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1. 发明公开

EP2743955A1 ELECTRONIC COMPONENT 无效
标题翻译：电子元件
公开(公告)号：EP2743955A1
公开(公告)日：2014-06-18
申请号：EP12824354.0
申请日：2012-07-18
申请人： Omron Corporation
发明人： SANO, Akihiko , FUJIWARA, Takeshi , MARUYAMA, Hidenori , SEKI, Tomonori
IPC分类号： H01H59/00 , B81B7/02
CPC分类号： H01H59/0009 , B81B2201/018 , B81B2207/012 , B81B2207/095 , B81C1/00238 , B81C2203/035 , H01H2001/0078
摘要： A first member (32) is provided with an electrostatic actuator (46), and a second member (33) is provided with a drive IC (72) for driving said electrostatic actuator (46). The first member (32) and the second member (33) are joined by join parts (35 and 36) at the outer edges thereof such that the surface on which the electrostatic actuator (46) is provided and the surface on which the drive IC (72) is provided face each other. The electrostatic actuator (46) and the drive IC (72) are hermetically sealed in a space (34) enclosed by the first member (32), the second member (33), and the join parts (35 and 36). The electrostatic (46) actuator and the drive IC (72) for driving said electrostatic actuator are thus stacked vertically, making it possible to reduce the size of the mounting footprint.
摘要翻译：第一部件（32）设置有静电致动器（46），第二部件（33）设置有用于驱动所述静电致动器（46）的驱动IC（72）。第一构件（32）和第二构件（33）在其外边缘处通过接合部分（35和36）接合，使得设置有静电致动器（46）的表面和其上设置有驱动IC （72）彼此面对设置。静电致动器46和驱动IC72密封在由第一部件32，第二部件33和接合部35,36包围的空间34内。因此，用于驱动所述静电致动器的静电（46）致动器和驱动IC（72）垂直堆叠，使得可以减小安装占地面积的尺寸。

2. 发明授权

EP2506282B1 RF MEMS crosspoint switch and crosspoint switch matrix comprising RF MEMS crosspoint switches 有权
标题翻译： RF MEMS交叉点开关和交叉点开关矩阵与RF MEMS交叉点开关
公开(公告)号：EP2506282B1
公开(公告)日：2013-09-11
申请号：EP11160016.9
申请日：2011-03-28
申请人： Delfmems
发明人： Pavageau, Christophe
IPC分类号： H01H59/00 , H01P1/12
CPC分类号： H01P1/15 , B81B5/00 , B81B2201/018 , H01H1/0036 , H01H1/20 , H01H59/0009 , H01H2001/0063 , H01H2001/0084 , H01H2059/0072 , H01P1/127 , H01P3/003

3. 发明授权

EP1760036B1 MEMS device having contact and standoff bumps and method of actuating 有权
标题翻译：具有接触和支座凸块和操作的方法的MEMS装置
公开(公告)号：EP1760036B1
公开(公告)日：2012-06-13
申请号：EP06126731.6
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Dereus, Dana, R.
IPC分类号： B81B3/00 , H01H59/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00

4. 发明授权

EP1717195B1 Trilayered beam MEMS switch and related method 有权
标题翻译： MEMS开关具有三层弯曲梁和相关方法
公开(公告)号：EP1717195B1
公开(公告)日：2011-09-14
申请号：EP06118802.5
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Cunningham, Shawn, J. , Tatic-Lucic, Svetlana
IPC分类号： B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00

5. 发明公开

EP2190778A2 CARBON NANOTUBE ASSEMBLY 审中-公开
标题翻译：碳纳米管组装
公开(公告)号：EP2190778A2
公开(公告)日：2010-06-02
申请号：EP08835561.5
申请日：2008-09-26
申请人： Brigham Young University
发明人： DAVIS, Robert, C. , VANFLEET, Richard, R. , HUTCHISON, David, N.
IPC分类号： B82B1/00 , C01B31/02
CPC分类号： H01J5/18 , B81B2201/018 , B81B2203/0109 , B81C1/00031 , B82Y30/00 , B82Y40/00 , C01B32/16 , C01B32/168 , C01B2202/20 , C01B2202/34 , C01B2202/36
摘要： A carbon nanotube assembly comprises a plurality of carbon nanotubes arranged into a patterned frame (10) and extending from a base (33) of the patterned frame to a face (31) of the patterned frame, the patterned frame having a height of at least about 10 μm or greater. At least one passage (14) extends through or is defined in the patterned frame, the at least one passage extending from the base of the patterned frame to the face of the patterned frame. An interstitial material at least partially fills interstices between at least some of the carbon nanotubes.

