会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明公开
    • METHOD AND APPARATUS FOR DETECTING BURIED DEFECTS
    • VERFAHREN UND VORRICHTUNG ZUR ERKENNUNG VERBORGENER DEFEKTE
    • EP2831908A1
    • 2015-02-04
    • EP13769920.3
    • 2013-03-26
    • Kla-Tencor Corporation
    • XIAO, HongJIANG, Ximan
    • H01L21/66H01L21/304
    • G01N23/2251H01J37/26H01J37/28H01J2237/24475H01J2237/2804H01J2237/2817
    • One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.
    • 一个实施例涉及一种检测目标微观金属特征中的掩埋缺陷的方法。 成像装置被配置为以带电粒子撞击着陆能量,使得带电粒子平均达到目标微观金属特征内的深度。 此外,成像装置被配置为滤除二次电子并检测反向散射电子。 然后操作成像装置以收集由于带电粒子的撞击而从目标微观金属特征发射的背散射电子。 将目标微观金属特征的背散射电子(BSE)图像与参考微观金属特征的BSE图像进行比较,以检测和分类埋藏缺陷。 还公开了其它实施例,方面和特征。
    • 6. 发明公开
    • Transmission electron microscope and method of observing TEM images
    • 传输电子邮件和Verfahren zum Betrachten von TEM-Bildern
    • EP2590205A2
    • 2013-05-08
    • EP12190836.2
    • 2012-10-31
    • Jeol Ltd.
    • Yamazaki, Kazuya
    • H01J37/26
    • H01J37/22H01J37/26H01J2237/2802H01J2237/2804
    • A transmission electron microscope (TEM) is offered which can reduce the effects of a magnetic field on a sample during observation of a TEM image. The transmission electron microscope (100) includes an electron beam source (2), an illumination lens (4), a first objective lens (6), a second objective lens (8), a selected area aperture (16), a projector lens (10), a detector (12), and a control portion (22). This control portion controls at least the illumination lens (4), second objective lens (8), and projector lens (10). A first plane (17) is located between the second objective lens (8) and the projector lens (10). The control portion (22) performs first sets of processing for controlling the illumination lens (4) such that an electron beam (L) hits the sample (S), controlling the second objective lens (8) such that a diffraction pattern of the sample (S) is imaged onto the first plane (17), and controlling the projector lens (10) such that a TEM image of the sample (S) formed by the second objective lens (8) is focused onto a second plane where the light-sensitive portion (13) of the detector (12) is disposed.
    • 提供透射电子显微镜(TEM),其可以在TEM图像的观察期间减少对样品的磁场的影响。 透射电子显微镜(100)包括电子束源(2),照明透镜(4),第一物镜(6),第二物镜(8),选择区域孔(16),投影透镜 (10),检测器(12)和控制部分(22)。 该控制部至少控制照明透镜(4),第二物镜(8)和投影透镜(10)。 第一平面(17)位于第二物镜(8)和投影透镜(10)之间。 控制部分(22)执行用于控制照明透镜(4)的第一组处理,使得电子束(L)撞击样品(S),控制第二物镜(8)使得样品的衍射图案 (S)被成像到第一平面(17)上,并且控制投影透镜(10),使得由第二物镜(8)形成的样本(S)的TEM图像聚焦到第二平面上,其中光 设置检测器(12)的敏感部分(13)。