基本信息:
- 专利标题： SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 申请号：EP04772544.5 申请日：2004-08-25
- 公开(公告)号：EP1662564B1 公开(公告)日：2018-05-30
- 发明人： YAMAMOTO, Satoshi , SUEMASU, Tatsuo , HIRAFUNE, Sayaka , ISOKAWA, Toshihiko , SHIOTANI, Koichi , MATSUMOTO, Kazuya
- 申请人： FUJIKURA LTD. , Olympus Corporation
- 申请人地址： 5-1, Kiba 1-chome Koto-ku Tokyo 135-8512 JP
- 专利权人： FUJIKURA LTD.,Olympus Corporation
- 当前专利权人： OLYMPUS CORPORATION, HACHIOJI-SHI, JP
- 当前专利权人地址： OLYMPUS CORPORATION, HACHIOJI-SHI, JP
- 代理机构： Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte - Partnerschaft mbB
- 优先权： JP2003304848 20030828; JP2003419613 20031217
- 国际公布： WO2005022631 20050310
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/31 ; H01L21/768 ; H01L23/48 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L27/146
摘要：
A semiconductor package of the invention comprises: a semiconductor element provided with a circuit element on one surface of a semiconductor substrate; an external wiring region provided on an other surface of the semiconductor substrate; a support substrate disposed on the one surface of the semiconductor substrate; an electrode pad disposed on the one surface of the semiconductor substrate; and a through-electrode which extends from the electrode pad through to the other surface of the semiconductor substrate.
公开/授权文献:
- EP1662564A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 公开/授权日：2006-05-31
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |