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1. 发明授权

EP2016810B1 METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARDS WITH STACKED MICROS VIAS 有权转让
公开(公告)号：EP2016810B1
公开(公告)日：2018-10-10
申请号：EP07755901.1
申请日：2007-04-19
申请人： VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
发明人： KUMAR, Raj , DREYER, Monte , TAYLOR, Michael, J.
IPC分类号： H05K3/46 , H05K3/20 , H05K3/38 , H05K3/42 , H05K3/40
CPC分类号： H05K3/4623 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/423 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K2201/0355 , H05K2201/0394 , H05K2201/09309 , H05K2201/096 , H05K2203/0191 , H05K2203/0271 , H05K2203/0502 , H05K2203/061 , H05K2203/0733 , H05K2203/107 , H05K2203/1461 , H05K2203/1536 , H05K2203/304 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

2. 发明公开

EP3311635A1 A METHOD FOR MAKING PATTERNED CONDUCTIVE TEXTILES 无效
标题翻译：一种制作图案化导电纺织品的方法
公开(公告)号：EP3311635A1
公开(公告)日：2018-04-25
申请号：EP16741372.3
申请日：2016-06-17
申请人： DST Innovations Limited
发明人： MILES, Anthony , MASHEDER, Benjamin John
IPC分类号： H05K1/02 , D06M11/83 , C23F1/02 , H05K1/03 , H05K3/06
CPC分类号： H05K1/0283 , C23F1/02 , C23F1/30 , D06M10/025 , D06M11/74 , D06M11/83 , D06M23/16 , D10B2501/00 , H05K1/038 , H05K1/0386 , H05K3/061 , H05K3/067 , H05K2201/0145 , H05K2201/0158 , H05K2201/0323 , H05K2203/1461 , H05K2203/1545 , H05K2203/1572
摘要： A method of forming a conductive/nonconductive pattern on a conductive particle-coated fabric uses chemical etching techniques to remove specific areas of conductive material from the fabric, producing non-conductive areas where the fabric was exposed to an etching agent, and leaving conductive areas where the conductive coating was protected by an etch-resistant coating.

3. 发明公开

EP3086629A1 ELECTRICAL WIRING MEMBER PRODUCTION METHOD, ELECTRICAL WIRING MEMBER FORMING MATERIAL, ELECTRICAL WIRING MEMBER, ELECTRICAL WIRING BOARD PRODUCTION METHOD, ELECTRICAL WIRING BOARD FORMING MATERIAL, ELECTRICAL WIRING BOARD, VIBRATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT 有权转让
标题翻译：方法制作电气布线元件，材料电气布线元件，电线元件的制造，方法制造电路板，材料制造电路板，电热板，振动器，电子设备和移动目标
公开(公告)号：EP3086629A1
公开(公告)日：2016-10-26
申请号：EP16165747.3
申请日：2016-04-18
申请人： Seiko Epson Corporation
发明人： Nakamura, Hidefumi , Kawasaki, Taku
IPC分类号： H05K3/40 , H05K1/03 , H05K3/10 , B22F1/02 , B22F3/02 , H05K3/12 , H03H3/02
CPC分类号： H05K1/0296 , B22F1/0059 , B22F1/02 , B22F2009/0828 , B22F2998/10 , H01B1/22 , H01B19/00 , H03H9/10 , H05K1/0373 , H05K3/105 , H05K3/1216 , H05K3/22 , H05K3/4038 , H05K2201/0224 , H05K2201/09118 , H05K2203/0278 , H05K2203/107 , H05K2203/1126 , H05K2203/1131 , H05K2203/1136 , H05K2203/1461 , B22F3/02 , B22F3/105 , B22F2003/023
摘要： A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, the surface insulating layer covering the metal particle containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.
摘要翻译：一种用于在电气布线构件的制造方法包括：压制成型在绝缘层中包含有树脂材料和金属颗粒的组合物中，表面绝缘层覆盖包含玻璃材料作为主要材料的金属颗粒，由此获得的粉末压实的层并照射在能量束，由此使照射区域以表现出导电性的粉末压实层。

