A1 HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD 有权转让
标题翻译：热粘合装置和热粘合制品的制造方法
公开(公告)号：EP2949415A1
公开(公告)日：2015-12-02
申请号：EP14743722.2
申请日：2014-01-09
申请人： Origin Electric Company, Limited
发明人： MATSUDA,Jun , SUZUKI,Takayuki , KURODA,Masami
IPC分类号： B23K1/008 , B23K1/00 , B23K3/04 , H05K3/34 , B23K101/42
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K3/047 , B23K2201/42 , H05K2203/085
摘要： Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when cooling a workpiece after performing heat-bonding in a vacuum, target objects that were heat-bonded can be cooled in less time than with conventional devices and methods, without overheating the target objects. This heat-bonding device is provided with the following: a vacuum chamber (10) that contains the target objects (1) being heat-bonded and a buffer part (5); a heater (20) that heats the buffer part, which is disposed so as to contact the target objects in the vacuum chamber; a target-object temperature sensor (40) that detects the temperatures of the target objects, which are heated via the buffer part; a buffer temperature sensor (60) that detects the temperature of the buffer part; a vacuum breaker (70) that breaks the vacuum inside the vacuum chamber; and a control device (50) that activates the vacuum breaker, breaking the vacuum inside the vacuum chamber, if the difference between the temperatures detected by the target-object temperature sensor and the buffer temperature sensor falls to within a prescribed temperature-difference range.
摘要翻译：本发明提供一种极好的热粘合装置和热粘合物品的制造方法，其中当在真空中进行热粘合后冷却工件时，与传统的装置和方法相比，被热粘合的目标物体可以在更短的时间内冷却，而不会使目标物体过热。该热粘接装置具备：包含热粘接对象物（1）和缓冲部（5）的真空室（10）加热器（20），该加热器（20）加热所述缓冲部分，所述缓冲部分被设置成与所述真空室中的所述目标物体接触; 目标物体温度传感器（40），其检测经由缓冲部件加热的目标物体的温度; 检测缓冲部的温度的缓冲温度传感器（60）真空破坏器（70），其打破真空室内的真空; 以及控制装置（50），如果由所述目标物体温度传感器和所述缓冲温度传感器检测到的温度之间的差落在规定的温度差范围内，则所述控制装置（50）启动所述真空破坏器，破坏所述真空室内的真空。

4. 发明公开

EP2587900A1 JOINT STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM FOR SAME 有权
标题翻译：维也纳国家公民权利与政治权利国际公约“，”维也纳公民权利和政治权利国际公约“
公开(公告)号：EP2587900A1
公开(公告)日：2013-05-01
申请号：EP11800738.4
申请日：2011-06-24
申请人： Ayumi Industry Co., Ltd.
发明人： ABE, Hideyuki , MAWATARI, Kazuaki
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008 , B23K31/02 , H01L21/60 , B23K101/40 , B23K101/42
CPC分类号： B23K3/0607 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K1/206 , B23K3/04 , B23K3/082 , B23K31/02 , B23K35/38 , B23K2101/40 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/75101 , H01L2224/7515 , H01L2224/75272 , H01L2224/81002 , H01L2224/81011 , H01L2224/81014 , H01L2224/81019 , H01L2224/81054 , H01L2224/8109 , H01L2224/81193 , H01L2224/81211 , H01L2224/81805 , H01L2224/81815 , H01L2224/81907 , H01L2224/83104 , H01L2924/01322 , H05K3/305 , H05K3/3436 , H05K13/0465 , H05K2203/083 , H05K2203/085 , H05K2203/087 , Y02P70/613 , H01L2924/00012 , H01L2924/00014 , H01L2924/0105 , H01L2924/01047 , H01L2924/00
摘要： A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.
A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
摘要翻译：提供了能够减轻基板之间的位置偏移的焊接方法，即使可以省略去除焊剂的步骤。临时粘合剂55被施加到多个基板50a，50b上，并且加热器33加热基板，同时基板临时粘合在其间插入临时粘合剂55，并且在焊料54熔化之前或焊料54熔化之前，临时粘合剂55蒸发，并且基板50a，50b与焊料接合，熔融的焊料54插入其间。

