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1. 发明公开

EP2516048A2 HEAT TREATMENT CONTAINER FOR VACUUM HEAT TREATMENT APPARATUS 有权
标题翻译：热处理容器的真空热处理的设备
公开(公告)号：EP2516048A2
公开(公告)日：2012-10-31
申请号：EP10839825.6
申请日：2010-12-24
申请人： LG Innotek Co., Ltd.
发明人： KIM, Byung Sook , KIM, Min Sung , CHAI, Kyoung Hoon
IPC分类号： B01J3/03 , F27D7/06 , F27B5/05 , C01B31/36
CPC分类号： F27D7/06 , C01B32/956 , F27B5/04 , F27B5/16
摘要： Provided is a heat treatment container for a vacuum heat treatment apparatus. The heat treatment container includes a bottom and a sidewall. An exhaust passage is defined in an upper portion of the sidewall.

2. 发明授权

EP3343647B1 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE COMPRISING SAME 有权转让
公开(公告)号：EP3343647B1
公开(公告)日：2019-12-18
申请号：EP16839644.8
申请日：2016-08-25
申请人： LG Innotek Co., Ltd.
发明人： PARK, Su Ik , KIM, Min Sung , SUNG, Youn Joon , LEE, Yong Gyeong , CHOI, Kwang Yong
IPC分类号： H01L33/46 , H01L33/36 , H01L33/38 , H01L33/40 , H01L33/08

3. 发明授权

EP2516048B1 HEAT TREATMENT CONTAINER FOR VACUUM HEAT TREATMENT APPARATUS 有权
公开(公告)号：EP2516048B1
公开(公告)日：2019-10-02
申请号：EP10839825.6
申请日：2010-12-24
申请人： LG Innotek Co., Ltd.
发明人： KIM, Byung Sook , KIM, Min Sung , CHAI, Kyoung Hoon
IPC分类号： F27B5/04 , F27B5/16 , C01B32/956 , F27D7/06

4. 发明公开

EP3343647A1 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE COMPRISING SAME 有权转让
公开(公告)号：EP3343647A1
公开(公告)日：2018-07-04
申请号：EP16839644.8
申请日：2016-08-25
申请人： LG Innotek Co., Ltd.
发明人： PARK, Su Ik , KIM, Min Sung , SUNG, Youn Joon , LEE, Yong Gyeong , CHOI, Kwang Yong
IPC分类号： H01L33/46 , H01L33/36
摘要： Embodiments disclose a light-emitting device including a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a first recess and a second recess passing through the second conductive semiconductor layer and the active layer and disposed up to a partial region of the first conductive semiconductor layer, a connection electrode disposed inside the first recess and electrically connected to the first conductive semiconductor layer, a reflective layer disposed inside the second recess, and an insulation layer configured to electrically insulate the reflective layer and the light-emitting structure, and a light-emitting device package including the same.

5. 发明公开

EP3511990A1 SEMICONDUCTOR DEVICE 有权转让
公开(公告)号：EP3511990A1
公开(公告)日：2019-07-17
申请号：EP17849159.3
申请日：2017-09-11
申请人： LG Innotek Co., Ltd.
发明人： SUNG, Youn Joon , KIM, Min Sung , LEE, Eun Dk
IPC分类号： H01L33/36 , H01L33/22 , H01L33/62 , H01L33/38 , H01L33/00 , H01L33/14 , H01L33/12 , H01L33/10 , H01L33/48
摘要： An embodiment includes a semiconductor device including a semiconductor structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first insulation layer disposed on the semiconductor structure; a first electrode disposed on the first conductive semiconductor layer; a second electrode disposed on the second conductive semiconductor layer; a first cover electrode disposed on the first electrode; a second cover electrode disposed on the second electrode; and a second insulation layer extending from an upper surface of the first cover electrode to an upper surface of the second cover electrode. The semiconductor structure includes a first surface extending from an upper surface of the first conductive semiconductor layer where the first electrode is disposed to a side surface of the active layer and an upper surface of the second conductive semiconductor where the second electrode is disposed. The first insulation layer is disposed on the first surface to be spaced apart from the first electrode. The first insulation layer is disposed on the first surface to overlap with the first cover electrode in a first direction perpendicular to the upper surface of the first conductive semiconductor layer.

