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1. 发明公开

EP2880670A1 TEMPERATURSCHALTER SOWIE VERFAHREN ZUR JUSTIERUNG EINES TEMPERATURSCHALTERS 有权
标题翻译：开关温度和方法用于调整的温度开关
公开(公告)号：EP2880670A1
公开(公告)日：2015-06-10
申请号：EP13750274.6
申请日：2013-07-30
申请人： Reiter, Werner , Soukup, Peter Klaus , Reithofer, Josef
发明人： Reiter, Werner , Soukup, Peter Klaus , Reithofer, Josef
IPC分类号： H01H37/30 , H01H37/28 , H01H37/04 , H01H37/12
CPC分类号： H01H61/01 , H01H37/04 , H01H37/12 , H01H37/28 , H01H37/30 , H01H61/04
摘要： The invention relates to a temperature switch comprising a housing (2), a switching system (3) consisting of a first support (3.1) with a fixed contact (3.2) and a second support (3.3) on which a switch spring (3.4) with a switch contact (3.5) is disposed, and of a switch arrangement (4) which, depending on the temperature, effects a change in the position of the switch contact (3.5).

2. 发明公开

EP2697811A4 CHANGING THE STATE OF A SWITCH THROUGH THE APPLICATION OF POWER 审中-公开
标题翻译：通过使用性能改变开关状态
公开(公告)号：EP2697811A4
公开(公告)日：2014-11-26
申请号：EP11866905
申请日：2011-10-11
申请人： HALLIBURTON ENERGY SERV INC
发明人： BONAVIDES CLOVIS S
IPC分类号： H01H61/02 , F42C15/36 , F42C15/40 , F42C19/00 , H01H37/76 , H01H61/04
CPC分类号： H01H5/04 , F42C15/36 , F42C15/40 , F42C19/00 , H01H3/30 , H01H37/76 , H01H37/761 , H01H37/767 , H01H61/02 , H01H61/04 , H01H85/36 , H01H85/46 , H01H2037/762 , H01H2037/763

3. 发明授权

EP2126942B1 MEMS ACTUATORS AND SWITCHES 有权
标题翻译： MEMS演员和开关
公开(公告)号：EP2126942B1
公开(公告)日：2014-05-21
申请号：EP08733612.9
申请日：2008-03-17
申请人： Réseaux MEMS, Société en Commandite
发明人： MÉNARD, Stéphane , LU, Jun , GONON, Nicolas
IPC分类号： H01H3/00 , B81B3/00 , B81B5/00 , B81B7/02 , H01H3/02 , H01H61/04
CPC分类号： H01H61/04 , H01H2061/008

4. 发明公开

EP2067159A2 MICRO-ACUTUATOR AND LOCKING SWITCH 审中-公开
标题翻译：微型致动器和LOCK开关
公开(公告)号：EP2067159A2
公开(公告)日：2009-06-10
申请号：EP07837880.9
申请日：2007-09-07
申请人： LUCENT TECHNOLOGIES INC.
发明人： PARDO, Flavio
IPC分类号： H01H61/04 , B81B3/00
CPC分类号： H01H61/04 , B81B3/0024 , B81B2201/018 , H01H2001/0047 , H01H2061/006 , H01H2061/008
摘要： A micro-electromechanical actuator (100) employs metal for the hot arm (101) and silicon for at least the flexible portion of the cold arm (105). The cold arm (105) made of silicon is coupled to a metal wire (107) that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.

5. 发明授权

EP1739702B1 Starter relay 有权
标题翻译： Starterrelais
公开(公告)号：EP1739702B1
公开(公告)日：2008-08-13
申请号：EP06013057.2
申请日：2006-06-24
申请人： SANYO ELECTRIC CO., LTD.
发明人： Kobayasi, Masahide
IPC分类号： H01H61/00
CPC分类号： H01C7/025 , H01C1/014 , H01C1/1406 , H01C7/02 , H01H61/002 , H01H61/04

6. 发明授权

EP1454333B1 MEMS DEVICE HAVING A TRILAYERED BEAM AND RELATED METHODS 有权
标题翻译： MEMS器件具有三层弯曲梁和相关程序
公开(公告)号：EP1454333B1
公开(公告)日：2007-09-12
申请号：EP02797085.4
申请日：2002-11-08
申请人： WiSpry, Inc.
发明人： CUNNINGHAM, Shawn, J. , DEREUS, Dana, R. , Sett, Subham , TATIC-LUCIC, Svetlana
IPC分类号： B81B3/00 , B81B7/00 , H01H59/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

