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1. 发明公开

EP2960932A4 SMALL PRODUCTION DEVICE AND PRODUCTION SYSTEM USING SAME 有权
标题翻译： KLEINPRODUKTIONSVORRICHTUNG UND PRODUKTIONSSYSTEM DAMIT
公开(公告)号：EP2960932A4
公开(公告)日：2016-11-09
申请号：EP14753798
申请日：2014-02-17
申请人： NAT INST OF ADVANCED IND SCIEN
发明人： HARA SHIRO , MAEKAWA HITOSHI , NAKANO SHIZUKA
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745

2. 发明公开

EP2960932A1 SMALL PRODUCTION DEVICE AND PRODUCTION SYSTEM USING SAME 有权
标题翻译：小生产设备和生产系统以便
公开(公告)号：EP2960932A1
公开(公告)日：2015-12-30
申请号：EP14753798.9
申请日：2014-02-17
申请人： National Institute of Advanced Industrial Science and Technology
发明人： HARA, Shiro , MAEKAWA, Hitoshi , NAKANO, Shizuka
IPC分类号： H01L21/677
CPC分类号： H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745
摘要： [Problem to be Solved]
A production system to facilitate the commonization of front chambers among a plurality of production devices that are different in the kind of a process to be performed for a processing substrate. According to the production system of the present invention, it is possible to reduce the development cost and production cost of the production devices.
[Solution]
Control units are provided separately in a processing chamber and a front chamber of a small production device. When the processing-chamber control unit outputs a load request signal, the front-chamber control unit loads a processing substrate to the processing chamber, and outputs a load acknowledgment signal. When the load acknowledgment signal is input, the processing-chamber control unit performs a process for the processing substrate, and outputs an unload request signal after the completion of the process. When the unload request signal is input, the front-chamber control unit starts the unloading of the processing substrate, and outputs an unload acknowledgment signal when the processing substrate is unloaded from the processing chamber. When the unload acknowledgment signal is input, the processing chamber starts the preparation of the next process.

3. 发明公开

EP2852469A1 SYSTEM ARCHITECTURE FOR VACUUM PROCESSING 有权
标题翻译：系统工程师FÜREINE VAKUUMBEHANDLUNG
公开(公告)号：EP2852469A1
公开(公告)日：2015-04-01
申请号：EP13780965.3
申请日：2013-04-26
申请人： Intevac, Inc. , Bluck, Terry , Shah, Vinay , Riposan, Alex
发明人： BLUCK, Terry , SHAH, Vinay , RIPOSAN, Alex
IPC分类号： B05D3/00
CPC分类号： H01L21/67709 , H01L21/67173 , H01L21/67736 , H01L21/67739 , H01L21/67754 , H01L21/67769 , H01L21/67775 , H01L21/67778 , H01L21/67781 , H01L21/68742 , H01L21/68785
摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.
摘要翻译：用于处理等离子体室中的衬底的系统，使得所有衬底传输和加载/卸载操作在大气环境中进行，但是在真空环境中进行处理。基板在载体上通过系统传送。系统的室线性布置，使得载体从一个室直接移动到下一个室。放置在系统室上方或下方的输送机在处理完成后将载体返回到系统的进入区域。可以在系统的一侧进行基板的装载和卸载，或者可以在入口侧进行装载并在出口侧卸载。

4. 发明公开

EP2698815A2 Method and apparatus for plasma dicing a semi-conductor wafer 审中-公开
公开(公告)号：EP2698815A2
公开(公告)日：2014-02-19
申请号：EP13188083.3
申请日：2012-03-12
申请人： Plasma-Therm, LLC
发明人： Johnson, Chris , Johnson, David , Martinez, Linnell , Pays-Volard, David , Westerman, Russell
IPC分类号： H01L21/3065 , H01L21/683 , H01L21/687 , H01L21/67 , H01L21/78
CPC分类号： H01L21/78 , H01J37/321 , H01J37/32155 , H01J37/32422 , H01J37/32623 , H01J37/32642 , H01J37/32651 , H01J37/32724 , H01L21/3065 , H01L21/30655 , H01L21/31116 , H01L21/67011 , H01L21/67069 , H01L21/67739 , H01L21/68 , H01L21/6831 , H01L21/6833 , H01L21/68735 , H01L21/68742 , H01L21/782 , H01L2221/68327 , Y10S414/139
摘要： The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

