专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP2587515A1 Inspection system by charged particle beam and method of manufacturing devices using the system 审中-公开
标题翻译：通过带电粒子的束，并使用该系统的制造装置的方法的测试系统
公开(公告)号：EP2587515A1
公开(公告)日：2013-05-01
申请号：EP13000328.8
申请日：2001-06-27
申请人： EBARA CORPORATION , Kabushiki Kaisha Toshiba
发明人： Nakasuji, Mamoru , Noji, Nobuharu , Satake, Tohru , Hatakeyama, Masahiro , Kimba, Toshifumi , Sobukawa, Hirosi , Yoshikawa, Shoji , Murakami, Takeshi , Watanabe, Kenji , Karimata, Tsutomu , Oowada, Shin , Saito, Mutsumi , Yamazaki, Yuichiro , Nagai, Takamitsu , Nagahama, Ichirota
IPC分类号： H01J37/063 , H01J37/29 , H01L21/027 , H01L21/66 , G03F1/86
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; ; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：在包括由电子束检查装置70具有为电子 - 光学系统，用于从在电子束源与一次电子束照射物体的电子光学器件，和用电子投射用于检测所述二次电子图像检测器光学系统; 用于保持和相对于电子光学系统中的物体移动的阶段系统50; 用于供给清洁气体至该物体，以防止接触到物体灰尘微环境腔室20; 用于容纳所述载物台装置的工作室31，工作腔室是可控制的，以便具有一个真空气氛; 至少两个装载室41，42中的微环境腔和工作腔，angepasst之间布置成unabhängig可控的，从而有一个真空气氛; ; 和用于传递环装载机60通过装载室中的对象到载置台系统。

2. 发明公开

EP1108979A2 Method and apparatus for substrate film thickness measurement and substrate processing 有权
标题翻译： Verfahren und VorrichtungfürSchichtdickenmessung und Substratverarbeitung
公开(公告)号：EP1108979A2
公开(公告)日：2001-06-20
申请号：EP00127374.7
申请日：2000-12-13
申请人： EBARA CORPORATION
发明人： Kimba, Toshifumi , Nakai, Shunsuke
IPC分类号： G01B11/06
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
摘要翻译：将圆柱形的水射流从射流喷嘴供应到基板的测量表面上，以形成在喷嘴和测量表面之间延伸的水柱。光从照射纤维发射并通过水柱传递到测量表面。由测量表面反射的光被受光纤通过水柱接收。测量计算单元基于反射光的强度来测量形成在基板上的膜的厚度。

3. 发明公开

EP2522992A3 Testing apparatus using charged particles and device manufacturing method using the testing apparatus 无效
标题翻译：利用使用这样的带电粒子和部件的制造方法的测试装置
公开(公告)号：EP2522992A3
公开(公告)日：2013-12-04
申请号：EP12005826.8
申请日：2004-04-26
申请人： Ebara Corporation
发明人： Nobuharu, Noji , Satake, Tohru , Sobukawa, Hirosi , Kimba, Toshifumi , Hatakeyama, Masahiro , Yoshikawa, Shoji , Murakami, Takeshi , Watanabe, Kenji , Karimata, Tsutomu , Suematsu, Kenichi , Tabe, Yutaka , Tajima, Ryo , Tohyama, Keiichi
IPC分类号： G01N23/225 , H01J37/05 , H01J37/28 , H01J37/29
CPC分类号： G01N23/225 , H01J37/05 , H01J37/28 , H01J2237/2441 , H01J2237/2446 , H01J2237/2817
摘要： A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 2·1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25·11.