5. 发明公开

EP2075993A1 A MOBILE TERMINAL PREVENTING TEMPERATURE RISING OF USER-SENSITIVE SURFACE 审中-公开
标题翻译：移动终端区域的温度升高，感觉用户，避免
公开(公告)号：EP2075993A1
公开(公告)日：2009-07-01
申请号：EP08773073.5
申请日：2008-07-01
申请人： Huawei Technologies Co., Ltd.
发明人： JIN, Linfang , WEI, Dong , WU, Guzheng
IPC分类号： H04M1/02
CPC分类号： H04M1/0277 , G06F1/203 , H04M1/0266 , H05K1/0201 , H05K1/181 , H05K2201/062 , H05K2203/085
摘要： A mobile terminal for preventing temperature increase of a user-sensitive surface, a display device, and a heat dissipating device for an electronic product based upon user satisfaction are provided. The mobile terminal for preventing temperature increase of a user-sensitive surface includes a user-sensitive surface and a printed circuit board (PCB), in which a heat-insulation layer is located between the user-sensitive surface and the PCB. The display device includes a display screen. A housing having a vacuum space is set on a back side of the display screen. Through the above technical solutions, the temperature of the user-sensitive surface is effectively controlled in usage, the user satisfaction is effectively increased, and the probability of complaints about heating is effectively lowered. The heat dissipating device for an electronic product based upon user satisfaction includes a thermal-conductive housing set surrounding a PCB and heat-generating components. A user contact area on the thermal-conductive housing is set with heat-insulation structures adapted to reduce the surface temperature of the area. In the embodiments of the present invention, through the heat-insulation structures set on the user contact area of the thermal-conductive housing and adapted to reduce the surface temperature of the area, a user's feeling about an excessively high surface temperature caused by heat transfer when he/she touches the electronic product with the heat dissipating device as a housing or a portion of the housing is alleviated. Meanwhile, the thermal-conductive housing inside the heat-insulation structures can serve as a heat dissipating device to effectively control the temperature increase of the heat-generating components and non-uniform surface temperature of the products.
摘要翻译：提供了用于防止用户敏感表面的温度上升，显示装置，和用于在基于用户的满意度的电子产品的散热装置的移动终端。一种用于防止用户敏感表面的温度增加的移动终端包括：用户敏感表面和印刷电路板（PCB），其中，一个热绝缘层位于所述用户敏感表面与PCB之间。该显示装置包括一个显示屏幕。具有真空空间的外壳被设置在显示屏幕的背面。通过上述技术方案，用户敏表面的温度在使用被有效的控制，用户的满意度被有效地增加，和投诉的关于加热的概率被有效地降低。在基于用户的满意度的电子产品的散热装置包括围绕PCB和发热部件的热传导性外壳集。热导电外壳上的用户接触面积被设定为angepasst减低区的表面温度的隔热结构。在本发明的实施例中，通过对热传导性外壳和angepasst的用户的接触面积设置隔热结构，以减少该区域的表面温度，用户的即将过高的表面温度的感觉由传热引起的当他/她触摸与所述散热装置作为壳体或壳体的一部分的电子产品被减轻。同时，隔热结构内的热传导性外壳可以用作散热装置来有效地控制发热部件和产品的不均匀的表面温度的温度上升。