7. 发明公开

EP1454349A2 TRILAYERED BEAM MEMS DEVICE AND RELATED METHODS 有权
标题翻译：三层RAY MEMS设备及其相关方法
公开(公告)号：EP1454349A2
公开(公告)日：2004-09-08
申请号：EP02793902.4
申请日：2002-11-08
申请人： Coventor, Incorporated , Turnstone Systems Inc.
发明人： CUNNINGHAM, Shawn, J. , TATIC-LUCIC, Sveltana
IPC分类号： H01L21/302 , H01L21/4763 , H01P1/10 , H01H57/00 , H02B1/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conductive microstructure (312); depositing a structural layer (322) on the first conductive microstructure (312); the sacrificial layer (310), and the substrate (300) and forming a via through the structural layer (322) to the first conductive microstructure (312); depositing a second conductive layer (336) on the structural layer (322) and in the via; forming a second conductive microstructure (324) by removing a portion of the second conductive layer (336), wherein the second conductive microstructure (324) electrically communicates with the first conductive microstructure (312) through the via; and removing a sufficient amount of the sacrificial layer (310) so as to separate the first conductive microstructure (312) from the substrate, wherein the structural layer (322) is supported by the substrate at a first end is freely suspended above the substrate at an opposing second end.

8. 发明公开

EP1454333A1 MEMS DEVICE HAVING A TRILAYERED BEAM AND RELATED METHODS 有权
标题翻译： MEMS器件具有三层弯曲梁和相关程序
公开(公告)号：EP1454333A1
公开(公告)日：2004-09-08
申请号：EP02797085.4
申请日：2002-11-08
申请人： Conventor, Incorporated , Turnstone Systems Inc.
发明人： CUNNINGHAM, Shawn, J. , DEREUS, Dana, R. , Sett, Subham , TATIC-LUCIC, Svetlana
IPC分类号： H01H57/00
CPC分类号： B81B3/0024 , B81B3/0051 , B81B2201/014 , B81B2201/018 , B81B2203/0118 , B81B2203/04 , B81B2207/07 , B81C1/0015 , B81C2201/0107 , B81C2201/0108 , B81C2201/0109 , H01H1/04 , H01H1/504 , H01H59/0009 , H01H61/04 , H01H2001/0042 , H01H2001/0063 , H01H2001/0089 , H01H2059/0072 , H01H2061/006 , H01L23/3735 , H01L23/522 , H01L27/1203 , H01L2924/0002 , H01L2924/09701 , H02N1/006 , H02N10/00 , Y10T29/49222 , H01L2924/00
摘要： A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

9. 发明公开

EP0377271A1 Fuse wire switch 失效
标题翻译： Schmelzdrahtschalter。
公开(公告)号：EP0377271A1
公开(公告)日：1990-07-11
申请号：EP89309075.3
申请日：1989-09-07
申请人： BABCOCK INC.
发明人： Duimstra, Frederick Arie
IPC分类号： H01H71/20
CPC分类号： H01H61/04 , H01H37/767
摘要： A spring powered switching mechanism (100) in which the energy required to complete switching is stored in a spring (or springs) (3, 4) which are constrained in a "cocked" or stressed condition by a fuse wire (2). The fuse wire has the characteristic of having a relatively flat coefficient of resistivity over a large temperature range. The mechanism is operative to close (or open) electrical circuits permanently upon receipt of the appropriate electrical signal to the "fuse" or "bridge" wire which is caused to break as a result of the receipt of the electrical signal.
摘要翻译：一种弹簧供电的切换机构（100），其中完成切换所需的能量被储存在由熔断丝（2）限制在“起翘”或应力状态的弹簧（或弹簧）（3,4）中。保险丝线具有在大的温度范围内具有相对平坦的电阻系数的特性。该机构在接收到由于接收到电信号而导致断开的“熔丝”或“桥”电线的适当电信号时，可以永久地关闭（或打开）电路。

10. 发明授权

EP2768007B1 BLADE-TYPE FUSE 有权
标题翻译：扁平熔
公开(公告)号：EP2768007B1
公开(公告)日：2016-04-27
申请号：EP12839267.7
申请日：2012-10-12
申请人： Yazaki Corporation
发明人： KAWAMOTO Arata , NOMURA Syoichi , SHIMOCHI Eiji , NAKAMURA Goro
IPC分类号： H01H85/153 , H01H85/045 , H01H85/20 , H01H85/11
CPC分类号： H01H9/02 , H01H61/01 , H01H61/04 , H01H85/0456 , H01H85/11 , H01H85/153 , H01H85/203 , H01H85/204 , H01H2009/0292

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