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    • 1. 发明公开
    • A mechanical deformation sensor based on plasmonic nanoparticles
    • 纳米技术人员研究机构Verformungssensor basierend auf plasmonische Nanopartikeln
    • EP3051273A1
    • 2016-08-03
    • EP15153474.0
    • 2015-02-02
    • Nokia Technologies OY
    • Harris, NadineAstley, MichaelWhite, Richard
    • G01N21/552G01N21/31
    • G01N21/554G01N21/31G01N21/3563G01N21/3581G01N21/4133G01N21/658
    • An apparatus comprising first and second plasmonic nanoparticles (502a, 502b) connected to one another by a deformable member (518), the first and second plasmonic nanoparticles each configured to exhibit a respective plasmon resonance when exposed to incident electromagnetic radiation,
      wherein, in a first configuration, the first and second plasmonic nanoparticles are in sufficient proximity to one another that their respective plasmon resonances can interact to produce a resulting plasmon resonance, and
      wherein mechanical deformation of the deformable member causes a variation in the relative position of the plasmonic nanoparticles to a second configuration to produce a detectable change in the resulting plasmon resonance of the first configuration which can be used to determine said mechanical deformation.
    • 一种包括通过可变形构件(518)彼此连接的第一和第二等离子体激元纳米颗粒(502a,502b)的装置,所述第一和第二等离子体激元纳米颗粒每个被配置为当暴露于入射电磁辐射时呈现相应的等离子体共振,其中, 第一配置,第一和第二等离子体激元纳米颗粒彼此足够接近,它们各自的等离子体共振可以相互作用以产生所得的等离子体共振,并且其中可变形构件的机械变形导致等离子体激元纳米粒子相对位置的变化 第二配置,以产生可用于确定所述机械变形的第一配置的所得到的等离子体共振的可检测变化。
    • 2. 发明公开
    • AN ARRAY APPARATUS AND ASSOCIATED METHODS
    • 一种阵列装置和相关方法
    • EP3249908A1
    • 2017-11-29
    • EP16171584.2
    • 2016-05-26
    • Nokia Technologies Oy
    • Allen, MarkEjaz, AqibAstley, MichaelKorpinen, PekkaKallioinen, Sami
    • H04N5/335H03M7/30H04N5/361
    • An apparatus comprising a processor and memory including computer program code, the memory and computer program code configured to, with the processor, enable the apparatus at least to: based on a predetermined dark current component for each photodetector in an array of photodetectors, identify a plurality of subsets of photodetectors from the array for signal readout and amplification by a readout circuit, each photodetector of the array configured to provide a photodetector output signal comprising the dark current component and an image component on exposure to incident electromagnetic radiation from a target scene, wherein each subset of photodetectors is identified such that the combined dark current component of the constituent photodetector output signals for each subset is substantially the same; and provide the identified plurality of subsets for use in signal readout and amplification by the readout circuit.
    • 一种包括处理器和包括计算机程序代码的存储器的设备,所述存储器和计算机程序代码被配置为与所述处理器一起使得所述设备至少:基于光电探测器阵列中的每个光电探测器的预定暗电流分量,识别 用于由读出电路进行信号读出和放大的阵列中的多个光电探测器子集,阵列中的每个光电探测器被配置为提供包括暗电流分量和曝光于来自目标场景的入射电磁辐射的图像分量的光电探测器输出信号, 其中识别光电检测器的每个子集,使得每个子集的组成光电检测器输出信号的组合光电流分量基本相同; 并且提供所识别的多个子集以用于由读出电路进行的信号读出和放大。
    • 9. 发明公开
    • An apparatus and associated methods for mountinig electronic components on deformable substrates
    • 设备和相关方法,用于在可变形的基板上安装的电子部件
    • EP3018705A1
    • 2016-05-11
    • EP14191680.9
    • 2014-11-04
    • Nokia Technologies OY
    • White, RichardHaque,, SamiulAstley, Michael
    • H01L23/00
    • H01L24/29H01L23/48H01L23/4985H01L24/32H01L2224/2919H01L2224/32013H01L2224/32105H01L2224/32245H01L2224/83385H03K17/962H03K17/9625H03K2217/96023H03K2217/960755
    • An apparatus comprising: a deformable substrate, the substrate configured to allow for electrical connection of one or more substrate electronic components mounted on the deformable substrate to at least one of: one or more other electronic components mounted on the deformable substrate, and one or more other electronic components mounted on another connected substrate; and one or more substrate electronic components mounted on the deformable substrate by an interconnect, the interconnect configured to electrically and mechanically interconnect the one or more substrate electronic components to the deformable substrate; wherein the interconnect comprises an ion gel, the ion gel configured to: electrically interconnect the one or more substrate electronic components to the deformable substrate by capacitive coupling; mechanically interconnect the one or more substrate electronic components to the deformable substrate by adhesion, and maintain the electrical and mechanical interconnection of the one or more substrate electronic components under operational strains of the deformable substrate.
    • 一种装置,包括:可变形的基材,配置为允许一个或多个基板的电子部件安装在所述可变形的基片的至少一个的电气连接的底物:一种或多种其它的电子部件安装在所述可变形的基片,以及一个或多个 安装在另一连接的基板等电子元件; 并安装在由互连到所述可变形基板的一个或多个衬底的电子元件,所述互连配置成电和机械互连的一个或多个基板的电子部件到所述可变形的底物; worin互连离子凝胶包括,离子凝胶被配置为:电气互连一个或多个衬底的电子元件,以通过电容耦合可变形的底物; 通过粘接机械互连的一个或多个基板上的电子部件到可变形的基材,和保持一个或多个衬底下可变形基板的操作菌株电子部件的电和机械互连。