5. 发明公开

EP2631937A1 Stationsanordnung zur Bearbeitung und/oder Vermessen von Halbleiterscheiben sowie Bearbeitungsverfahren 审中-公开
标题翻译：用于半导体晶片和处理方法的处理和/或测量站装置
公开(公告)号：EP2631937A1
公开(公告)日：2013-08-28
申请号：EP12156856.2
申请日：2012-02-24
申请人： Fraunhofer Gesellschaft zur Förderung der angewandten Forschung E.V.
发明人： Schellenberger, Martin , Lewke, Dirk
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68
CPC分类号： H01L21/67703 , H01L21/67109 , H01L21/67173 , H01L21/67178 , H01L21/67739 , H01L21/67778 , H01L21/68 , H01L22/10
摘要： Die vorliegende Erfindung betrifft eine Stationsanordnung zur Bearbeitung und/oder Vermessung von Halbleiterscheiben bzw. -wafern, die mindestens ein Belademodul, mindestens eine Prozessstation zum Bearbeiten der Halbleiterscheiben und/oder mindestens eine Vermessstation zum Vermessen einer Größe der Halbleiterscheiben, mindestens eine Justage-/Kühl-Station sowie mindestens einen Transportroboter, der in einem Transportgehäuse angeordnet ist, als Einzel-Module umfasst. Der Transportroboter ermöglicht den Transport der zu bearbeitenden Halbleiterscheiben zwischen dem Belademodul und der jeweiligen Prozessstation zur Bearbeitung der Halbleiterscheiben und/oder der mindestens einen Vermessstation zum Vermessen der Halbleiterscheiben. Die Erfindung betrifft die besondere Anordnung der Justage/Kühl-Station innerhalb der Stationsanordnung, so dass ein möglichst geringer Platzbedarf der einzelnen Module innerhalb der Stationsanordnung und somit eine platzsparende Bauweise der Stationsanordnung insgesamt resultiert.
摘要翻译：该装置具有一个装载模块（130），处理站（120），用于处理半导体盘（000）和/或用于测量半导体磁盘的变量的测量站（140）。甲搬运机械手（101）中的输送壳体（100）为单独的模块布置。使输送机械手允许为了测量半导体磁盘装载模块，并且为了处理该半导体磁盘respectivement处理站，和/或测量站之间待加工的半导体磁盘的运输。因此独立claimsoft被包括用于处理半导体晶片的方法。

6. 发明公开

EP1907173A4 SUBSTRATE TRANSPORT APPARATUS 有权转让
标题翻译：基片运输
公开(公告)号：EP1907173A4
公开(公告)日：2010-07-07
申请号：EP06774600
申请日：2006-07-07
申请人： BROOKS AUTOMATION INC
发明人： GILCHRIST ULYSSES , HOFMEISTER CHRISTOFER
IPC分类号： B25J9/06 , B25J9/08 , B25J9/10
CPC分类号： B25J9/02 , B25J9/0087 , B25J9/04 , B25J9/041 , B25J9/042 , B25J9/045 , B25J9/08 , B25J9/10 , B25J9/104 , B25J9/1045 , B25J9/126 , B25J18/04 , H01L21/677 , H01L21/67703 , H01L21/67706 , H01L21/67739 , H01L21/67742 , H01L21/67748 , Y10S901/15 , Y10S901/23 , Y10S901/28 , Y10T74/20305 , Y10T74/20317 , Y10T74/20329
摘要： A substrate transport apparatus having a frame, a drive section and an articulated arm. The drive section has at least one motor module that is selectable for placement in the drive section from a number of different interchangeable motor modules. Each having a different predetermined characteristic. The articulated arm has articulated joints. The arm is connected to the drive section for articulation. The arm has a selectable configuration selectable from a number of different arm configurations each having a predetermined configuration characteristic. The selection of the arm configuration is effected by selection of the at least one motor module for placement in the drive section.

7. 发明公开

EP1017085A3 Semiconductor device manufacturing apparatus employing vacuum system 失效
标题翻译： Gerätzur Herstellung einer Halbleitervorrichtung mit Vakuumsystem
公开(公告)号：EP1017085A3
公开(公告)日：2002-09-25
申请号：EP00302162.3
申请日：1996-06-07
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jeon, Jae-sun , Yang, Yun-mo , Kim, Won-yeong , Chae, Seung-ki
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , C23C14/566 , H01J37/18 , H01J37/3244 , H01J37/32743 , H01J2237/184 , H01L21/67017 , H01L21/67201 , H01L21/67739 , Y10S414/139
摘要： A semiconductor device manufacturing apparatus employing a vacuum system is provided. The system has one or more of the following features. A heating source (81) is installed in a predetermined portion of a venting-gas inlet (71). A venting speed controlling valve (61) is installed in a predetermined portion of a venting pipe (51), for controlling the speed of gas flowing from a load lock chamber (21) to a pump (41) by control of the opening thereof. The venting pipe (51) has a main pipe of different diameters to reduce the venting speed. Condensation-induced particle formation is thus reduced by preventing adiabatic expansion of the gas in the load lock chamber (21).
摘要翻译：提供一种采用真空系统的半导体器件制造装置。该系统具有以下一个或多个功能。加热源（81）安装在排气入口（71）的预定部分。排气速度控制阀61安装在排气管51的预定部分中，用于通过控制其开启来控制从负载锁定室21流向泵41的气体的速度。排气管51具有不同直径的主管以减小排气速度。因此通过防止负载锁定室（21）中的气体的绝热膨胀，从而减少了冷凝诱导的颗粒形成。

