基本信息:
- 专利标题： INSULATED WIRE WITH SOLDERED PORTION AND METHOD FOR MANUFACTURING SAME
- 申请号：EP15843144 申请日：2015-09-28
- 公开(公告)号：EP3200196A4 公开(公告)日：2018-05-02
- 发明人： IZUMI REIKO , IIDA SHINTARO , SAKURAI HIDEAKI , IKEDA TAKESHI , HAYASHII KEN
- 申请人： MITSUBISHI MATERIALS CORP , MITSUBISHI CABLE IND LTD
- 专利权人： MITSUBISHI MATERIALS CORP,MITSUBISHI CABLE IND LTD
- 当前专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址： MITSUBISHI MATERIALS CORPORATION
- 优先权： JP2014197685 2014-09-28
- 主分类号： H01B7/00
- IPC分类号： H01B7/00 ; C23C2/02 ; H01B7/02 ; H01B13/00
摘要：
This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01B | 电缆；导体；绝缘体；导电、绝缘或介电材料的选择 |
| ------H01B7/00 | 按形状区分的绝缘导体或电缆 |