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    • 10. 发明公开
    • MULTILAYER SUBSTRATE STRUCTURE AND METHOD AND SYSTEM OF MANUFACTURING THE SAME
    • 多层基板结构及其制造方法和系统
    • EP2862206A2
    • 2015-04-22
    • EP13803800.5
    • 2013-06-12
    • Tivra Corporation
    • DE, IndranilMACHUCA, Francisco
    • H01L33/00H01L29/15H01L33/04
    • C30B1/02C30B23/005C30B23/025C30B25/165C30B25/183C30B25/186C30B29/403C30B29/52
    • A multilayer substrate structure comprises a substrate, a thermal matching layer formed on the substrate and a lattice matching layer above the thermal matching layer. The thermal matching layer includes at least one of molybdenum, molybdenum-copper, mullite, sapphire, graphite, aluminum-oxynitrides, silicon, silicon carbide, zinc oxides, and rare earth oxides. The lattice matching layer includes a first chemical element and a second chemical element to form an alloy. The first and second chemical element has similar crystal structures and chemical properties. The coefficient of thermal expansion of the thermal matching layer and the lattice parameter of the lattice matching layer are both approximately equal to that of a member of group III-V compound semiconductors. The lattice constant of the lattice matching layer is approximately equal to that of a member of group III-V compound semiconductor. The lattice matching layer and the thermal matching layer may be deposited on a substrate using a lateral control shutter.
    • 多层衬底结构包括衬底,在衬底上形成的热匹配层和在热匹配层上的晶格匹配层。 热匹配层包括钼,钼 - 铜,莫来石,蓝宝石,石墨,铝 - 氮氧化物,硅,碳化硅,氧化锌和稀土氧化物中的至少一种。 晶格匹配层包括第一化学元素和第二化学元素以形成合金。 第一和第二化学元素具有相似的晶体结构和化学性质。 热匹配层的热膨胀系数和晶格匹配层的晶格参数都近似等于III-V族化合物半导体的成员的热膨胀系数。 晶格匹配层的晶格常数近似等于III-V族化合物半导体的晶格常数。 晶格匹配层和热匹配层可以使用横向控制快门沉积在衬底上。