4. 发明公开

EP3060031A1 Coil-Coating-Verfahren 有权转让
标题翻译：卷材涂布方法
公开(公告)号：EP3060031A1
公开(公告)日：2016-08-24
申请号：EP15155824.4
申请日：2015-02-19
申请人： voestalpine Stahl GmbH
发明人： SCHATZL-LINDNER, Michaela , STRAUSS, Bernhard , SELL, Johannes , ENSER, Herbert , HILBER, Wolfgang , JAKOBY, Bernhard
IPC分类号： H05K3/12 , H05K3/28
CPC分类号： H05K3/1275 , H05K1/056 , H05K3/28 , H05K2203/1461 , H05K2203/1545
摘要： Es wird ein Coil-Coating-Verfahren zur mehrschichtigen Beschichtung eines sich im Banddurchlauf befindlichen endlosen, insbesondere beschichteten, Metallbands (3), bei dem an einer Flachseite (4) des Metallbands (3) eine Konversionsschicht (5) gegebenenfalls erzeugt wird, nachfolgend auf diese Flachseite (4) mithilfe eines Walzenauftrags eine aushärtbare polymere Grundierung (9) zur Ausbildung einer elektrisch isolierenden Grundierungsschicht (10) und auf diese Grundierungsschicht (10) mithilfe eines Walzenauftrags ein aushärtbarer polymerer Lack (11) zur Ausbildung einer elektrisch isolierenden Lackschicht (12) aufgebracht und gehärtet werden, wobei zwischen Grundierungsschicht (10) und Lackschicht (12) wenigstens eine zumindest elektrisch leitende Leiterbahn (15) zumindest bereichsweise aufgedruckt wird. Um die Reproduzierbarkeit des Coil-Coating-Verfahrens zu erhöhen, wird vorgeschlagen, dass an der vorgehärteten Grundierungsschicht (10) die Leiterbahn (15) bereichsweise aufgedruckt wird und dass Leiterbahn (15) und Lack (11) nass-in-nass aufgebracht werden.
摘要翻译：这是一个转换层（5）任选地生成用于一个位于带多层涂层的线圈涂工艺通过无止境的，特别是涂层的金属条带（3），其特征在于，在平坦的侧面（4）在金属带（3）中，接着使用辊涂覆可固化聚合物底漆该平坦侧（4）（9），用于形成电绝缘涂层（10），并使用辊涂的可固化的聚合物涂层（11），以形成电绝缘漆层该底漆层（10）（12）上施加和固化，且底漆层（10）和抗蚀剂之间的层（12）的至少一个至少导电迹线（15）被至少部分地打印。为了增加线圈涂法的再现性，该导体轨道（15）部分地印刷在预固化的底漆层（10）上，并在该导体轨道（15）和抗蚀剂（11）是湿对湿施加提出。

5. 发明公开

EP2947975A4 COMPONENT-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：在组件嵌入式基板及其制造方法中的应用
公开(公告)号：EP2947975A4
公开(公告)日：2016-08-24
申请号：EP13872019
申请日：2013-01-18
申请人： MEIKO ELECTRONICS CO LTD
发明人： SEKI YASUAKI , NAGATA TOMOYUKI , TODA MITSUAKI
IPC分类号： H05K3/46 , H01L23/00 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/40
CPC分类号： H05K1/186 , H01L23/5226 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/32245 , H01L2224/82005 , H01L2224/82039 , H01L2224/83005 , H01L2224/92144 , H05K1/0206 , H05K1/0222 , H05K1/0298 , H05K1/113 , H05K1/114 , H05K1/115 , H05K1/185 , H05K1/188 , H05K3/0017 , H05K3/0035 , H05K3/305 , H05K3/4602 , H05K3/4652 , H05K2201/09827 , H05K2201/10 , H05K2203/063 , H05K2203/1461 , Y10T156/10
摘要： A device embedded substrate (20), includes: an insulation layer (12) including an insulation resin material; an electric or electronic device (4) embedded in the insulation layer (12); a terminal (15) serving as an electrode included in the device (4); a conductor pattern (18) formed on the surface of the insulation layer (12); and a conducting via (21) for electrically connecting the conductor pattern (18) and the terminals (15) with each other. The conducting via (21) is made up of a large-diameter section (21a) having a large diameter and a small-diameter section (21b) having a smaller diameter than that of the large-diameter section (21a), in order starting from the conductor pattern (18) toward the terminal (15). A stepped section (17) is formed between the large-diameter section (21a) and the small-diameter section (21b). The large-diameter section (21a) is formed so as to penetrate a sheet-shaped glass cloth (11) disposed in the insulation layer (12).

