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1. 发明公开

EP3230003A1 WÄRMEÜBERTRAGUNGSVORRICHTUNG FÜR DIE LÖTVERBINDUNGSHERSTELLUNG ELEKTRISCHER BAUTEILE 有权
标题翻译： WÄRMEÜBERTRAGUNGSVORRICHTUNGFÜRDIELÖTVERBINDUNGSHERSTELLUNGELEKTRISCHER BAUTEILE
公开(公告)号：EP3230003A1
公开(公告)日：2017-10-18
申请号：EP15817776.6
申请日：2015-12-09
申请人： PINK GmbH Thermosysteme
发明人： OETZEL, Christoph , CLÄRDING, Sebastian
IPC分类号： B23K3/08 , B23K1/00
CPC分类号： B23K3/04 , B23K1/0016 , B23K3/085 , B23K2101/40
摘要： The invention relates to a heat transfer device (10, 110, 210) for thermal coupling of a component (28, 128) to be soldered, comprising a heat source and/or a heat sink (48) in a soldering machine (200), having at least one base plate (12, 112, 212) which is designed to be in thermal contact at least with the heat source and/or the heat sink (48). The base plate (12, 112, 212) has a plurality of contact units (14, 114, 124) having a respective contact surface (24, 124), wherein the contact surfaces (24, 124) are thermally contactable to the components (28, 128). The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component can be changed. The invention further relates to a soldering device (200), in particular a vacuumable soldering device having at least one such heat transfer device (10, 110, 210).
摘要翻译：本发明涉及一种用于热耦合要焊接的部件（28,128）的传热装置（10,110,210），其包括焊接机（200）中的热源和/或散热器（48），具有至少一个设计成至少与热源和/或散热器（48）热接触的基板（12,112,212）。基板（12,112,212）具有多个具有相应接触表面（24,124）的接触单元（14,114,124），其中接触表面（24,124）可热接触到元件 28，128）。接触单元被设计成使得接触表面和面对部件的基板表面之间的相对距离可以改变。本发明还涉及一种焊接装置（200），特别是具有至少一个这样的传热装置（10,110,210）的真空焊接装置。

2. 发明公开

EP3007287A4 WIRE ROD CONNECTION DEVICE, WIRE ROD CONNECTION METHOD, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE 审中-公开
标题翻译： WALZDRAHTVERBINDUNGSVORRICHTUNG，WALZDRAHTVERBINDUNGSVERFAHREN UND VERFAHREN ZUR HERSTELLUNG EINER VERBINDUNGSSTRUKTUR
公开(公告)号：EP3007287A4
公开(公告)日：2017-08-09
申请号：EP14804200
申请日：2014-05-28
申请人： FUJIKURA LTD
发明人： FUJITA SHINJI
IPC分类号： H01R43/02 , B23K1/00 , B23K3/04 , B23K3/08 , B23K37/04 , B23K101/32 , H01B12/00 , H01B13/00 , H01F6/06 , H01R4/02 , H01R4/68 , H02G1/00
CPC分类号： H02G1/005 , B23K1/0008 , B23K1/0016 , B23K1/19 , B23K3/04 , B23K3/085 , B23K3/087 , B23K37/0408 , B23K2201/32 , H01B12/00 , H01B12/04 , H01R4/022 , H01R4/027 , H01R4/68 , H01R43/02 , H01R43/0263
摘要： A wire splicing device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate toward or away from one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween, and the heating body which is driven toward the holding base by the second driver presses together and heats, via the pressing plate, the plurality of wires accommodated in the wire accommodation groove with solder therebetween.
摘要翻译：一种电线接合装置，包括：保持基座，设置有具有宽度的电线容纳槽，电线容纳槽构造为容纳多根电线; 位于保持基座上方的压板; 加热体，其位于压板的上方并包括加热构件; 第一驱动器，所述第一驱动器将所述保持基座和所述压板朝向彼此或远离彼此驱动; 以及第二驱动部，其使所述保持台与所述发热体接近或远离地进行驱动，由所述第一驱动部向所述保持台驱动的所述按压板将收纳于所述电线收纳槽的所述多根电线与焊料一起压接并且由第二驱动器朝向保持基座驱动的加热体压在一起并通过压板加热容纳在电线容纳槽中的多根电线，其间具有焊料。

