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1. 发明公开

EP4053512A1 PROPAGATION TIME MEASUREMENT DEVICE 审中-公开
公开(公告)号：EP4053512A1
公开(公告)日：2022-09-07
申请号：EP20882140.5
申请日：2020-09-25
申请人： OMRON Corporation
发明人： YOSHITAKE, Naoki , ISHIDA, Yui , FUJIWARA, Takeshi , TSURUKAME, Yoshitaka , YAWATA, Masaki
IPC分类号： G01F1/66
摘要： A device determines a propagation time of an acoustic signal through cross-correlation analysis between a transmission signal and a reception signal. The device generates the transmission signal to satisfy (1) a ratio of a height of a peak other than a maximum peak in an autocorrelation function of the transmission signal to a height of the maximum peak being 0.8 or less and (2) a duration of the transmission signal being at least five times a shortest period of the transmission signal or at least 20 times a half width at half maximum of the autocorrelation function of the transmission signal.

2. 发明公开

EP2743955A1 ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件
公开(公告)号：EP2743955A1
公开(公告)日：2014-06-18
申请号：EP12824354.0
申请日：2012-07-18
申请人： Omron Corporation
发明人： SANO, Akihiko , FUJIWARA, Takeshi , MARUYAMA, Hidenori , SEKI, Tomonori
IPC分类号： H01H59/00 , B81B7/02
CPC分类号： H01H59/0009 , B81B2201/018 , B81B2207/012 , B81B2207/095 , B81C1/00238 , B81C2203/035 , H01H2001/0078
摘要： A first member (32) is provided with an electrostatic actuator (46), and a second member (33) is provided with a drive IC (72) for driving said electrostatic actuator (46). The first member (32) and the second member (33) are joined by join parts (35 and 36) at the outer edges thereof such that the surface on which the electrostatic actuator (46) is provided and the surface on which the drive IC (72) is provided face each other. The electrostatic actuator (46) and the drive IC (72) are hermetically sealed in a space (34) enclosed by the first member (32), the second member (33), and the join parts (35 and 36). The electrostatic (46) actuator and the drive IC (72) for driving said electrostatic actuator are thus stacked vertically, making it possible to reduce the size of the mounting footprint.
摘要翻译：第一部件（32）设置有静电致动器（46），第二部件（33）设置有用于驱动所述静电致动器（46）的驱动IC（72）。第一构件（32）和第二构件（33）在其外边缘处通过接合部分（35和36）接合，使得设置有静电致动器（46）的表面和其上设置有驱动IC （72）彼此面对设置。静电致动器46和驱动IC72密封在由第一部件32，第二部件33和接合部35,36包围的空间34内。因此，用于驱动所述静电致动器的静电（46）致动器和驱动IC（72）垂直堆叠，使得可以减小安装占地面积的尺寸。

3. 发明公开

EP1434036A3 Thermal flow sensor and method for correcting its output signal 有权
标题翻译：用于校正其输出信号热式流量传感器和方法
公开(公告)号：EP1434036A3
公开(公告)日：2005-09-21
申请号：EP03104188.2
申请日：2003-11-13
申请人： OMRON CORPORATION
发明人： FUJIWARA, Takeshi , SASAKI, Sho
IPC分类号： G01F1/696 , G01F1/684 , G01F1/692
CPC分类号： G01F1/6965 , G01F1/6845
摘要： A flow sensor (11) and a flow rate measuring method are disclosed, in which an error caused by dust attached to the flow sensor (11) is accurately corrected. A thin-film bridge unit (15) is formed on the surface of a substrate and supported in the air above a space portion of the substrate. A heater (16) and the temperature measuring unit are arranged on the surface of the bridge unit (15). The relation between the temperature measured by the temperature measuring unit in the initial state and the flow rate of the fluid to be measured is stored in the memory of an operation processing unit (28). The flow sensor (11) determines the ratio of the value of the temperature measured by the temperature measuring unit with the flow rate of zero in the initial state to the temperature measured by the temperature measuring unit with the flow rate of zero during the operation, and multiplying the measured temperature ratio by the output of the temperature measuring unit, corrects the output of the temperature measuring unit. Then, the flow rate of the fluid is determined based on the corrected value of the output of the temperature measuring unit and the relation stored in the memory device.

