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1. 发明授权

EP3104372B1 HALOGEN-FREE FLAME-RETARDANT INSULATED WIRE AND HALOGEN-FREE FLAME-RETARDANT CABLE 有权
公开(公告)号：EP3104372B1
公开(公告)日：2018-11-21
申请号：EP16171850.7
申请日：2016-05-29
申请人： Hitachi Metals, Ltd.
发明人： Iwasaki, Makoto , Kikuchi, Ryutaro , Hashimoto, Mitsuru , Oriuchi, Takuya
IPC分类号： H01B7/295 , H01B3/44
CPC分类号： H01B7/295 , H01B3/10 , H01B3/441 , H01B7/0216 , H01B7/0225
摘要： A halogen-free flame-retardant insulated wire (10) includes a conductor (11), and a single or multilayered crosslinked insulation layer (12) around the conductor (11). The insulation layer (12) has a tensile modulus of not less than 500 MPa and an elongation at break of not more than 120% in a tensile test conducted at a displacement rate of 200 mm/min, and a storage modulus of not less than 3x10 6 Pa at 125°C in a dynamic viscoelasticity test.

2. 发明授权

EP3144941B1 FLAME RETARDANT TWIN AXIAL CABLE 有权
公开(公告)号：EP3144941B1
公开(公告)日：2018-07-18
申请号：EP16197125.4
申请日：2013-02-20
申请人： 3M Innovative Properties Company
发明人： Chiu, Chuang-Wei , Gundel, Douglas B. , Lin, Haohao , Palmer, Mark T. , Pyun, Eumi
IPC分类号： H01B7/08 , H01B7/29
CPC分类号： H01B7/295 , H01B3/10 , H01B3/307 , H01B3/441 , H01B3/442 , H01B7/0807 , H01B11/203
摘要： A cable includes a plurality of conductor sets. Each conductor set extending along a length of the cable and includes two or more insulated conductors, each insulated conductor including a central conductor surrounded by a dielectric material that includes polyolefin, a brominated flame retardant, and antimony trioxide. First and second conductive shielding films are disposed on opposite first and second sides of the conductor set, including cover portions and pinched portions arranged such that, in transverse cross section, the cover portions of the first and second shielding films in combination substantially surround the conductor set, and the pinched portions of the first and second shielding films in combination form pinched portions of the conductor set on each side of the conductor set. The cable includes an adhesive layer bonding the first shielding film to the second shielding film in the pinched portions of the conductor set.

3. 发明公开

EP3198612A4 LAMINATION COMPOSITE OF BORON NITRIDE IN PAPER FOR TRANSFORMER INSULATION 审中-公开
公开(公告)号：EP3198612A4
公开(公告)日：2018-05-23
申请号：EP15844183
申请日：2015-09-25
申请人： MOMENTIVE PERFORMANCE MAT INC
发明人： QU HAO , BEMERT LADA , DELIS JOHANNES , SAFAROWSKY OLIVER
IPC分类号： H01B3/04 , H01B3/10 , H01B3/12 , H01B3/46
CPC分类号： H01B3/04 , H01B3/10 , H01B3/12 , H01B3/46
摘要： The present technology provides an electrical insulating material comprising a plurality of insulating dielectric layers and a thermally conductive layer disposed between adjacent dielectric layers, the thermally conductive layer comprising a thermally conductive filler. Additionally, the present technology also provides a method of manufacturing the electrical insulating material. The present technology also provides an electrically conductive apparatus comprising an electrically conductive material and an electrical insulating material disposed about the conductive material, the electrical insulating material comprising a first dielectric layer, a second dielectric layer overlying the first dielectric layer, and a thermally conductive layer disposed between the first and second dielectric layers, the thermally conductive layer comprising a thermally conductive filler, e.g., born nitride.

