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1. 发明授权

EP1443017B1 Multi-metal layer MEMS structure and process for making the same 有权
公开(公告)号：EP1443017B1
公开(公告)日：2018-09-19
申请号：EP04380016.8
申请日：2004-01-22
申请人： Akustica Inc.
发明人： Gabriel, Kaigham J. , Zhu, Xu
IPC分类号： B81C1/00 , H01G5/16
CPC分类号： B81C1/00158 , B81B2201/018 , B81B2201/0257 , B81C2201/0109 , H01G5/16
摘要： The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer. In that manner, a portion of the first metal layer may form a micro-machined mesh which is released when a portion of the base sacrificial layer in the area of the micro-machined mesh is removed. Additionally, a second layer of sacrificial material and a third metal layer may be provided. A micro-machined mesh may be formed in a portion of the third metal layer. The structure of the present invention may be used to construct variable capacitors, switches and, when certain of the meshes are sealed, microspeakers and microphones.

2. 发明公开

EP2751837A4 MERGED LEGS AND SEMI-FLEXIBLE ANCHORING FOR MEMS DEVICE 审中-公开
标题翻译： FUSONIERTE腿和半柔性锚MEMS器件
公开(公告)号：EP2751837A4
公开(公告)日：2015-04-08
申请号：EP12827352
申请日：2012-09-04
申请人： CAVENDISH KINETICS INC
发明人： VAN KAMPEN ROBERTUS PETRUS , UNAMUNO ANARTZ , KNIPE RICHARD L , GADDI ROBERTO , MAHAMEED RASHED
IPC分类号： H01L27/14
CPC分类号： H01H59/0009 , B81B3/0097 , B81B7/04 , B81B2201/018 , B81B2203/0109 , B81B2203/0118 , B81B2203/0172 , B81B2203/0307
摘要： The present invention generally relates to a MEMS device having a plurality of cantilevers that are coupled together in an anchor region and/or by legs that are coupled in a center area of the cantilever. The legs ensure that each cantilever can move/release from above the RF electrode at the same voltage. The anchor region coupling matches the mechanical stiffness in all sections of the cantilever so that all of the cantilevers move together.

3. 发明公开

EP2506282A1 RF MEMS crosspoint switch and crosspoint switch matrix comprising RF MEMS crosspoint switches 有权
标题翻译： RF-MEMS-Kreuzpunktschalter和Kreuzpunktschaltermatrix mit RF-MEMS-Kreuzpunktschaltern
公开(公告)号：EP2506282A1
公开(公告)日：2012-10-03
申请号：EP11160016.9
申请日：2011-03-28
申请人： Delfmems
发明人： Pavageau, Christophe
IPC分类号： H01H59/00 , H01P1/12
CPC分类号： H01P1/15 , B81B5/00 , B81B2201/018 , H01H1/0036 , H01H1/20 , H01H59/0009 , H01H2001/0063 , H01H2001/0084 , H01H2059/0072 , H01P1/127 , H01P3/003
摘要： The RF MEMS crosspoint switch (1) comprising a first transmission (10) line and a second transmission line (11) that crosses the first transmission line ; the first transmission line (10) comprises two spaced-apart transmission line portions (100, 101), and a switch element (12) that permanently electrically connects the said two spaced-apart transmission line portions (100, 101) ; the second transmission line (11) crosses the first transmission line (10) between the two spaced-apart transmission line portions (100, 101); the RF MEMS crosspoint switch (1) further comprises actuation means (121) for actuating the switch element (12) at least between a first position, in which the switch element (12) is electrically connecting the said two spaced-apart transmission line portions (100, 101) of the first transmission line (10) and the first (10) and second (11) transmission lines are electrically disconnected, and a second position, in which the switch element (12) is electrically connecting the said two spaced-apart transmission line portions (100, 101) of the first transmission line (10) and is also electrically connecting the two transmission lines (10, 11) together.
摘要翻译： RF MEMS交叉点开关（1）包括穿过第一传输线的第一传输（10）线和第二传输线（11）; 第一传输线（10）包括两个间隔开的传输线部分（100,101）和永久地电连接所述两个间隔开的传输线部分（100,101）的开关元件（12）。所述第二传输线（11）穿过所述两个间隔开的传输线部分（100,101）之间的所述第一传输线（10）。 RF MEMS交叉点开关（1）还包括用于至少在第一位置之间致动开关元件（12）的致动装置（121），其中开关元件（12）将所述两个间隔开的传输线部分第一传输线路（10）和第一（10）和第二（11）传输线路的第一位置（100,101）被电断开;以及第二位置，其中开关元件（12）将所述两个间隔 - 所述第一传输线（10）的传输线路部分（100,101），并且还将所述两条传输线（10,11）电连接在一起。

4. 发明授权

EP1717193B1 Trilayered beam MEMS device and related methods 有权
标题翻译：三层光束MEMS器件及其相关方法
公开(公告)号：EP1717193B1
公开(公告)日：2008-10-29
申请号：EP06118798.5
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Cunningham, Shawn, J. , Tatic-Lucic, Svetlana
IPC分类号： B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00