4. 发明公开

EP1434036A2 Thermal flow sensor and method for correcting its output signal 有权
标题翻译：澳大利亚国防科学技术大学
公开(公告)号：EP1434036A2
公开(公告)日：2004-06-30
申请号：EP03104188.2
申请日：2003-11-13
申请人： Omron Corporation
发明人： FUJIWARA, Takeshi , SASAKI, Sho
IPC分类号： G01F1/696
CPC分类号： G01F1/6965 , G01F1/6845
摘要： A flow sensor (11) and a flow rate measuring method are disclosed, in which an error caused by dust attached to the flow sensor (11) is accurately corrected. A thin-film bridge unit (15) is formed on the surface of a substrate and supported in the air above a space portion of the substrate. A heater (16) and the temperature measuring unit are arranged on the surface of the bridge unit (15). The relation between the temperature measured by the temperature measuring unit in the initial state and the flow rate of the fluid to be measured is stored in the memory of an operation processing unit (28). The flow sensor (11) determines the ratio of the value of the temperature measured by the temperature measuring unit with the flow rate of zero in the initial state to the temperature measured by the temperature measuring unit with the flow rate of zero during the operation, and multiplying the measured temperature ratio by the output of the temperature measuring unit, corrects the output of the temperature measuring unit. Then, the flow rate of the fluid is determined based on the corrected value of the output of the temperature measuring unit and the relation stored in the memory device.
摘要翻译：公开了一种流量传感器（11）和流量测量方法，其中精确地校正了附着在流量传感器（11）上的灰尘引起的误差。薄膜桥接单元（15）形成在基板的表面上并且被支撑在基板的空间部分上方的空气中。加热器（16）和温度测量单元布置在桥接单元（15）的表面上。在初始状态下由温度测量单元测量的温度与要测量的流体的流量之间的关系被存储在操作处理单元（28）的存储器中。流量传感器（11）确定在操作期间由温度测量单元测量的温度值与初始状态下的零流量与由温度测量单元测量的温度为零的流量比，并将测量的温度比乘以温度测量单元的输出，校正温度测量单元的输出。然后，基于温度测量单元的输出的校正值和存储在存储器件中的关系来确定流体的流量。

5. 发明公开

EP2677538A1 WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFACTURING WAFER LEVEL PACKAGE 审中-公开
标题翻译：包胶晶圆级芯片尺寸封装器件及其制造方法的封装晶片级上
公开(公告)号：EP2677538A1
公开(公告)日：2013-12-25
申请号：EP11858569.4
申请日：2011-03-16
申请人： Omron Corporation
发明人： OKUNO, Toshiaki , INOUE, Katsuyuki , FUJIWARA, Takeshi , SEKI, Tomonori
IPC分类号： H01L23/02
CPC分类号： H01L21/78 , B81C1/00269 , B81C1/00873 , B81C2203/019 , H01L21/50 , H01L23/10 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/0345 , H01L2224/03462 , H01L2224/04026 , H01L2224/05551 , H01L2224/05552 , H01L2224/05554 , H01L2224/05555 , H01L2224/05557 , H01L2224/2745 , H01L2224/27462 , H01L2224/29005 , H01L2224/29007 , H01L2224/29011 , H01L2224/29012 , H01L2224/29013 , H01L2224/29014 , H01L2224/29082 , H01L2224/29083 , H01L2224/29099 , H01L2224/2919 , H01L2224/3201 , H01L2224/32225 , H01L2224/83101 , H01L2224/83801 , H01L2224/8385 , H01L2224/94 , H01L2924/0002 , H01L2924/1461 , H01L2924/163 , H01L2924/351 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/83 , H01L2224/27 , H01L2224/03 , H01L2924/00014
摘要： A wafer level package (20A) according to the present invention is provided with a base wafer (22) having a plurality of semiconductor chips (1) mounted or formed on its surface and a cover wafer (23) opposite the base wafer (22). The base wafer (22) and the cover wafer (23) are joined so as to sandwich therebetween a frame-shaped seal frame (4) which seals the periphery of each semiconductor chip. A gap (24) is formed between respective seal frames (4) of mutually adjoining semiconductor chips (1). In the gap (24) between the respective seal frames (4) of the mutually adjoining semiconductor chips (1), a partial connect part (26) is provided, which mutually and partially connects both seal frames (4). Hereby, the occurrence of a crack in a seal frame can be avoided when dicing, while providing a wafer level package, a chip size package device and a method of manufacturing a wafer level package, which can suppress the occurrence of peel-off from a wafer even when a high-temperature process is applied after a wet process or after liquid cleaning.

6. 发明授权

EP1434036B1 Thermal flow sensor and method for correcting its output signal 有权
标题翻译：用于校正其输出信号热式流量传感器和方法
公开(公告)号：EP1434036B1
公开(公告)日：2013-05-15
申请号：EP03104188.2
申请日：2003-11-13
申请人： OMRON CORPORATION
发明人： FUJIWARA, Takeshi , SASAKI, Sho
IPC分类号： G01F1/696 , G01F1/684 , G01F1/692
CPC分类号： G01F1/6965 , G01F1/6845

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