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    • 2. 发明公开
    • Sense amplifier for a semiconductor memory device
    • Leseverstärkerfüreine Halbleiter-Speicheranordnung。
    • EP0244628A1
    • 1987-11-11
    • EP87104661.1
    • 1987-03-30
    • KABUSHIKI KAISHA TOSHIBAToshiba Micro-Computer Engineering Corporation
    • Atsumi, Shigeru c/o Patent DivisionTanaka, Sumio c/o Patent DivisionOtsuka, Nobuaki c/o Patent DivisionKamei, Takashi c/o Patent Division
    • G11C7/06G11C11/34
    • G11C16/3459G11C7/06G11C16/12G11C16/28G11C16/3454
    • In a sense amplifier, the first input terminal of the differential amplifier (26) is connected to a first MOS transistor (23) operating as a transfer gate, a first floating gate transistor (22) operating as a memory cell, and a first load (24). The gates of the first MOS transistor (23) and the first floating gate transistor (22) are respectively connected to the column-­select line (BL) and the word line (WL). The second input terminal of the differential amplifier (26) is connected to a second load (28), a second MOS transistor (31) operating as a transfer gate, and a second floating gate transistor (32) operating as a dummy cell. The second load (28) has the same characteristics as the first load (24). The second load (28) is composed of first and second load elements (28A, 28B). The second floating gate transistor (32) is constantly supplied with power voltage. When a shift in the thre shold voltage of the first floating gate transistor (22) is monitored, the first load element (28A) of the second load (28) is disconnected from the input terminal of the differential amplifier (26), and only the second load element (28B) remains connected to the input ter­minal. The gate of the second MOS transistor (31) is supplied with the high potential. A gradually increas­ing potential is applied to the gates of the first MOS transistor (23) and the first floating gate transistor (22). The potential is detected when the data of the first floating gate transistor changes from "0" to "1".
    • 在读出放大器中,差分放大器(26)的第一输入端连接到作为传输门工作的第一MOS晶体管(23),作为存储单元工作的第一浮栅晶体管(22)和第一负载 (24)。 第一MOS晶体管(23)和第一浮栅晶体管(22)的栅极分别连接到列选择线(BL)和字线(WL)。 差分放大器(26)的第二输入端连接到第二负载(28),作为传输栅极工作的第二MOS晶体管(31)和作为虚设单元工作的第二浮栅晶体管(32)。 第二负载(28)具有与第一负载(24)相同的特性。 第二负载(28)由第一和第二负载元件(28A,28B)组成。 第二浮栅晶体管(32)经常被供给电源电压。 当监视第一浮栅晶体管(22)的输出电压的偏移时,第二负载(28)的第一负载元件(28A)与差分放大器(26)的输入端断开,只有 第二负载元件(28B)保持连接到输入端子。 第二MOS晶体管(31)的栅极被提供高电位。 对第一MOS晶体管(23)和第一浮栅晶体管(22)的栅极施加逐渐增加的电位。 当第一浮栅晶体管的数据从“0”变为“1”时,检测电位。
    • 7. 发明公开
    • Semiconductor memory device
    • Halbleiterspeichergerät。
    • EP0249903A2
    • 1987-12-23
    • EP87108508.0
    • 1987-06-12
    • KABUSHIKI KAISHA TOSHIBA
    • Saito, Shinji c/o Patent DivisionAtsumi, Shigeru c/o Patent DivisionTanaka, Sumio c/o Patent Division
    • G11C29/00G06F11/20
    • G11C29/781G11C29/24
    • A semiconductor memory device includes a main memory cell array (30A), a redundancy memory cell array (30B), bonding pads for receiving an address signal, a row decoder (32) for selecting a row of the main memory cell array (30A), in accordance with the row address signal, and an exchange controller (46) connected to receive the address signal, which is programmable to inhibit the selective operation of the row decoder (32) to select the row of the redundancy memory cell array (32B), in response to specific address signals. The semiconductor memory device further includes bonding pads each for receiving a test signal. The exchange controller (46) is connected to receive the test signal for inhibiting the selective operation of the row decoder (32) and selecting the row of the redundancy memory cell array (30B), in response to the test signal.
    • 一种半导体存储器件,包括主存储单元阵列(30A),冗余存储单元阵列(30B),用于接收地址信号的接合焊盘,用于选择主存储单元阵列(30A)行的行解码器(32) ,和根据行地址信号的交换控制器(46),以及连接以接收地址信号的交换控制器(46),其可编程为禁止行解码器(32)的选择性操作以选择冗余存储单元阵列(32B)的行 ),以响应具体的地址信号。 半导体存储器件还包括用于接收测试信号的接合焊盘。 交换控制器46被连接以响应于测试信号而接收用于禁止行解码器(32)的选择性操作并选择冗余存储单元阵列(30B)的行的测试信号。
    • 8. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • EP0249903B1
    • 1992-05-13
    • EP87108508.0
    • 1987-06-12
    • KABUSHIKI KAISHA TOSHIBA
    • Saito, Shinji c/o Patent DivisionAtsumi, Shigeru c/o Patent DivisionTanaka, Sumio c/o Patent Division
    • G11C29/00G06F11/20
    • G11C29/781G11C29/24
    • A semiconductor memory device includes a main memory cell array (30A), a redundancy memory cell array (30B), bonding pads for receiving an address signal, a row decoder (32) for selecting a row of the main memory cell array (30A), in accordance with the row address signal, and an exchange controller (46) connected to receive the address signal, which is programmable to inhibit the selective operation of the row decoder (32) to select the row of the redundancy memory cell array (32B), in response to specific address signals. The semiconductor memory device further includes bonding pads each for receiving a test signal. The exchange controller (46) is connected to receive the test signal for inhibiting the selective operation of the row decoder (32) and selecting the row of the redundancy memory cell array (30B), in response to the test signal.
    • 一种半导体存储器件包括主存储单元阵列(30A),冗余存储单元阵列(30B),用于接收地址信号的接合焊盘,用于选择主存储单元阵列(30A)的行的行解码器(32) ,以及交换控制器(46),其被连接以接收地址信号,该地址信号是可编程的以禁止行解码器(32)的选择性操作来选择冗余存储单元阵列(32B)的行 ),以响应特定的地址信号。 该半导体存储器件还包括用于接收测试信号的接合焊盘。 响应于测试信号,交换控制器(46)被连接以接收用于禁止行解码器(32)的选择操作并选择冗余存储单元阵列(30B)的行的测试信号。