3. 发明授权

EP2661983B1 Gerät, insbesondere ein Haarstylinggerät 有权
标题翻译： Gerät，insbesondere einHaarstylinggerät
公开(公告)号：EP2661983B1
公开(公告)日：2017-04-12
申请号：EP13166470.8
申请日：2013-05-03
申请人： BSH Hausgeräte GmbH
发明人： Altmann, Berthold , Blischke, Daniela , Copitzky, Thomas
IPC分类号： A45D1/04 , B23K3/00
CPC分类号： A45D1/04 , B23K3/02 , B23K3/04

4. 发明公开

EP2950622A1 HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD 有权转让
标题翻译： WÄRMEBINDUNGSVORRICHTUNGUND VERFAHREN ZUR HERSTELLUNG EINESWÄRMEGEBUNDENENARTIKELS
公开(公告)号：EP2950622A1
公开(公告)日：2015-12-02
申请号：EP14742961.7
申请日：2014-01-09
申请人： Origin Electric Company, Limited
发明人： MATSUDA,Jun , SUZUKI,Takayuki , KURODA,Masami
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008 , B23K3/04 , B23K101/42
CPC分类号： B23K1/005 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K3/085 , B23K35/26 , B23K2101/42 , H05K3/3494 , H05K2203/085
摘要： Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when performing a heat-bonding process in a vacuum, e.g. soldering, the temperatures of target objects being heat-bonded can be brought to a prescribed target temperature suitable for heat-bonding, in less time than with conventional devices and methods, without overshooting said target temperature by a large amount. This heat-bonding device is provided with the following: a vacuum chamber that contains the target objects to be heat-bonded and a buffer part; a heater that heats the buffer part, which is disposed so as to contact the target objects in the vacuum chamber; a cooler that removes some of the heat from the buffer part heated by the heater; a target-object temperature sensor that detects the temperatures of the target objects, which are heated via the buffer part; and a control device that controls the heat-bonding device by regulating the removal of heat from the buffer part by the cooler on the basis of the detected temperatures of the target objects so as to bring the temperatures of the target objects to the abovementioned target temperature suitable for heat-bonding
摘要翻译：提供了一种极好的热粘合装置和热粘合物制造方法，其中当在真空中进行热粘合工艺时，例如，焊接时，与现有的装置和方法相比，能够以比现有的装置和方法更短的时间将与热粘合的目标物体的温度设定为适合于热粘合的规定目标温度，而不会大量地超过目标温度。这种热粘合装置具有以下装置：包含要被热粘合的目标物体和缓冲部分的真空室; 加热器，其加热缓冲部分，其设置成与真空室中的目标物体接触; 冷却器，其从加热器加热的缓冲部分中除去一些热量; 目标物体温度传感器，其检测经由缓冲部件被加热的目标物体的温度; 以及控制装置，其通过基于所检测到的目标物体的温度来调节由所述冷却器从所述缓冲部排出的热量来控制所述热粘合装置，以使所述目标物体的温度达到上述目标温度适用于热粘合

5. 发明公开

EP2941103A1 GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE 有权转让
标题翻译： DIFFUSORPLATE UNDLÖTVORRICHTUNG
公开(公告)号：EP2941103A1
公开(公告)日：2015-11-04
申请号：EP13867869.3
申请日：2013-12-20
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： HIYAMA Tsutomu
IPC分类号： H05K3/34 , B23K1/008 , B23K3/04 , B23K101/40 , B23K101/42
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/082 , B23K2201/42 , H05K2203/04 , H05K2203/081
摘要： In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern Plof the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.
摘要翻译：在气体发泡孔阵列结构中，能够将气体吹送到诸如印刷电路板，半导体晶片等的被传送部件的整个表面，几乎同心地并且允许被传送部件的整个表面非常均匀地加热或冷却，喷嘴2的喷嘴图案P2被布置成与喷嘴盖3的一侧的上分割部分和下分割部分中的喷嘴图案Plof相对于其中心部分线性对称与输送方向垂直，如图1所示。 1。为了使在喷嘴盖3中对角地配置的排列图形变得相同，喷嘴图案P1被布置为与喷嘴2的喷嘴图案P2在喷嘴的另一侧的上下分割部分的线对称盖3。