4. 发明公开

EP3200196A4 INSULATED WIRE WITH SOLDERED PORTION AND METHOD FOR MANUFACTURING SAME 有权转让
公开(公告)号：EP3200196A4
公开(公告)日：2018-05-02
申请号：EP15843144
申请日：2015-09-28
申请人： MITSUBISHI MATERIALS CORP , MITSUBISHI CABLE IND LTD
发明人： IZUMI REIKO , IIDA SHINTARO , SAKURAI HIDEAKI , IKEDA TAKESHI , HAYASHII KEN
IPC分类号： H01B7/00 , C23C2/02 , H01B7/02 , H01B13/00
CPC分类号： H01B13/0016 , C23C2/02 , H01B3/10 , H01B7/00 , H01B7/0036 , H01B7/02 , H01B7/292 , H01B13/00 , H02G1/1287
摘要： This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.

5. 发明公开

EP3200196A1 INSULATED WIRE WITH SOLDERED PORTION AND METHOD FOR MANUFACTURING SAME 有权转让
标题翻译：具有焊接部分的绝缘线和制造该部分的方法
公开(公告)号：EP3200196A1
公开(公告)日：2017-08-02
申请号：EP15843144.5
申请日：2015-09-28
申请人： Mitsubishi Materials Corporation , Mitsubishi Cable Industries, Ltd.
发明人： IZUMI, Reiko , IIDA, Shintaro , SAKURAI, Hideaki , IKEDA, Takeshi , HAYASHII, Ken
IPC分类号： H01B7/00 , C23C2/02 , H01B7/02 , H01B13/00
CPC分类号： H01B13/0016 , C23C2/02 , H01B3/10 , H01B7/00 , H01B7/0036 , H01B7/02 , H01B7/292 , H01B13/00 , H02G1/1287
摘要： This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
摘要翻译：该绝缘电线包括在导线主体的表面上形成的绝缘涂层和用于导电的焊接部分。焊接部分通过将二羧酸附着到绝缘涂层的表面上并且通过在二羧酸附着到绝缘涂层的表面上的状态下执行焊料镀覆而形成。另外，该绝缘电线的制造方法包括将二羧酸附着于成为焊接部的绝缘被膜的表面的表面处理工序和将该表面处理部浸渍在加热的焊料熔体中进行绝缘涂层。

6. 发明公开

EP3113189A1 DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT 有权
标题翻译：黛LE CH E UNG。。。。。。。。。。。。。
公开(公告)号：EP3113189A1
公开(公告)日：2017-01-04
申请号：EP16176684.5
申请日：2016-06-28
申请人： TDK Corporation
发明人： MASAOKA, Raitarou , UCHIYAMA, Hiroki , FUJII, Shohei , SHIROKAWA, Maiko
IPC分类号： H01B3/10 , C04B35/495 , H01B3/12 , H01G4/10
CPC分类号： H01B3/10 , C01G35/006 , C01P2006/40 , C04B35/495 , C04B35/62645 , C04B35/62685 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/6565 , C04B2235/6567 , C23C14/08 , H01B3/12 , H01G4/10 , H01G4/1254 , H01G4/33
摘要： A dielectric composition containing a complex oxide represented by the formula of xAO-yBO-zC 2 O 5 as the main component, wherein A represents at least one element selected from the group including Ba, Ca and Sr, B represents Mg, and C represents at least one element selected from the group including Nb and Ta, and x, y and z meet the following conditions, x+y+z=1.000, 0.198≤x≤0.375, 0.389≤y≤0.625, and x/3≤z≤x/3+1/9.
摘要翻译：含有由式xAO-yBO-zC 2 O 5表示的复合氧化物作为主要成分的电介质组合物，其中A表示选自Ba，Ca和Sr中的至少一种元素，B表示Mg，C表示选自Nb和Ta中的至少一种元素，x，y和z满足以下条件：x + y + z = 1.000，0.198‰¤x‰0.375，0.389‰¤‰‰0.625，x / 3‰¤z‰¤x/ 3 + 1/9。

