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2. 发明授权

EP3018705B1 An apparatus and associated methods for mounting electronic components on deformable substrates 有权
公开(公告)号：EP3018705B1
公开(公告)日：2018-08-22
申请号：EP14191680.9
申请日：2014-11-04
申请人： Nokia Technologies Oy
发明人： White, Richard , Haque,, Samiul , Astley, Michael
IPC分类号： H01L23/00
CPC分类号： H01L24/29 , H01L23/48 , H01L23/4985 , H01L24/32 , H01L2224/2919 , H01L2224/32013 , H01L2224/32105 , H01L2224/32245 , H01L2224/83385 , H03K17/962 , H03K17/9625 , H03K2217/96023 , H03K2217/960755
摘要： An apparatus comprising: a deformable substrate, the substrate configured to allow for electrical connection of one or more substrate electronic components mounted on the deformable substrate to at least one of: one or more other electronic components mounted on the deformable substrate, and one or more other electronic components mounted on another connected substrate; and one or more substrate electronic components mounted on the deformable substrate by an interconnect, the interconnect configured to electrically and mechanically interconnect the one or more substrate electronic components to the deformable substrate; wherein the interconnect comprises an ion gel, the ion gel configured to: electrically interconnect the one or more substrate electronic components to the deformable substrate by capacitive coupling; mechanically interconnect the one or more substrate electronic components to the deformable substrate by adhesion, and maintain the electrical and mechanical interconnection of the one or more substrate electronic components under operational strains of the deformable substrate.

3. 发明公开

EP2985785A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：EP2985785A1
公开(公告)日：2016-02-17
申请号：EP13881860.4
申请日：2013-10-15
申请人： Mitsubishi Electric Corporation
发明人： YOSHIDA, Kazuo , NEGISHI, Masato
IPC分类号： H01L21/52 , H01L21/301
CPC分类号： H01L24/32 , H01L21/268 , H01L21/302 , H01L21/6836 , H01L21/78 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/92 , H01L24/95 , H01L29/30 , H01L2221/68327 , H01L2224/04026 , H01L2224/05557 , H01L2224/06051 , H01L2224/06183 , H01L2224/26145 , H01L2224/2732 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29339 , H01L2224/32013 , H01L2224/32058 , H01L2224/32105 , H01L2224/32106 , H01L2224/32225 , H01L2224/32227 , H01L2224/48227 , H01L2224/83101 , H01L2224/83365 , H01L2224/838 , H01L2224/83851 , H01L2224/83862 , H01L2224/83871 , H01L2224/83907 , H01L2224/92247 , H01L2224/95 , H01L2924/00014 , H01L2924/10156 , H01L2924/3841 , H01L2924/0781 , H01L2224/83 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of the device.
摘要翻译：根据本发明的半导体器件包括安装基板，施加到安装基板的粘合剂，以及其下表面用粘合剂粘合到安装基板的器件。器件侧表面上部的表面粗糙度低于器件侧表面下部的表面粗糙度。

4. 发明授权

EP2669936B1 Discrete semiconductor device package and manufacturing method 有权转让
标题翻译：分立半导体器件封装和制造方法
公开(公告)号：EP2669936B1
公开(公告)日：2018-02-14
申请号：EP12170528.9
申请日：2012-06-01
申请人： Nexperia B.V.
发明人： Boettcher, Tim , Walczyk, Sven , Groenhuis, Roelf , Brenner, Rolf , De Bruin, Emiel
IPC分类号： H01L23/31 , H01L21/56 , H01L23/485 , H01L25/065 , H01L23/00 , H01L25/00 , H01L21/78
CPC分类号： H01L21/78 , H01L21/56 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05016 , H01L2224/05088 , H01L2224/051 , H01L2224/05111 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/05582 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/06181 , H01L2224/13147 , H01L2224/16145 , H01L2224/20 , H01L2224/291 , H01L2224/32105 , H01L2224/32113 , H01L2224/32237 , H01L2224/33181 , H01L2224/9202 , H01L2224/94 , H01L2224/96 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/10253 , H01L2924/12036 , H01L2924/014 , H01L2924/00 , H01L2224/03 , H01L2224/81 , H01L2224/05552
摘要： Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.

