专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP1662564B1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：EP1662564B1
公开(公告)日：2018-05-30
申请号：EP04772544.5
申请日：2004-08-25
申请人： FUJIKURA LTD. , Olympus Corporation
发明人： YAMAMOTO, Satoshi , SUEMASU, Tatsuo , HIRAFUNE, Sayaka , ISOKAWA, Toshihiko , SHIOTANI, Koichi , MATSUMOTO, Kazuya
IPC分类号： H01L23/12 , H01L23/31 , H01L21/768 , H01L23/48 , H01L23/538 , H01L23/00 , H01L25/065 , H01L27/146
CPC分类号： H01L24/94 , H01L21/76898 , H01L23/481 , H01L23/5389 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/02372 , H01L2224/0401 , H01L2224/13024 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15788 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.

2. 发明公开

EP1662564A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：EP1662564A1
公开(公告)日：2006-05-31
申请号：EP04772544.5
申请日：2004-08-25
申请人： FUJIKURA LTD. , Olympus Corporation
发明人： YAMAMOTO, Satoshi , SUEMASU, Tatsuo , HIRAFUNE, Sayaka , ISOKAWA, Toshihiko , SHIOTANI, Koichi , MATSUMOTO, Kazuya
IPC分类号： H01L23/12
CPC分类号： H01L24/94 , H01L21/76898 , H01L23/481 , H01L23/5389 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L2224/02372 , H01L2224/0401 , H01L2224/13024 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15788 , H01L2924/16195 , H01L2924/3025 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.

3. 发明公开

EP2388816A1 SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE 审中-公开
标题翻译：半导体传感器装置，方法用于制造半导体传感器装置，封装方法KAPSELUNGSHERSTELLUNG，模块方法生产模块和电子设备
公开(公告)号：EP2388816A1
公开(公告)日：2011-11-23
申请号：EP09840312.4
申请日：2009-12-18
申请人： Fujikura, Ltd.
发明人： YAMAMOTO, Satoshi
IPC分类号： H01L25/065 , G01L9/00 , H01L25/07 , H01L25/16 , H01L25/18 , H01L29/84
CPC分类号： G01L1/18 , G01P1/023 , H01L23/057 , H01L23/525 , H01L24/02 , H01L24/16 , H01L2224/0236 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0401 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/13562 , H01L2224/14131 , H01L2224/14135 , H01L2224/73207 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor sensor device is provided which is composed of: a semiconductor sensor chip that includes a first substrate (21), a sensor circuit (23B) formed on the first substrate (21), a first conductive portion (23C) electrically connected to the sensor circuit (23B), and a first redistribution layer (25) electrically connected to the first conductive portion (23C); a semiconductor chip that includes a second substrate (31), a processing circuit, formed on the second substrate (31), that processes an electrical signal output from the sensor circuit (23B), a second conductive portion (33) electrically connected to the processing circuit, and a second redistribution layer (35) electrically connected to the second conductive portion (33); and a conductive connection component that electrically connects the first redistribution layer (25) and the second redistribution layer (35), wherein at least one of the thickness of the first redistribution layer (25) and the thickness of the second redistribution layer (35) is 8 to 20 µm.
摘要翻译：一种半导体传感器装置提供的所有它是由：一个半导体传感器芯片做包括一第一基材（21），形成在第一基片（21）的传感器电路（23B），第一导电部分（23℃），电连接到传感器电路（23B），和一个第一重分布层（25）电连接到所述第一导电部分（23℃）; 半导体芯片做包括第二基板（31），一个处理电路，形成在第二基板（31）上，做了流程，以电信号输出来自传感器电路（23B），第二导电部分（33）电连接到所述处理电路和第二重分布层（35）电连接到所述第二导电部分（33）; 和导电连接部件并电连接第一重分布层（25）和所述第二重分布层（35）worin第一重分布层（25）和所述第二重新分配层的厚度的厚度中的至少一个（35）为8〜20微米。

4. 发明授权

EP2088411B1 PRESSURE SENSOR MODULE 有权
标题翻译：压力传感器模块
公开(公告)号：EP2088411B1
公开(公告)日：2015-05-06
申请号：EP07831765.8
申请日：2007-11-13
申请人： FUJIKURA LTD.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Mikio
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L9/0054

