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1. 发明公开

EP0634787A1 Subsrate tray and ceramic blade for semiconductor processing apparatus 失效
标题翻译： Halbleiterscheibefangvorrichtung und KeramikblattfürHalbleiterbearbeitungseinrichtung。
公开(公告)号：EP0634787A1
公开(公告)日：1995-01-18
申请号：EP94305115.1
申请日：1994-07-13
申请人： APPLIED MATERIALS, INC.
发明人： Somekh, Sasson , Fairbairn, Kevin , Kolstoe, Gary M. , White, Gregory W. , Faraco Jr.,W.George
IPC分类号： H01L21/00
CPC分类号： H01L21/6838 , H01L21/67742 , H01L21/67748 , Y10S294/907 , Y10S414/137 , Y10S414/139 , Y10S414/141
摘要： A semiconductor wafer processing system for processing wafers (22) from a wafer storage cassette (24) includes a wafer transfer chamber (14); a wafer storage elevator (20) within the transfer chamber; one or more wafer processing chambers (12); and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm (16); a thin flat wafer carrying blade (18) at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray (40) which is configured for removable engagement with the blade and for engaging and positively positioning a wafer (22) from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper (18') and lower (18'') halves together with defining vacuum channels and capacitive position sensors.
摘要翻译：一种用于从晶片存储盒（24）处理晶片（22）的半导体晶片处理系统包括晶片传送室（14）; 传送室内的晶片存储电梯（20）; 一个或多个晶片处理室（12）; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。当从外部接收晶片时，储存室的环境在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。传送装置包括机器人臂（16）; 在所述机器人臂的前端处的薄平坦晶片承载叶片（18），并且构造成用于从所述存储盒或电梯接合晶片; 以及晶片支撑盘（40），其被配置为可移除地与所述刀片接合并且用于接合并且将晶片（22）从所述电梯或处理室内的支撑座接合并且正确定位。当传送装置在抽空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并且有助于在运输过程中保持晶片。当晶片在大气压力下在盒和电梯之间转移时，托盘从叶片脱离并放置在电梯上的静止位置，并且通过单独的刀片执行晶片转移，其中与叶片成一体的真空拾取器。叶片包括上部（18'）和下部（18“）半部以及限定的真空通道和电容式位置传感器。

2. 发明授权

EP0634787B1 Subsrate tray and ceramic blade for semiconductor processing apparatus 失效
标题翻译：衬底安全齿轮和用于半导体处理装置的陶瓷片
公开(公告)号：EP0634787B1
公开(公告)日：1997-05-02
申请号：EP94305115.1
申请日：1994-07-13
申请人： APPLIED MATERIALS, INC.
发明人： Somekh, Sasson , Fairbairn, Kevin , Kolstoe, Gary M. , White, Gregory W. , Faraco Jr.,W.George
IPC分类号： H01L21/00
CPC分类号： H01L21/6838 , H01L21/67742 , H01L21/67748 , Y10S294/907 , Y10S414/137 , Y10S414/139 , Y10S414/141

3. 发明公开

EP0734056A3 Ceramic blades for semiconductor processing apparatus 失效
标题翻译： KeramikblattfürHalbleiterbearbeitungseinrichtung
公开(公告)号：EP0734056A3
公开(公告)日：1996-11-20
申请号：EP96107964.7
申请日：1994-07-13
申请人： APPLIED MATERIALS, INC.
发明人： Somekh, Sasson , Fairbairn, Kevin , Kolstoe, Gary M. , White, Gregory W. , Faraco Jr.,W.George
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , H01L21/67739 , H01L21/6838 , Y10S414/137
摘要： A semiconductor wafer processing system for processing wafers (22) from a wafer storage cassette (24) includes a wafer transfer chamber (14); a wafer storage elevator (20) within the transfer chamber; one or more wafer processing chambers (12); and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm (16); a thin flat wafer carrying blade (18) at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray (40) which is configured for removable engagement with the blade and for engaging and positively positioning a wafer (22) from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper (18') and lower (18'') halves together with defining vacuum channels and capacitive position sensors.
摘要翻译：一种用于从晶片存储盒（24）处理晶片（22）的半导体晶片处理系统包括晶片传送室（14）; 传送室内的晶片存储电梯（20）; 一个或多个晶片处理室（12）; 以及晶片传送装置，用于在与传送室和电梯之间以及电梯和处理室之间的标准存储盒之间传送晶片。当从外部接收晶片时，储存室的环境在大气压之间变化，并且在将晶片转移到处理室或从处理室转移时的低于大气压。传送装置包括机器人臂（16）; 在所述机器人臂的前端处的薄平坦晶片承载叶片（18），并且构造成用于从所述存储盒或电梯接合晶片; 以及晶片支撑盘（40），其被配置为可移除地与所述刀片接合并且用于接合并且将晶片（22）从所述电梯或处理室内的支撑座接合并且正确定位。当传送装置在抽空环境中在电梯和处理室之间移动晶片时，托盘与刀片接合并且有助于在运输过程中保持晶片。当晶片在大气压力下在盒和电梯之间转移时，托盘从叶片脱离并放置在电梯上的静止位置，并且通过单独的刀片执行晶片转移，其中与叶片成一体的真空拾取器。叶片包括上部（18'）和下部（18“）半部以及限定的真空通道和电容式位置传感器。