6. 发明公开

EP2902147A1 HEAT-PROCESSING DEVICE 有权
标题翻译：热处理装置
公开(公告)号：EP2902147A1
公开(公告)日：2015-08-05
申请号：EP13841015.4
申请日：2013-09-06
申请人： Origin Electric Company, Limited
发明人： AKAMA,Hiroshi , MATSUMOTO,Yutaka , KURODA,Masami , NISHIMURA,Hironobu
IPC分类号： B23K1/008 , H05B3/44
CPC分类号： B23K3/04 , B23K1/0016 , B23K1/005 , B23K1/008 , H05B3/0047 , H05B3/44
摘要： To provide a thermal processing apparatus where a projection area perpendicular to the axis of a sealing structure and attachment structure of heat radiation heater is decreased and a chamber volume is decreased. The apparatus has a chamber for accommodating a workpiece of a thermal processing object, the chamber having a partition wall for partitioning inside from outside of the chamber, a heat radiation heater disposed penetrating the partition wall, wherein the heater has a ring seal arranged on an outer peripheral surface of the extension section, and hermetically sealing the chamber, and a heat blocking plate arranged between the heat radiation unit and the ring seal in the axial direction of the glass tube, for blocking heat radiated from the heat radiation unit to the ring seal, the heat blocking plate having an inner peripheral surface fitting along the extension section.
摘要翻译：提供一种热处理装置，其中与密封结构的轴线垂直的投影区域和热辐射加热器的附接结构减小并且腔室容积减小。该设备具有用于容纳热处理物体的工件的腔室，该腔室具有用于从腔室的外部分隔内部的分隔壁，设置成穿过分隔壁的热辐射加热器，其中加热器具有设置在延伸部分的外周表面，并且密封腔室;以及热阻挡板，其在玻璃管的轴向上布置在散热单元和环形密封件之间，用于阻挡从热辐射单元辐射到环形件的热量所述热阻挡板具有沿延伸部分配合的内周表面。

7. 发明公开

EP1935546A1 Laser brazing heating assembly with optic fibre having at least at a distal end a non-circular cross section ; Laser brazing tool and robot with such a laser brazing heating assembly ; Useof such optical fibre with at least at a distal end a non-circular cross section for laser brazing 审中-公开
标题翻译：用光学上一端的具有非圆形横截面的纤维Laserlötheizgerät; Laserlötwerkzeug和与该Laserlötheizgerät机器人; 使用一非圆形横截面的具有在光纤的一端与激光焊接
公开(公告)号：EP1935546A1
公开(公告)日：2008-06-25
申请号：EP06126844.7
申请日：2006-12-21
申请人： Ford Global Technologies, LLC
发明人： PALMQUIST, Niclas
IPC分类号： B23K1/005 , B23K3/04 , B23K26/06 , B23K26/073 , B23K26/08 , G02B6/10
CPC分类号： B23K1/0056 , B23K3/04 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/0732 , B23K26/0884 , G02B6/4296
摘要： The present invention relates to a laser brazing heating assembly (10), comprising a laser source (12) adapted to produce a laser beam (14). The assembly (10) further comprises an optic fibre (16) having a proximal end (18) and a distal end (20). The proximal end (18) is connected to the laser source (12) and the distal end (20) is adapted to emit the laser beam (14). At least a portion (22) of the fibre (16), which extends along the length of the fibre and is located at the distal end (20), has a non- circular cross section.
The invention further relates to the use of a fibre (16) in a laser brazing heating assembly (10) or a laser brazing tool, wherein at least a portion of said fibre (16) extending along the length of said fibre (16) and being located at a distal end (20) has a non-circular cross section.
摘要翻译：本发明涉及包含适于产生激光束（14）的激光源（12）的激光钎焊加热组件（10）。具有近端（18）和远端（20）的组件（10）的光纤（16）进一步包括。近端（18）被连接到激光源（12）和所述远端（20）是angepasst发射所述激光束（14）。至少沿着所述光纤的长度延伸，并位于所述远端（20）的光纤（16）的部分（22）具有非圆形横截面。本发明还涉及到在激光钎焊加热组件（10）或激光钎焊工具的使用的纤维（16）的，worin至少所述纤维（16）的至少一部分沿着所述光纤（16）和长度方向延伸位于在远端（20）具有非圆形的横截面。