6. 发明授权

EP1785391B1 Multi-stable electromechanical switches and methods of fabricating same 有权
标题翻译：稳定的多机电开关和它们的制备方法
公开(公告)号：EP1785391B1
公开(公告)日：2009-12-09
申请号：EP07002339.5
申请日：2004-04-16
申请人： Medtronic, Inc.
发明人： Receveur, Rogier , Habets, Philippe , Danzl, Ralph B. , Houben, Richard P. M. , Mattes, Michael F.
IPC分类号： B81B5/00 , H01H59/00 , B81B3/00
CPC分类号： H01H59/0009 , B81B3/0054 , B81B2201/018 , B81B2203/051 , H01H2001/0042 , H01H2001/0078 , Y10T29/49105

7. 发明授权

EP1717194B1 Trilayered Beam MEMS device and related methods 有权
标题翻译：三层光束MEMS器件及其相关方法
公开(公告)号：EP1717194B1
公开(公告)日：2009-05-27
申请号：EP06118800.9
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Cunningham, Shawn, J. , Tatic-Lucic, Svetlana
IPC分类号： B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00

8. 发明公开

EP1785391A2 Multi-stable electromechanical switches and methods of fabricating same 有权
标题翻译：多功能电机和电机Herstellungsverfahren
公开(公告)号：EP1785391A2
公开(公告)日：2007-05-16
申请号：EP07002339.5
申请日：2004-04-16
申请人： MEDTRONIC, INC.
发明人： The designation of the inventor has not yet been filed
IPC分类号： B81B5/00 , H01H59/00
CPC分类号： H01H59/0009 , B81B3/0054 , B81B2201/018 , B81B2203/051 , H01H2001/0042 , H01H2001/0078 , Y10T29/49105
摘要： A multi-stable electromechanical switch having an open state and a closed state, the electromechanical switch comprising: a moveable member, at least one pair of receiving terminals biased to a bias position corresponding to the open state, wherein each terminal of the at least one pair of receiving terminals is configured to interface with the moveable member in the closed state; and an actuating circuit configured to provide electrostatic energy and to thereby displace the at least one pair of receiving terminals from the bias position, and to displace the moveable member toward the bias position; wherein the receiving terminals are further configured to return towards the bias position when the electrostatic energy is removed, and to thereby create an electrical connection with the moveable member, thereby retaining the electromechanical switch in the closed state.
摘要翻译：一种具有打开状态和闭合状态的多稳定机电开关，所述机电开关包括：可移动构件，至少一对接收端子被偏置到对应于所述打开状态的偏置位置，其中所述至少一个一对接收端子被配置为在关闭状态下与可移动部件接合; 以及致动电路，其被配置为提供静电能量并且从而使所述至少一对接收端子偏离所述偏置位置，并且使所述可移动构件朝向所述偏置位置移位; 其中所述接收端子还被配置为当所述静电能量被去除时返回到所述偏置位置，并且由此与所述可移动构件形成电连接，从而将所述机电开关保持在所述关闭状态。

9. 发明公开

EP1601821A4 ELECTROPLATING PCB COMPONENTS 审中-公开
标题翻译：电镀PBC成分的
公开(公告)号：EP1601821A4
公开(公告)日：2007-03-14
申请号：EP04718225
申请日：2004-03-08
申请人： MICRO RELAY HOLDINGS PTY LTD
发明人： SEXTON BRETT , DAVIS THIMOTHY J
IPC分类号： B81B3/00 , B81C1/00 , C25D5/12 , H05K3/40
CPC分类号： B81C1/00666 , B81B2201/018 , B81B2203/0118 , B81C2201/0167 , C25D5/12 , H01H2059/0081 , H05K3/4092 , H05K2201/0311 , H05K2201/0338 , H05K2201/0397 , H05K2203/0726
摘要： Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.

10. 发明公开

EP1760746A2 MEMS device having standoff bumps and folded component 有权
标题翻译： MEMS器件具有支架凸块和折叠组件
公开(公告)号：EP1760746A2
公开(公告)日：2007-03-07
申请号：EP06126734.0
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Dereus, Dana, R.
IPC分类号： H01H59/00 , B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.
摘要翻译：根据一个实施例，提供了一种悬挂在衬底上的可移动MEMS部件。部件可以包括具有通过间隙与衬底分离的可移动电极的结构层。部件还可以包括至少一个支座凸块，该支座凸块附接到结构层并且延伸到间隙中以防止当部件移动时可移动电极与导电材料接触。结构层被折叠。

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