5. 发明公开

EP2453724A1 THROUGH-WIRING BOARD AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：穿透布线板及其制造方法
公开(公告)号：EP2453724A1
公开(公告)日：2012-05-16
申请号：EP10796870.3
申请日：2010-06-22
申请人： Fujikura, Ltd.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Hirokazu
IPC分类号： H05K1/11 , H01L23/15 , H05K1/02 , H05K3/00 , H05K3/40
CPC分类号： H05K3/101 , H01L23/15 , H01L23/473 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/0272 , H05K3/4053 , H05K2201/09272 , H01L2924/00
摘要： A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.
摘要翻译：贯通布线基板包括具有第一面和第二面的基板，以及通过在贯通第一面和第二面之间的贯通孔中填充或形成导电性物质的膜而形成的贯通电线。通孔具有弯曲部分，该弯曲部分在通孔的纵向截面中包括弯曲成凹形的内周部分和弯曲成突出形状的外周部分，并且至少内部周边部分在纵向截面中形成为圆弧形状。

6. 发明公开

EP2219215A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：EP2219215A1
公开(公告)日：2010-08-18
申请号：EP08864653.4
申请日：2008-12-12
申请人： Fujikura, Ltd.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Hirokazu
IPC分类号： H01L23/02 , H01L27/14 , H01L29/84 , B81C3/00
CPC分类号： B81C1/00317 , B81C2201/0104 , B81C2201/0108 , B81C2201/0125 , B81C2203/0118 , B81C2203/0145 , H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.
摘要翻译：一种制造半导体器件的方法包括：键合步骤，将具有光学透明性的第一基板和具有其上设置有功能元件的表面的第二基板彼此键合，使得功能元件面向第一基板; 减薄第一和第二基板中的至少一个的减薄步骤; 以及通孔形成步骤，在第一和第二基板之间的接合部分的至少一部分中形成腔体和与腔体连通的通孔。根据本发明，可以防止由空腔的存在或不存在引起的不规则或裂缝，并且更规则地使基板变薄。此外，可以使用更便利的工艺来制造能够有助于装置和具有该装置的电子设备的小型化的半导体装置。

7. 发明公开

EP2453725A1 THROUGH-WIRING BOARD AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译： VURFAHREN ZU IHRER HERSTELLUNGDURCHFÜHRUNGSPLATTE
公开(公告)号：EP2453725A1
公开(公告)日：2012-05-16
申请号：EP10796873.7
申请日：2010-06-24
申请人： Fujikura, Ltd.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Hirokazu
IPC分类号： H05K1/11 , H01L23/36 , H05K1/02 , H05K3/00 , H05K3/40
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0272 , H05K1/115 , H05K3/101 , H05K3/42 , H05K2201/09245 , H05K2201/09845 , H05K2201/09981 , H01L2924/00
摘要： A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate.
摘要翻译：通过布线基板包括具有第一面和第二面的基板，以及通过在贯通第一面和第二面之间的通孔中填充或形成导电性物质的膜而形成的多根贯通丝第二面。通线彼此分离，并且在基板的平面图中包括至少一个重叠部分。