6. 发明公开

EP3474337A1 SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP3474337A1
公开(公告)日：2019-04-24
申请号：EP17815692.3
申请日：2017-06-20
申请人： LG Innotek Co., Ltd.
发明人： PARK, Su Ik , SUNG, Youn Joon , KIM, Min Sung , LEE, Yong Gyeong , LEE, Eun Dk
IPC分类号： H01L33/02 , H01L33/36 , H01L33/22 , H01L33/62 , H01L33/10 , H01L33/00 , H01L33/38 , H01L33/20
摘要： An embodiment provides a semiconductor device including a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a plurality of recesses passing through the second conductive semiconductor layer and the active layer and extending to a portion of the first conductive semiconductor layer; a plurality of first electrodes disposed inside the plurality of recesses and electrically connected with the first conductive semiconductor layer; and a second electrode electrically connected with the second conductive semiconductor layer, wherein a ratio of a first area of where the plurality of first electrodes are in contact with the first conductive semiconductor layer and a second area of where the second electrode is in contact with the second conductive semiconductor layer (first area : second area) ranges from 1:3 to 1:10.

7. 发明公开

EP3537486A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING SAME 审中-公开
公开(公告)号：EP3537486A1
公开(公告)日：2019-09-11
申请号：EP17868255.5
申请日：2017-11-03
申请人： LG Innotek Co., Ltd.
发明人： SUNG, Youn Joon , KANG, Ki Man , KIM, Min Sung , PARK, Su Ik , LEE, Yong Gyeong , LEE, Eun Dk , LIM, Hyun Soo
IPC分类号： H01L33/02 , H01L33/36 , H01L33/22 , H01L33/48 , H01L33/10 , H01L33/42
摘要： Disclosed in one embodiment is a semiconductor device comprising: a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer arranged between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode electrically connected with the first conductive semiconductor layer; a second electrode electrically connected with the second conductive semiconductor layer; a reflective layer arranged on the second electrode; and a capping layer arranged on the reflective layer and including a plurality of layers, wherein the capping layer includes a first layer directly arranged on the reflective layer and the first layer includes Ti.

8. 发明公开

EP3471154A1 SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：EP3471154A1
公开(公告)日：2019-04-17
申请号：EP17810578.9
申请日：2017-06-09
申请人： LG Innotek Co., Ltd.
发明人： PARK, Su Ik , SUNG, Youn Joon , LEE, Yong Gyeong , KIM, Min Sung
IPC分类号： H01L33/00 , H01L33/02 , H01L33/22 , H01L33/10 , H01L33/38 , H01L33/58
摘要： One embodiment provides a semiconductor device comprising: a light-emitting structure which comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer and also comprises first and second recesses which pass through the active layer from the second conductive semiconductor layer and extend to the first conductive semiconductor layer; a first electrode coming into contact with the first conductive semiconductor layer from the first recess; a second electrode coming into contact with the second conductive semiconductor layer; and a reflective layer formed in the second recess, wherein the second recess has an open lower part disposed on the downside of the second conductive semiconductor layer, an upper part disposed on the first conductive semiconductor layer, and a side part extending from the lower part to the upper part, and the reflective layer comprises a reflection part disposed inside the second recess and an extension part extending from the lower part of the second recess and coming into contact with the second electrode.

9. 发明公开

EP3343644A1 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE COMPRISING SAME 有权转让
公开(公告)号：EP3343644A1
公开(公告)日：2018-07-04
申请号：EP16839634.9
申请日：2016-08-25
申请人： LG Innotek Co., Ltd.
发明人： PARK, Su Ik , KIM, Min Sung , SUNG, Youn Joon , LEE, Yong Gyeong , CHOI, Kwang Yong
IPC分类号： H01L33/26 , H01L33/36 , H01L33/12
CPC分类号： H01L33/382 , H01L33/06 , H01L33/12 , H01L33/22 , H01L33/26 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/486 , H01L33/62
摘要： An embodiment relates to a light-emitting device comprising: a light-emitting structure which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and comprises a plurality of first recesses passing through the second conductive semiconductor layer and active layer and disposed on a part of an area of the first conductive semiconductor layer; a first electrode which is electrically connected to the first conductive semiconductor layer inside the plurality of first recesses; a conductive support substrate which is electrically connected to the first electrode; a second electrode which is electrically connected to the second conductive semiconductor layer; and an insulating layer which is disposed between the conductive support substrate and second conductive semiconductor layer, wherein a second recess passes through the first conductive semiconductor layer, second conductive semiconductor layer and active layer and is disposed on a part of an area of the insulating layer.

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