6. 发明公开

EP2041782A1 METHOD OF TEMPORARILY ATTACHING A RIGID CARRIER TO A SUBSTRATE 审中-公开
标题翻译：程序临时固定用刚性载体上的衬底
公开(公告)号：EP2041782A1
公开(公告)日：2009-04-01
申请号：EP07799273.3
申请日：2007-07-03
申请人： The Arizona Board of Regents, A Body Corporate Acting on Behalf of Arizona State University
发明人： O'ROURKE, Shawn
IPC分类号： H01L21/50
CPC分类号： H01L24/89 , C09J5/06 , C09J2203/326 , C09J2205/302 , C09J2469/00 , H01L21/6835 , H01L23/4985 , H01L2221/68318 , H01L2221/68345 , H01L2221/6835 , H01L2224/80007 , H01L2224/80047 , H01L2224/8085 , H01L2224/80948 , H01L2924/0002 , H05K1/0393 , H05K3/007 , H05K3/386 , H05K2203/016 , H05K2203/083 , H05K2203/085 , H05K2203/1105 , Y10T29/49156 , H01L2924/00
摘要： Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.
摘要翻译：用于在基板临时固定到刚性载体方法描述了一种包括形成热分解性聚合物，E. G.，聚（亚烷基碳酸酯）的牺牲层，并且所述柔性基板接合到与定位在其间的牺牲层的刚性载体。电子元件和/或电路可随后被制造或其它半导体处理步骤中使用（E. G.背）上的贴合基板。一旦制造完成，基底可以从刚性载体通过加热组件以分解所述牺牲层分离。

7. 发明公开

EP1206325A4 VAPOR PHASE CONNECTION TECHNIQUES 审中-公开
标题翻译：连通气相
公开(公告)号：EP1206325A4
公开(公告)日：2006-08-02
申请号：EP00954052
申请日：2000-08-11
申请人： TESSERA INC
发明人： HABA BELGACEM , SMITH JOHN W
IPC分类号： H05K3/40 , B05D5/12 , H01L21/48 , H01L21/60 , H01L21/768 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/46
CPC分类号： H05K3/4076 , H01L21/486 , H01L2924/0002 , H05K2203/083 , H05K2203/085 , H05K2203/1105 , H01L2924/00
摘要： Electrical connections are made between a pair of elements (32, 38) disposed on opposite side of a hole (28) extending through a dielectric layer (20) by evaporating a conductive material (40) such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

8. 发明授权

EP0977471B1 METHOD AND APPARATUS FOR FABRICATING CIRCUIT-FORMING-SUBSTRATE AND CIRCUIT-FORMING-SUBSTRATE MATERIAL 有权
标题翻译：方法和设备制造电路下基板与电路形成衬底材料
公开(公告)号：EP0977471B1
公开(公告)日：2005-07-06
申请号：EP98957171.6
申请日：1998-12-04
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： YAMANE, Shigeru , NISHII, Toshihiro , NAKAMURA, Shinji , SAKAI, Masayuki
IPC分类号： H05K3/00
CPC分类号： H05K3/0032 , H05K3/227 , H05K3/4069 , H05K2201/0355 , H05K2203/081 , H05K2203/085 , H05K2203/1383 , H05K2203/1388 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T156/1056 , Y10T156/1062 , Y10T428/24994 , Y10T442/2902
摘要： A method of fabricating a circuit-forming-substrate comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability circuit forming substrate.

9. 发明授权

EP1014769B1 Manufacturing method of printed circuit board 有权
标题翻译：一种用于生产印刷电路处理
公开(公告)号：EP1014769B1
公开(公告)日：2003-10-08
申请号：EP99310466.0
申请日：1999-12-23
申请人： VICTOR COMPANY OF JAPAN, LTD.
发明人： Seki, Yasuaki , Shiratori, Shigenori , Suzuki, Kenji
IPC分类号： H05K3/46
CPC分类号： H05K3/4673 , H05K3/4644 , H05K2201/09509 , H05K2201/09518 , H05K2203/0759 , H05K2203/085 , H05K2203/1105 , Y10T428/24917 , Y10T428/31681 , Y10T428/31728

10. 发明公开

EP1139410A3 Method of manufacturing bump-component mounted body and device for manufacturing the same 审中-公开
标题翻译：在基板上组装驼峰状部件的方法和安装在同一装置
公开(公告)号：EP1139410A3
公开(公告)日：2003-09-24
申请号：EP01103502.9
申请日：2001-02-15
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Tsukamoto, Masahide
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L24/75 , H01L21/563 , H01L24/29 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2224/81209 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H05K3/284 , H05K3/303 , H05K2203/0278 , H05K2203/085 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , H01L2924/00 , H01L2224/05599
摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

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