8. 发明授权

EP1106947B1 Heizvorrichtung 有权
标题翻译：加热器
公开(公告)号：EP1106947B1
公开(公告)日：2005-06-15
申请号：EP00126863.0
申请日：2000-12-07
申请人： Rehm Anlagenbau GmbH
发明人： Rehm, Johannes
IPC分类号： F27B9/02 , B23K1/015 , F26B15/10
CPC分类号： F26B15/10 , B23K1/0053 , B23K1/008 , B23K1/012 , B23K3/04 , F27B9/10 , F27B9/243 , F27D3/00 , F27D2003/0065

9. 发明公开

EP1292798A1 OPTICAL APPARATUS AND METHODS FOR SHRINKING ELECTRONIC COMPONENTS 审中-公开
标题翻译：光学设备和一种用于减少电子元件
公开(公告)号：EP1292798A1
公开(公告)日：2003-03-19
申请号：EP01939739.7
申请日：2001-05-31
申请人： JUDCO MANUFACTURING, INC.
发明人： The designation of the inventor has not yet been filed
IPC分类号： F27B11/00
CPC分类号： H01L21/67115 , B23K3/04 , B23K2201/40
摘要： Optical heat-generating apparatus (10) to deliver heat energy to heat shrink tubing (11) disposed over wires or other components, or to fuse insulated wires, or solder and unsolder packaged IC chips. A housing has one or more reflective cavities each having a linear elliptical reflective surface (13) with first and second focal lines, into which heatable component is placed along coincident first focal lines. Optical heat-generating elements (15) are placed along the second focal lines so as to focus heat energy along the first focal line.

10. 发明公开

EP1155767A3 Verfahren zum Bestimmen von Stroemungsverhaeltnissen in Reflowloetanlagen und Testplatine 有权
标题翻译：一种用于回流焊接和测试板测定Stroemungsverhaeltnissen方法
公开(公告)号：EP1155767A3
公开(公告)日：2002-06-19
申请号：EP01250077.3
申请日：2001-03-09
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Meier, Hartmut , Mueller, Bernd , Wittreich, Ulrich
IPC分类号： B23K1/012
CPC分类号： B23K3/04 , B23K1/012 , B23K3/08 , H05K1/0266 , H05K3/3494
摘要： Die Erfindung betrifft ein Verfahren zum Bestimmen von Strömungsverhältnissen des Heizgases in Reflowlötanlagen. Um auf einfache Art und Weise die Strömungsverhältnisse des Heizgases in Reflowlötanlagen zu bestimmen, wird eine lotpastenfreie Testplatine (1, 40) mit lotpastenfreien Strömungstestelementen (2, 10 bis 13, 41, 51) durch die Reflowlötanlage transportiert und Bewegungen der Strömungstestelemente (2, 10 bis 13, 41, 51) werden zum Bestimmen der Strömungsverhältnisse ausgewertet. Als Strömungstestelemente können Modellbauelemente (41, 51) verwendet werden, die in ihrer Form der elektrischer Bauelemente entsprechen und ein Gewicht aufweisen, das eine Haftreibungskraft auf der Testplatine (1, 40) entsprechend der von Lotpaste auf die elektrischen Bauelemente ausgeübten Naßklebekraft zur Folge hat. Weiterhin können als Strömungstestelemente (2, 10 bis 13, 41, 51) vom Heizgas drehbare Fahnen verwendet werden.

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