8. 发明公开

EP2426714A1 DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD 审中-公开
标题翻译：器件安装结构和器件安装方法
公开(公告)号：EP2426714A1
公开(公告)日：2012-03-07
申请号：EP10769514.0
申请日：2010-04-28
申请人： Fujikura, Ltd.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Hirokazu
IPC分类号： H01L25/065 , H01L23/473 , H01L25/07 , H01L25/18 , H05K1/11 , H05K3/46
CPC分类号： H05K1/181 , H01L23/3128 , H01L23/49827 , H01L23/49838 , H01L24/06 , H01L24/16 , H01L25/0657 , H01L2224/0401 , H01L2224/05555 , H01L2224/16235 , H01L2225/06517 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15184 , H01L2924/15311 , H01L2924/15321 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/181 , H05K1/0272 , H05K1/115 , H05K2201/09836 , H05K2201/10545 , Y02P70/611 , Y10T29/49124 , H01L2924/00
摘要： A device mounting structure including: a interposer substrate that includes a substrate and a plurality of through-hole interconnection that are formed within a plurality of through holes that penetrate the substrate from a first principal surface that is one principal surface of the substrate to a second principal surface that is the other principal surface; a first device that includes a plurality of electrodes, with the electrodes arranged so as to face the first principal surface; and a second device that includes a plurality of electrodes whose arrangement is different from the arrangement of the electrodes of the first device, with the electrodes arranged so as to face the second principal surface, wherein each through-hole interconnection includes a first conductive portion that is provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion that is provided at a position on the second principal surface corresponding to the electrode of the second device, each electrode of the first device is electrically connected with the first conductive portion, and each electrode of the second device is electrically connected with the second conductive portion.
摘要翻译： 1。一种器件安装结构，包括：中介层基板，其包括基板和多个通孔互连，所述多个通孔互连形成在多个通孔中，所述多个通孔从基板的一个主表面的第一主表面穿透到基板的第二表面主表面是另一主表面; 第一装置，其包括多个电极，并且所述电极被布置成面向所述第一主表面; 以及第二器件，所述第二器件包括多个电极，所述多个电极的布置与所述第一器件的所述电极的布置不同，所述电极布置成面向所述第二主表面，其中每个所述通孔互连包括第一导电部分，所述第一导电部分设置在与所述第一设备的电极对应的所述第一主面上的位置处，以及设置在所述第二主面上与所述第二设备的电极对应的位置处的第二导电部分，所述第一设备与所述第一导电部分电连接，并且所述第二器件的每个电极与所述第二导电部分电连接。

9. 发明公开

EP2088411A1 PRESSURE SENSOR MODULE 有权
标题翻译： DRUCKSENSORMODUL
公开(公告)号：EP2088411A1
公开(公告)日：2009-08-12
申请号：EP07831765.8
申请日：2007-11-13
申请人： FUJIKURA LTD.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Mikio
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L9/0054
摘要： A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging.
摘要翻译：本发明的压力传感器模块包括压力传感器和层状基板。电极布置在压力传感器的隔膜部分附近。在层叠基板中，层叠多个基板，层叠基板包含压力传感器。隔膜部分的一个面由空间部分露出。根据本发明，可以提供一种便于更小和更小尺寸的压力传感器模块，并且能够实现高密度包装。

10. 发明公开

EP1975587A1 PRESSURE SENSOR PACKAGE AND ELECTRONIC PART 审中-公开
标题翻译： DRUCKSENSORPAKET UND ELEKTRONISCHES TEIL
公开(公告)号：EP1975587A1
公开(公告)日：2008-10-01
申请号：EP07707089.4
申请日：2007-01-19
申请人： FUJIKURA LTD.
发明人： YAMAMOTO, Satoshi , HASHIMOTO, Mikio , SUZUKI, Takanao
IPC分类号： G01L9/00
CPC分类号： G01L9/0042 , G01L9/0054 , G01L19/0069 , H01L2224/48091 , H01L2924/00014
摘要： A pressure sensor package (10) of the present invention includes: a pressure sensor (11) including at least a first conductive portion (17) having a space (13) inside a central region (α) on a surface of a semiconductor substrate, a thin-plate region above the space serving as a diaphragm section (14), and pressure sensitive elements (15) arranged in the diaphragm section, the first conductive portion being arranged on a peripheral region (β) excluding the diaphragm section on the surface and electrically connected to each of the pressure sensitive elements (15); and a first bump (18) arranged on the first conductive portion and electrically connected to it, wherein the thickness D1 of the semiconductor substrate at the peripheral region, the thickness D2 of the diaphragm section, the height D3 of the space, and the remaining thickness D4 of the semiconductor substrate excluding D2 and D3 at the central region satisfy the relationships: (D2+D3)
摘要翻译：本发明的压力传感器封装（10）包括：压力传感器（11），其至少包括在半导体衬底的表面上的中心区域（±）内具有空间（13）的第一导电部分（17）在作为隔膜部分的空间上方的薄板区域和布置在隔膜部分中的压敏元件（15），第一导电部分布置在不包括表面上的隔膜部分的周边区域（2）上并且电连接到每个压敏元件（15）; 以及布置在第一导电部分上并与其电连接的第一凸块（18），其中半导体衬底在周边区域处的厚度D1，隔膜部分的厚度D2，空间的高度D3以及剩余部分除了中心区域D2和D3之外的半导体衬底的厚度D4满足以下关系：（D2 + D3）<< D4和D1几乎等于D4。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式