5. 发明公开

EP2669936A1 DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD 有权转让
标题翻译： Diskrete Halbleiterbauelementverpackung und Herstellungsverfahren
公开(公告)号：EP2669936A1
公开(公告)日：2013-12-04
申请号：EP12170528.9
申请日：2012-06-01
申请人： NXP B.V.
发明人： Boettcher, Tim , Walczyk, Sven , Groenhuis, Roelf , Brenner, Rolf , De Bruin, Emiel
IPC分类号： H01L21/56 , H01L23/31 , H01L23/485 , H01L25/065
CPC分类号： H01L21/78 , H01L21/56 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05016 , H01L2224/05088 , H01L2224/051 , H01L2224/05111 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/05582 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/06181 , H01L2224/13147 , H01L2224/16145 , H01L2224/20 , H01L2224/291 , H01L2224/32105 , H01L2224/32113 , H01L2224/32237 , H01L2224/33181 , H01L2224/9202 , H01L2224/94 , H01L2224/96 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/10253 , H01L2924/12036 , H01L2924/014 , H01L2924/00 , H01L2224/03 , H01L2224/81 , H01L2224/05552
摘要： Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.
摘要翻译：公开了一种分立半导体器件封装（100），其包括半导体管芯（110），其具有第一表面和与所述第一表面相对的第二表面，所述第二表面承载触点（112）; 所述接触件上的导电体（120）横向封装所述导电体的封装材料（130）; 以及与焊料部分导电接触的诸如焊料帽，另外的半导体管芯或其组合的封盖构件（140,610），所述焊料帽在封装材料上延伸。可以在第一表面上设置另外的焊锡帽（150）。还公开了制造这种分立半导体器件封装的方法。

6. 发明公开

EP3167485A1 SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS 审中-公开
标题翻译：可扩展包装结构及相关技术和配置
公开(公告)号：EP3167485A1
公开(公告)日：2017-05-17
申请号：EP14897417.3
申请日：2014-07-11
申请人： Intel Corporation
发明人： GANESAN, Sanka , ZIADEH, Bassam , NIMKAR, Nitesh
IPC分类号： H01L25/07 , H01L23/48 , H01L23/28
CPC分类号： H01L25/0657 , H01L23/293 , H01L24/02 , H01L24/03 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/03 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0381 , H01L2224/08225 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/27 , H01L2224/28105 , H01L2224/29006 , H01L2224/2919 , H01L2224/32058 , H01L2224/32105 , H01L2224/32145 , H01L2224/3301 , H01L2224/33106 , H01L2224/73204 , H01L2224/73253 , H01L2224/80903 , H01L2224/81191 , H01L2224/81203 , H01L2224/83102 , H01L2224/83191 , H01L2224/83203 , H01L2224/83855 , H01L2224/92 , H01L2224/9211 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06548 , H01L2225/1023 , H01L2225/1058 , H01L2924/00012 , H01L2924/15311 , H01L2924/18161 , H01L2924/3512 , H01L2924/0665 , H01L2924/014 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： Embodiments of the present disclosure describe scalable package architecture of an integrated circuit (IC) assembly and associated techniques and configurations. In one embodiment, an integrated circuit (IC) assembly includes a package substrate having a first side and a second side disposed opposite to the first side, a first die having an active side coupled with the first side of the package substrate and an inactive side disposed opposite to the active side, the first die having one or more through-silicon vias (TSVs) configured to route electrical signals between the first die and a second die, and a mold compound disposed on the first side of the package substrate, wherein the mold compound is in direct contact with a sidewall of the first die between the active side and the inactive side and wherein a distance between the first side and a terminating edge of the mold compound that is farthest from the first side is equal to or less than a distance between the inactive side of the first die and the first side. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例描述了集成电路（IC）组件的可缩放封装体系结构以及相关技术和配置。在一个实施例中，集成电路（IC）组件包括具有第一侧和与第一侧相对设置的第二侧的封装衬底，具有与封装衬底的第一侧耦合的有源侧和不活跃侧与所述有源侧相对设置，所述第一裸片具有被配置为在所述第一裸片和第二裸片之间布线电信号的一个或多个硅通孔（TSV）以及布置在所述封装衬底的第一侧上的模制化合物，其中，所述模制化合物在所述有效侧和所述无效侧之间与所述第一模具的侧壁直接接触，并且其中所述模制化合物的离所述第一侧最远的所述第一侧和终止边之间的距离等于或小于比第一模具的不活动侧和第一侧之间的距离大。其他实施例可以被描述和/或要求保护。