5. 发明授权

EP1461828B1 METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SWITCHES ON CMOS COMPATIBLE SUBSTRATES 有权
标题翻译：用于生产机电MICRO SWITCH CMOS兼容SUBSTRATES
公开(公告)号：EP1461828B1
公开(公告)日：2008-01-23
申请号：EP02803310.8
申请日：2002-11-07
申请人： International Business Machines Corporation
发明人： VOLANT, Richard, P. , BISSON, John, C. , COTE, Donna R. , DALTON, Timothy, J. , GROVES, Robert, A. , PETRARCA, Kevin, S. , STEIN, Kenneth, J. , SUBBANNA, Seshadri
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81C1/00246 , B81B2201/016 , B81B2201/018 , B81B2203/0127 , B81B2207/07 , B81C1/00611 , B81C2201/0122 , B81C2203/0735 , H01G5/40 , H01H59/0009
摘要： A method of fabricating micro-electromechanical switches (MEMS) integrated with conventional semiconductor interconnect levels, using compatible processes and materials is described. The method is based upon fabricating a capacitive switch that is easily modified to produce various configurations for contact switching and any number of metal-dielectric-metal switches. The process starts with a copper damascene interconnect layer, made of metal conductors inlaid in a dielectric. All or portions of the copper interconnects are recessed to a degree sufficient to provide a capacitive air gap when the switch is in the closed state, as well as provide space for a protective layer of, e.g., Ta/TaN. The metal structures defined within the area specified for the switch act as actuator electrodes to pull down the movable beam and provide one or more paths for the switched signal to traverse. The advantage of an air gap is that air is not subject to charge storage or trapping that can cause reliability and voltage drift problems. Instead of recessing the electrodes to provide a gap, one may just add dielectric on or around the electrode. The next layer is another dielectric layer which is deposited to the desired thickness of the gap formed between the lower electrodes and the moveable beam that forms the switching device. Vias are fabricated through this dielectric to provide connections between the metal interconnect layer and the next metal layer which will also contain the switchable beam. The via layer is then patterned and etched to provide a cavity area which contains the lower activation electrodes as well as the signal paths. The cavity is then back-filled with a sacrificial release material. This release material is then planarized with the top of the dielectric, thereby providing a planar surface upon which the beam layer is constructed.

6. 发明授权

EP1489639B1 Anchorless electrostatically activated micro electromechanical system switch 有权
标题翻译：毫无根据静电激活微机电系统开关
公开(公告)号：EP1489639B1
公开(公告)日：2007-03-21
申请号：EP03026904.7
申请日：2003-11-24
申请人： NORTHROP GRUMMAN CORPORATION
发明人： Yip, David
IPC分类号： H01H59/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B5/00 , B81B2201/018 , H01H9/40 , H01H59/0009 , H01H2001/0078

7. 发明公开

EP1760746A3 MEMS device having standoff bumps and folded component 有权
标题翻译：具有支座凸块和折叠组件的MEMS装置
公开(公告)号：EP1760746A3
公开(公告)日：2007-03-14
申请号：EP06126734.0
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Dereus, Dana, R.
IPC分类号： H01H59/00 , B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves. The structural layer is folded.

8. 发明公开

EP1717193A1 Trilayered beam MEMS device and related methods 有权
标题翻译： Dreischichtige Strahl-MEMS-Einrichtung unddiesbezüglicheVerfahren
公开(公告)号：EP1717193A1
公开(公告)日：2006-11-02
申请号：EP06118798.5
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： Cunningham, Shawn, J. , Tatic-Lucic, Svetlana
IPC分类号： B81B3/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.
摘要翻译：三层梁MEMS器件及相关方法。根据一个实施例，提供一种制造三层梁的方法。该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 并且去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

9. 发明公开

EP1443017A3 Multi-metal layer MEMS structure and process for making the same 有权
标题翻译：多金属层的MEMS结构和它们的制备方法
公开(公告)号：EP1443017A3
公开(公告)日：2005-06-08
申请号：EP04380016.8
申请日：2004-01-22
申请人： Akustica Inc.
发明人： Gabriel, Kaigham J. , Zhu, Xu
IPC分类号： B81B3/00 , H04R19/00
CPC分类号： B81C1/00158 , B81B2201/018 , B81B2201/0257 , B81C2201/0109 , H01G5/16
摘要： The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer. In that manner, a portion of the first metal layer may form a micro-machined mesh which is released when a portion of the base sacrificial layer in the area of the micro-machined mesh is removed. Additionally, a second layer of sacrificial material and a third metal layer may be provided. A micro-machined mesh may be formed in a portion of the third metal layer. The structure of the present invention may be used to construct variable capacitors, switches and, when certain of the meshes are sealed, microspeakers and microphones.

10. 发明公开

EP1461816A2 MEMS DEVICE HAVING CONTACT AND STANDOFF BUMPS AND RELATED METHODS 有权
标题翻译：接触和对峙颠簸和相关程序MEMS器件
公开(公告)号：EP1461816A2
公开(公告)日：2004-09-29
申请号：EP02793903.2
申请日：2002-11-08
申请人： Coventor, Incorporated , Turnstone Systems Inc.
发明人： DEREUS, Dana, R.
IPC分类号： H01H1/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves.

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