8. 发明公开

EP1017085A2 Semiconductor device manufacturing apparatus employing vacuum system 失效
标题翻译：设备用于制造具有真空系统的半导体器件
公开(公告)号：EP1017085A2
公开(公告)日：2000-07-05
申请号：EP00302162.3
申请日：2000-03-24
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jeon, Jae-sun , Yang, Yun-mo , Kim, Won-yeong , Chae, Seung-ki
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , C23C14/566 , H01J37/18 , H01J37/3244 , H01J37/32743 , H01J2237/184 , H01L21/67017 , H01L21/67201 , H01L21/67739 , Y10S414/139
摘要： A semiconductor device manufacturing apparatus employing a vacuum system is provided. The system has one or more of the following features. A heating source (81) is installed in a predetermined portion of a venting-gas inlet (71). A venting speed controlling valve (61) is installed in a predetermined portion of a venting pipe (51), for controlling the speed of gas flowing from a load lock chamber (21) to a pump (41) by control of the opening thereof. The venting pipe (51) has a main pipe of different diameters to reduce the venting speed. Condensation-induced particle formation is thus reduced by preventing adiabatic expansion of the gas in the load lock chamber (21).

9. 发明公开

EP0776026A1 Semiconductor device manufacturing apparatus employing vacuum system 失效
标题翻译： Gerätzur Herstellung einer Halbleitervorrichtung mit Vakuumsystem
公开(公告)号：EP0776026A1
公开(公告)日：1997-05-28
申请号：EP96304288.2
申请日：1996-06-07
申请人： Samsung Electronics Co., Ltd.
发明人： Jeon, Jae-sun , Yang, Yun-mo , Kim, Won-yeong , Chae, Seung-ki
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , C23C14/566 , H01J37/18 , H01J37/3244 , H01J37/32743 , H01J2237/184 , H01L21/67017 , H01L21/67201 , H01L21/67739 , Y10S414/139
摘要： A semiconductor device manufacturing apparatus employing a vacuum system is provided. The system has one or more of the following features. A heating source (81) is installed in a predetermined portion of a venting-gas inlet (71). A venting speed controlling valve (61) is installed in a predetermined portion of an exhaust pipe (51), for controlling the speed of gas flowing from a load lock chamber (21) to a pump (41) by control of the opening thereof. The exhaust pipe (51) has a main pipe of different diameters to reduce the venting speed. Condensation-induced particle formation thus reduced by preventing adiabatic expansion of the gas in the load lock chamber (21).
摘要翻译：提供一种采用真空系统的半导体器件制造装置。该系统具有以下一个或多个功能。加热源（81）安装在排气入口（71）的预定部分。排气速度控制阀61设置在排气管51的预定部分，用于通过控制其开口来控制从负载锁定室21流向泵41的气体的速度。排气管51具有不同直径的主管以减小排气速度。因此通过防止负载锁定室（21）中的气体的绝热膨胀而减少了凝结引起的颗粒形成。

10. 发明公开

EP0734056A3 Ceramic blades for semiconductor processing apparatus 失效
标题翻译： KeramikblattfürHalbleiterbearbeitungseinrichtung
公开(公告)号：EP0734056A3
公开(公告)日：1996-11-20
申请号：EP96107964.7
申请日：1994-07-13
申请人： APPLIED MATERIALS, INC.
发明人： Somekh, Sasson , Fairbairn, Kevin , Kolstoe, Gary M. , White, Gregory W. , Faraco Jr.,W.George
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , H01L21/67739 , H01L21/6838 , Y10S414/137
摘要： A semiconductor wafer processing system for processing wafers (22) from a wafer storage cassette (24) includes a wafer transfer chamber (14); a wafer storage elevator (20) within the transfer chamber; one or more wafer processing chambers (12); and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm (16); a thin flat wafer carrying blade (18) at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray (40) which is configured for removable engagement with the blade and for engaging and positively positioning a wafer (22) from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper (18') and lower (18'') halves together with defining vacuum channels and capacitive position sensors.
摘要翻译：一种用于从晶片存储盒（24）处理晶片（22）的半导体晶片处理系统包括晶片传送室（14）; 传送室内的晶片存储电梯（20）; 一个或多个晶片处理室（12）; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。当从外部接收晶片时，储存室的环境在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。传送装置包括机器人臂（16）; 在所述机器人臂的前端处的薄平坦晶片承载叶片（18），并且构造成用于从所述存储盒或电梯接合晶片; 以及晶片支撑盘（40），其被配置为可移除地与所述刀片接合并且用于接合并且将晶片（22）从所述电梯或处理室内的支撑座接合并且正确定位。当传送装置在抽空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并且有助于在运输过程中保持晶片。当晶片在大气压力下在盒和电梯之间转移时，托盘从叶片脱离并放置在电梯上的静止位置，并且通过单独的刀片执行晶片转移，其中与叶片成一体的真空拾取器。叶片包括上部（18'）和下部（18“）半部以及限定的真空通道和电容式位置传感器。

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