7. 发明公开

EP2920225A2 REAKTIONSBESCHLEUNIGER FÜR EINE COPOLYMERISATION, ELEKTROISOLATIONSBAND, ELEKTROISOLATIONSKÖRPER UND KONSOLIDIERUNGSKÖRPER 有权
标题翻译： REAKTIONSBESCHLEUNIGERFÜREINE COPOLYMERISATION，ELEKTROISOLATIONSBAND，ELEKTROISOLATIONSKÖRPERUNDKONSOLIDIERUNGSKÖRPER
公开(公告)号：EP2920225A2
公开(公告)日：2015-09-23
申请号：EP14702779.1
申请日：2014-01-23
申请人： Siemens Aktiengesellschaft
发明人： BROCKSCHMIDT, Mario , POHLMANN, Friedhelm , RAINER, Frank
IPC分类号： C08G59/42 , C08G59/68 , H01B3/04 , H01B3/40
CPC分类号： C07F3/06 , C08G59/02 , C08G59/42 , C08G59/681 , H01B3/04 , H01B3/10 , H01B3/40
摘要： The invention relates to the use of a compound having the structural formula R
1 CO
2
- R
2 CO
2
- Zn
2+ as a reaction accelerator for the copolymerisation of a mixture of a carboxylic acid anhydride and an oxirane, wherein R
1 and R
2 are a straight-chained or branched alkyl group independently of each other
.
摘要翻译：要求使用烷基羧酸（I）的锌盐作为羧酸酐和环氧乙烷的混合物的共聚反应促进剂。使用具有式（R1CO2-→R2CO2-→Zn2 + +）（I）结构的烷基羧酸锌盐作为反应促进剂，用于共聚羧酸酐和环氧乙烷。 R1，R2：直链或支链烷基，优选正庚基，1-甲基正己基，2-甲基正己基，3-甲基正己基，4-甲基 - 正己基，5-甲基 - 正己基，3-乙基 - 正戊基，2-乙基 - 正戊基，1,1-二甲基 - 正戊基，2,2-二甲基 - 正戊基，3,3-二甲基 - 正戊基， 4,4-二甲基 - 正戊基，1,2-二甲基 - 正戊基，1,3-二甲基 - 正戊基，1,4-二甲基 - 正戊基，2,3-二甲基 - 正戊基， 2,4-二甲基 - 正戊基，3,4-二甲基 - 正戊基，1,1,2-三甲基 - 正丁基，1,1,3-三甲基 - 正丁基，三甲基正丁基，1,2,2-三甲基正丁基，2,2,3-三甲基正丁基，2,3,3三甲基正丁基，1,3,3-三甲基-N 1-丁基，1-乙基-1-甲基 - 正丁基，1-乙基-2-甲基 - 正丁基，1-乙基-3-甲基 - 正丁基，2-乙基-1-甲基 - 正丁基，2-乙基-2-甲基 - 正丁基，2-乙基-3-甲基 - 正丁基，1-异丙基 - 正丁基，2-异丙基 - 正丁基，1,1,2,2-四甲基正丙基，1,1-二乙基 - 正丙基，2,2-二甲基-1-乙基 - 正丙基，1,2-二甲基-1-乙基 - 正丙基，1-异丙基-1-甲基正丙基或1-异丙基-2-甲基 - 正丙基，6C-烷基，8-烷基，9 C-烷基或10 -烷基。独立权利要求包括：（1）电绝缘胶带，优选云母和/或氧化铝，其包含（I）; （2）一种用于电导体的电绝缘体，包括电绝缘带，其中羧酸酐和环氧乙烷的混合物在（I）存在下固化; 以及（3）旋转电机的卷绕头的固化体，包括多孔和非导电性基体，其包含（I）。

8. 发明公开

EP2742512A4 LEAD-FREE CABLE CONTAINING BISMUTH COMPOUND 审中-公开
标题翻译： WITH A WISMUT无铅电缆连接
公开(公告)号：EP2742512A4
公开(公告)日：2015-03-25
申请号：EP12821617
申请日：2012-08-10
申请人： GEN CABLE TECHNOLOGIES CORP
发明人： SARKAR AMALENDU , GERRETSEN SARAH
IPC分类号： H01B3/30 , H01B3/10 , H01B17/62
CPC分类号： H01B3/307 , C08K3/22 , H01B3/10 , H01B3/28 , H01B3/441 , H01B3/447 , C08L23/0815

