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    • 2. 发明公开
    • Method for programming MOS and CMOS rom memories
    • Verfahren zur Pragrammierung von MOS和CMOS-ROM-Speichern。
    • EP0335148A2
    • 1989-10-04
    • EP89104165.9
    • 1989-03-09
    • SGS-THOMSON MICROELECTRONICS S.r.l.
    • Bekkering, Roland QuirinusCereda, Manlio Sergio
    • H01L21/82H01L27/10
    • H01L27/11266H01L27/112
    • A method for programming ROM memories at an advanced memory manufacture stage. The method, after defining the active regions, possibly implanting threshold-correction boron, performing gate oxidation and providing the gate regions, comprises at least partially masking the regions adjacent to the gate regions of the memory cells which must be made permanently non-conductive. During the subsequent implanting of the source and drain regions, the regions thus shielded are not implanted, so that in the programmed cells the source and/or drain regions are completely missing or in any case separated from the related gate regions by such a distance as to prevent switching on of the memory cell when reading in the memory.
    • 一种在高级存储器制造阶段对ROM存储器进行编程的方法。 该方法在定义有源区域之后,可能注入阈值校正硼,执行栅极氧化和提供栅极区域,包括至少部分地掩蔽与必须永久不导电的存储器单元的栅极区域相邻的区域。 在随后的源极和漏极区域的注入期间,这样屏蔽的区域不被植入,使得在编程的单元中源极和/或漏极区域完全缺失或者在任何情况下都与相关的栅极区域分开一段距离 以防止在读取存储器时接通存储器单元。
    • 5. 发明公开
    • Method for improving the intermediate dielectric profile, particularly for non-volatile memories
    • 为了提高中间介电曲线,特别是用于非易失性存储器的方法
    • EP0793273A1
    • 1997-09-03
    • EP96830086.3
    • 1996-02-28
    • SGS-THOMSON MICROELECTRONICS s.r.l.
    • Brambilla, ClaudioGinami, GiancarloDaffra, StefanoRavaglia, AndreaCereda, Manlio Sergio
    • H01L27/115H01L21/8247
    • H01L27/11521H01L27/115
    • A method for improving the intermediate dielectric profile, particularly for non-volatile memories constituted by a plurality of cells, which comprises the following steps:

      -- forming field oxide regions (14) and drain active area regions (15) on a substrate (1);
      -- forming word lines (16) on the field oxide regions (14);
      -- depositing oxide to form oxide wings (13) that are adjacent to the word lines (16);
         characterized in that it comprises the following additional steps:

      -- opening, by masking (20), source regions (18) and the drain active area regions (15), keeping the field oxide regions (14) that separate one memory cell from the other, inside the memory, covered with resist; and
      -- removing field oxide (14) in the source regions (18) and removing oxide wings (13) from both sides of the word lines (16).
    • 一种提高在中间电介质分布,特别是用于通过细胞的复数,其包括以下步骤构成的非易失性存储器的方法: - 形成场氧化区(14)和漏有源区的区域(15)上的基板(1 ); - 形成字线(16)上的场氧化区(14); - (13)做了沉积氧化,从而形成氧化翼邻近于字线(16); 在这样做是包括下列附加步骤,其特征在于: - 开口,通过掩蔽(20),源极区(18)和漏有源区的区域(15),保持场氧化区(14)做了单独的一个存储器单元从所述 其他,存储器,覆盖有抗蚀剂的内部; 和 - 从所述字线(16)的bothsides除去在源极区(18)和除去氧化物翼(13)的场氧化物(14)。
    • 6. 发明公开
    • Lithographic image size reduction
    • Lithographische Reduzierung derBildgrösse。
    • EP0655773A1
    • 1995-05-31
    • EP93830427.6
    • 1993-10-27
    • SGS-THOMSON MICROELECTRONICS S.r.l.
    • Brambilla, ClaudioCereda, Manlio SergioRavaglia, Andrea
    • H01L21/033H01L21/308
    • H01L21/0337H01L21/0338
    • A mask having features of a smaller size than a lithographically defined image width is formed by depositing a first layer of a different material from the underlying material to be treated through the openings of the mask. This first layer is lithographically patterned and thereafter a conformally deposited second layer is anisotropically etched, thus leaving residues on vertical definition walls of the first layer. The mask openings are restricted to a controllably reduced width as compared with the width of the lithographically defined window. Empirical relationships between the thicknesses of the deposited layers and the reduction of the lithographic image size that is achieved provide a good dimensional control of the mask openings that are finally produced, adequate for sub-micron line-width processes.
    • 具有比光刻图像宽度小的特征的掩模通过从掩模的开口沉积不同材料的第一层与待处理的下层材料而形成。 该第一层被光刻图案化,其后共形沉积的第二层被各向异性地蚀刻,从而在第一层的垂直定义壁上留下残留物。 与光刻定义的窗口的宽度相比,掩模开口被限制为可控制地减小的宽度。 沉积层的厚度与实现的平版印刷图像尺寸的减小之间的经验关系提供了最终产生的足够用于亚微米线宽工艺的掩模开口的良好尺寸控制。
    • 7. 发明公开
    • Method for programming MOS and CMOS rom memories
    • 编程MOS和CMOS ROM存储器的方法
    • EP0335148A3
    • 1990-01-24
    • EP89104165.9
    • 1989-03-09
    • SGS-THOMSON MICROELECTRONICS S.r.l.
    • Bekkering, Roland QuirinusCereda, Manlio Sergio
    • H01L21/82H01L27/10
    • H01L27/11266H01L27/112
    • A method for programming ROM memories at an advanced memory manufacture stage. The method, after defining the active regions, possibly implanting threshold-correction boron, performing gate oxidation and providing the gate regions, comprises at least partially masking the regions adjacent to the gate regions of the memory cells which must be made permanently non-conductive. During the subsequent implanting of the source and drain regions, the regions thus shielded are not implanted, so that in the programmed cells the source and/or drain regions are completely missing or in any case separated from the related gate regions by such a distance as to prevent switching on of the memory cell when reading in the memory.
    • 一种在高级存储器制造阶段对ROM存储器进行编程的方法。 该方法在定义有源区域之后,可能注入阈值校正硼,执行栅极氧化和提供栅极区域,包括至少部分地掩蔽与必须永久不导电的存储器单元的栅极区域相邻的区域。 在随后的源极和漏极区域的注入期间,这样屏蔽的区域不被植入,使得在编程的单元中源极和/或漏极区域完全缺失或者在任何情况下都与相关的栅极区域分开一段距离 以防止在读取存储器时接通存储器单元。