8. 发明公开

EP3018705A1 An apparatus and associated methods for mountinig electronic components on deformable substrates 有权
标题翻译：设备和相关方法，用于在可变形的基板上安装的电子部件
公开(公告)号：EP3018705A1
公开(公告)日：2016-05-11
申请号：EP14191680.9
申请日：2014-11-04
申请人： Nokia Technologies OY
发明人： White, Richard , Haque,, Samiul , Astley, Michael
IPC分类号： H01L23/00
CPC分类号： H01L24/29 , H01L23/48 , H01L23/4985 , H01L24/32 , H01L2224/2919 , H01L2224/32013 , H01L2224/32105 , H01L2224/32245 , H01L2224/83385 , H03K17/962 , H03K17/9625 , H03K2217/96023 , H03K2217/960755
摘要： An apparatus comprising: a deformable substrate, the substrate configured to allow for electrical connection of one or more substrate electronic components mounted on the deformable substrate to at least one of: one or more other electronic components mounted on the deformable substrate, and one or more other electronic components mounted on another connected substrate; and one or more substrate electronic components mounted on the deformable substrate by an interconnect, the interconnect configured to electrically and mechanically interconnect the one or more substrate electronic components to the deformable substrate; wherein the interconnect comprises an ion gel, the ion gel configured to: electrically interconnect the one or more substrate electronic components to the deformable substrate by capacitive coupling; mechanically interconnect the one or more substrate electronic components to the deformable substrate by adhesion, and maintain the electrical and mechanical interconnection of the one or more substrate electronic components under operational strains of the deformable substrate.
摘要翻译：一种装置，包括：可变形的基材，配置为允许一个或多个基板的电子部件安装在所述可变形的基片的至少一个的电气连接的底物：一种或多种其它的电子部件安装在所述可变形的基片，以及一个或多个安装在另一连接的基板等电子元件; 并安装在由互连到所述可变形基板的一个或多个衬底的电子元件，所述互连配置成电和机械互连的一个或多个基板的电子部件到所述可变形的底物; worin互连离子凝胶包括，离子凝胶被配置为：电气互连一个或多个衬底的电子元件，以通过电容耦合可变形的底物; 通过粘接机械互连的一个或多个基板上的电子部件到可变形的基材，和保持一个或多个衬底下可变形基板的操作菌株电子部件的电和机械互连。

10. 发明公开

EP2668675A1 LIGHT EMITTING DEVICE CHIP SCALE PACKAGE 有权转让
标题翻译：住房芯片尺寸的发光器件
公开(公告)号：EP2668675A1
公开(公告)日：2013-12-04
申请号：EP11813570.6
申请日：2011-12-29
申请人： Koninklijke Philips N.V.
发明人： STEIGERWALD, Daniel Alexander
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L33/08 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L33/0079 , H01L33/50 , H01L33/62 , H01L2221/6835 , H01L2221/68377 , H01L2224/03002 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05568 , H01L2224/05647 , H01L2224/131 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17107 , H01L2224/291 , H01L2224/32105 , H01L2224/32227 , H01L2224/32238 , H01L2924/00014 , H01L2933/0066 , H01L2924/014 , H01L2224/05552
摘要： The substrate that is used to support the growth of the LED structure is used to support the creation of a superstructure above the LED structure. The superstructure is preferably created as a series of layers, including conductive elements that forma conductive path from the LED structure to the top of the superstructure, as well as providing structural support to the light emitting device. The structure is subsequently inverted, such that the superstructure becomes the carrier substrate for the LED structure, and the original substrate is thinned or removed. The structure is created using materials that facilitate electrical conduction and insulation, as well as thermal conduction and dissipation.

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