9. 发明公开

EP2411987A4 NEW DIELECTRIC OXIDE FILMS AND METHOD FOR MAKING SAME 审中-公开
标题翻译： VERFAHREN ZU IHRER HERSTELLUNG的NEE DIELEKTRISCHE OXIDFILME
公开(公告)号：EP2411987A4
公开(公告)日：2015-01-07
申请号：EP10756741
申请日：2010-03-23
申请人： SBA MATERIALS INC
发明人： PHILLIPS MARK , THOMAS TRAVIS , FERGUSON SAUL
IPC分类号： H01B3/10 , C01B13/18 , C01G1/02 , C01G23/08 , C03C3/108 , C04B35/46 , C04B35/462 , C04B35/468 , C04B35/49 , C04B35/491 , C04B35/495 , C04B35/622 , C04B35/624
CPC分类号： H01B3/10 , C04B35/46 , C04B35/462 , C04B35/4682 , C04B35/49 , C04B35/491 , C04B35/495 , C04B35/62231 , C04B35/6225 , C04B35/62259 , C04B35/624 , C04B2235/3229 , C04B2235/3251 , C04B2235/3287 , C04B2235/3298 , C04B2235/3409 , C04B2235/441 , C04B2235/443 , C04B2235/444 , C04B2235/449
摘要： Dielectric oxide materials prepared by producing a sol from a mixture of a metal oxide precursor, a solvent, and an epoxide, and preparing a metal oxide material from the sol. In various versions, the mixture can also include a cosolvent, one or more additional metal oxide precursors, water, or a precursor to a glassforming oxide, or any combination thereof. The prepared dielectric oxide materials can be in the form of thin films having high &kgr; values, low electrical leakage, and low dielectric loss tangent values.
摘要翻译：通过从金属氧化物前体，溶剂和环氧化物的混合物制备溶胶，以及由溶胶制备金属氧化物材料制备的电介质氧化物材料。在各种形式中，混合物还可以包括共溶剂，一种或多种另外的金属氧化物前体，水或玻璃形成氧化物的前体，或其任何组合。制备的电介质氧化物材料可以是具有高kgr的薄膜的形式; 值，低漏电和低介电损耗角正切值。

10. 发明公开

EP2259307A3 Electronic device, conductive compositon, metal filling apparatus, and electronic decive manufacturing method 有权
标题翻译：一种电子设备，导电性组合物Metallfüllvorrichtung及其制造方法的电子设备
公开(公告)号：EP2259307A3
公开(公告)日：2014-07-02
申请号：EP10251002.1
申请日：2010-05-28
申请人： Napra Co., Ltd.
发明人： Sekine, Shigenobu , Kuwana, Yoshiharu
IPC分类号： H01L23/00 , H01L23/48 , B22D13/00 , H01B1/02 , H01L25/065 , H01L21/768 , H01L23/498 , H01L23/14
CPC分类号： H05K13/0465 , H01B3/025 , H01B3/10 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/6616 , H01L2224/0401 , H01L2224/0557 , H01L2224/1131 , H01L2224/13009 , H01L2224/13025 , H01L2224/13099 , H01L2224/812 , H01L2224/8181 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01066 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/05552 , H01L2224/8384
摘要： An electronic device includes a plurality of stacked substrates. Each of the substrates includes a semiconductor substrate, a columnar conductor, and a ring-shaped insulator. The columnar conductor extends along a thickness direction of the semiconductor substrate. The ring-shaped insulator includes an inorganic insulating layer mainly composed of a glass. The inorganic insulating layer fills a ring-shaped groove that is provided in the semiconductor substrate to surround the columnar conductor.

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