4. 发明公开

EP0734056A2 Ceramic blades for semiconductor processing apparatus 失效
标题翻译：半导体加工设备的陶瓷刀片
公开(公告)号：EP0734056A2
公开(公告)日：1996-09-25
申请号：EP96107964.7
申请日：1994-07-13
申请人： APPLIED MATERIALS, INC.
发明人： Somekh, Sasson , Fairbairn, Kevin , Kolstoe, Gary M. , White, Gregory W. , Faraco Jr.,W.George
IPC分类号： H01L21/00
CPC分类号： H01L21/67748 , H01L21/67739 , H01L21/6838 , Y10S414/137
摘要： A semiconductor wafer processing system for processing wafers (22) from a wafer storage cassette (24) includes a wafer transfer chamber (14); a wafer storage elevator (20) within the transfer chamber; one or more wafer processing chambers (12); and a wafer transfer apparatus for transferring a wafer between a standard storage cassette adjacent and outside the transfer chamber and the elevator, and between the elevator and the processing chamber. The environment of the storage chamber varies in pressure between atmospheric when accepting wafers from outside, and a subatmospheric pressure when transferring wafers to or from a processing chamber. The transfer apparatus includes a robot arm (16); a thin flat wafer carrying blade (18) at the leading end of the robot arm and configured for engaging a wafer from the storage cassette or the elevator; and a wafer support tray (40) which is configured for removable engagement with the blade and for engaging and positively positioning a wafer (22) from the elevator, or a support pedestal within a processing chamber. When the transfer apparatus moves a wafer between the elevator and a processing chamber in an evacuated environment, the tray is engaged with the blade and helps retain the wafer during transit. When wafers are transferred between the cassette and the elevator at atmospheric pressure the tray is disengaged from the blade and placed in a rest position on the elevator, and the wafer transfer is performed by means of the blade alone with a vacuum pick integral to the blade. The blade includes upper (18') and lower (18'') halves together with defining vacuum channels and capacitive position sensors.
摘要翻译：一种用于从晶片存储盒（24）处理晶片（22）的半导体晶片处理系统包括晶片传送室（14）; 在传送室内的晶片存储升降机（20）一个或多个晶片处理室（12）; 以及晶片传送装置，用于在位于传送室附近和外部的标准储存盒与电梯之间以及电梯与处理室之间传送晶片。当从外部接收晶片时，储存室的环境在大气压力和在将晶片传送到处理室或从处理室传送时施加低于大气压力的压力之间变化。该传送设备包括机器人臂（16）; 在所述机器人臂的前端处的薄扁晶片承载刀片（18），所述薄扁晶片承载刀片（18）被配置用于从所述存储盒或所述电梯接合晶片; 以及晶片支撑托盘（40），该晶片支撑托盘（40）被配置为与刀片可移除地接合并且用于接合和可靠地将来自电梯的晶片（22）或处理室内的支撑基座定位。当传送设备在抽空环境中在升降机和处理室之间移动晶片时，托盘与叶片接合并且有助于在运送期间保持晶片。当晶片在大气压力下在盒子和升降机之间转移时，托盘与刀片脱离接合并放置在升降机上的静止位置，并且借助于刀片单独地利用与刀片集成的真空拾取装置来执行晶片传送。刀片包括上半部（18'）和下半部（18“）以及限定的真空通道和电容位置传感器。

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