6. 发明授权

EP1267595B1 CIRCUIT FORMING BOARD PRODUCING METHOD, CIRCUIT FORMING BOARD, AND MATERIAL FOR CIRCUIT FORMING BOARD 有权
标题翻译： METHOD FOR循环训练板，线路板培训和材料循环训练板
公开(公告)号：EP1267595B1
公开(公告)日：2012-12-12
申请号：EP01974853.2
申请日：2001-10-15
申请人： Panasonic Corporation
发明人： YAMANE, Shigeru , KAWAMOTO, Eiji , KOMODA, Hideaki , SUZUKI, Takeshi , NISHII, Toshihiro , NAKAMURA, Shinji
IPC分类号： H05K3/40 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/46 , B32B5/00 , B32B5/14 , B32B15/08
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607

7. 发明公开

EP2408285A1 MULTILAYER WIRING SUBSTRATE PRODUCING METHOD AND MULTILAYER WIRING SUBSTRATE OBTAINED BY THE SAME 有权
标题翻译：一种用于生产多层布线基板，并在此过程制备多层线路基板的基础
公开(公告)号：EP2408285A1
公开(公告)日：2012-01-18
申请号：EP10750562.0
申请日：2010-03-09
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： YAMAGUCHI, Norihiro , UMEDA, Hiroaki , YUKAWA, Ken
IPC分类号： H05K3/46 , H05K1/09 , H01B1/22
CPC分类号： H05K3/46 , H01B1/22 , H05K1/0298 , H05K1/095 , H05K3/0032 , H05K3/4069 , H05K3/462 , H05K2201/0191 , H05K2201/0272 , H05K2201/0355 , H05K2201/10378 , H05K2203/0278 , H05K2203/0425 , H05K2203/1105 , H05K2203/111 , H05K2203/1194 , H05K2203/1461 , H05K2203/1572 , Y10T29/49117 , Y10T29/49124 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165
摘要： In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60°C to 200°C, and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10.
摘要翻译：在制造多层电路板，的方法，包括：用于通过由激光束加工，通孔，用导电浆料含有树脂成分和金属粉末填充的工序的预浸料形成通孔钻孔步骤和步骤配置铜层或上和填充的导电膏下的图案化基板的铜层部分，并且按相同的，多层印刷布线板优异的导电性和长期稳定性是通过使用合金化糊作为导电糊获得，其中至少金属粉末的一部分被熔化并在金属粉末毗邻海誓山盟合金化，使用具有至少10:1的比例A / B的预浸渍体进行预热，其中A是储能模量在拐点之前，其中从增加到减少和B的储能模量的变化是在一个储能模量在拐点从降低到在温度曲线从60℃上升增加的储能模量的变化至200℃，并在钻孔步骤之前预热预浸渍，以减少的比率A / B到第10下面

8. 发明授权

EP1357775B1 CIRCUIT BOARD AND ITS MANUFACTURING METHOD 有权
标题翻译：电路板及其制造方法
公开(公告)号：EP1357775B1
公开(公告)日：2009-12-09
申请号：EP02775418.3
申请日：2002-10-30
申请人： Panasonic Corporation
发明人： SUGAWA, Toshio , TAKASE, Yoshihisa
IPC分类号： H05K3/38 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/40 , H05K3/46
CPC分类号： H05K3/108 , H05K3/062 , H05K3/384 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2203/0307 , H05K2203/0353 , H05K2203/0361 , H05K2203/072 , H05K2203/1461 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156

9. 发明授权

EP1170983B1 CIRCUIT FORMING BOARD AND METHOD OF MANUFACTURING CIRCUIT FORMING BOARD 有权
标题翻译：电路板和电路板的方法
公开(公告)号：EP1170983B1
公开(公告)日：2009-11-18
申请号：EP00981676.0
申请日：2000-12-13
申请人： Panasonic Corporation
发明人： NISHII, Toshihiro
IPC分类号： H05K3/40 , H05K1/11 , H05K3/00 , H05K3/38 , H05K3/42 , H05K3/46
CPC分类号： H05K3/0032 , H05K1/116 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K3/4652 , H05K2201/0355 , H05K2201/09909 , H05K2203/0191 , H05K2203/0537 , H05K2203/065 , H05K2203/1461 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/24917 , Y10T428/249953
摘要： In order to improve the adhesion of a circuit to a circuit forming board, a separation film (4) comprising a base film and a coating layer formed on the base film is joined to both the sides of the board (1). When a laser beam (5) is applied to form a throughhole (6) in the board (1), a unified portion (7) of the board (1) and the separation film (4) is formed around the throughhole (6). An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.

10. 发明公开

EP1821588A4 PROCESS FOR PRODUCING MULTILAYER WIRING BOARD 审中-公开
标题翻译：用于生产多层电路板
公开(公告)号：EP1821588A4
公开(公告)日：2009-11-11
申请号：EP05788279
申请日：2005-09-29
申请人： SONY CHEM & INF DEVICE CORP , TESSERA INTERCONNECT MATERIALS
发明人： SHIMIZU KAZUHIRO , YAGI MASANOBU , HANAMURA KENICHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE , IIJIMA TOMOO
IPC分类号： H05K3/46 , B32B37/26
CPC分类号： H05K3/4038 , B32B37/26 , B32B2457/08 , H05K3/022 , H05K3/06 , H05K3/4647 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1461 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163

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