4. 发明公开

EP2522992A2 Testing apparatus using charged particles and device manufacturing method using the testing apparatus 无效
标题翻译：利用使用这样的带电粒子和部件的制造方法的测试装置
公开(公告)号：EP2522992A2
公开(公告)日：2012-11-14
申请号：EP12005826.8
申请日：2004-04-26
申请人： Ebara Corporation
发明人： Nobuharu, Noji , Satake, Tohru , Sobukawa, Hirosi , Kimba, Toshifumi , Hatakeyama, Masahiro , Yoshikawa, Shoji , Murakami, Takeshi , Watanabe, Kenji , Karimata, Tsutomu , Suematsu, Kenichi , Tabe, Yutaka , Tajima, Ryo , Tohyama, Keiichi
IPC分类号： G01N23/225 , H01J37/28 , H01L21/66
CPC分类号： G01N23/225 , H01J37/05 , H01J37/28 , H01J2237/2441 , H01J2237/2446 , H01J2237/2817
摘要： A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 2·1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25·11.
摘要翻译：一种用于进一步提高速度，即系统改善的SEM型检查装置可以通过被提供。用于检查基板的表面的检查装置生成从电子束源2·1发射的电子交叉，然后在试样W以产生交叉的方向上的期望倍率下形成图像。当交叉通过，电子作为噪声被从交叉除去与孔径其中调节以使没有交叉变为平行电子束照射基片在所期望的截面形状。产生检查的电子束没有凹凸照度为10％或更小。从试样W放出的电子由检测器25·11检测到的

5. 发明公开

EP2365512A2 Inspection system by charged particle beam 审中-公开
标题翻译： Untersuchungsvorrichtung mit geladenen teilchenstrahlen
公开(公告)号：EP2365512A2
公开(公告)日：2011-09-14
申请号：EP11004165.4
申请日：2001-06-27
申请人： EBARA CORPORATION , Kabushiki Kaisha Toshiba
发明人： Nakasuji, Mamoru , Noji, Nobuharu , Satake, Toru , Hatakeyama, Masahiro , Kimba, Toshifumi , Sobukawa, Hirosi , Yoshikawa, Shoji , Murakami, Takeshi , Watanabe, Kenji , Karimata, Tsutomu , Oowada, Shin , Saito, Mutsumi , Yamazaki, Yuichiro , Nagai, Takamitsu , Nagahama, Ichirota
IPC分类号： H01J37/063 , H01J37/29 , H01L21/027 , H01L21/66 , H01L21/677
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; ; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：电子束的检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子光学系统;以及用于检测由电子束投影的二次电子图像的检测器，光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳舞台装置的工作室31，工作室可控制为具有真空气氛; 设置在微环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; ; 以及用于通过装载室将物体传送到舞台系统的装载器60。

6. 发明公开

EP1108979A3 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
标题翻译：方法和装置用于层厚度测量和衬底处理
公开(公告)号：EP1108979A3
公开(公告)日：2003-10-08
申请号：EP00127374.7
申请日：2000-12-13
申请人： EBARA CORPORATION
发明人： Kimba, Toshifumi , Nakai, Shunsuke
IPC分类号： B24B37/04 , B24B49/12 , H01L21/66 , G01B11/06 , B24D7/12
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683
摘要： A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.

7. 发明公开

EP2586568A3 Polishing method and polishing apparatus 审中-公开
标题翻译：抛光方法和抛光装置
公开(公告)号：EP2586568A3
公开(公告)日：2017-10-04
申请号：EP12007343.2
申请日：2012-10-25
申请人： EBARA CORPORATION
发明人： Kimba, Toshifumi
IPC分类号： B24B49/12 , B24B37/013 , B24B49/04 , B24B37/20
CPC分类号： H01L22/26 , B24B37/013 , B24B37/20 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： A polishing method capable of obtaining an accurate thickness of a silicon layer during polishing of a substrate and determining an accurate polishing end point of the substrate based on the thickness of the silicon layer obtained. The method includes: calculating relative reflectance by dividing the measured intensity of the infrared ray by predetermined reference intensity; producing spectral waveform representing relationship between the relative reflectance and wavelength of the infrared ray; performing a Fourier transform process on the spectral waveform to determine a thickness of the silicon layer and a corresponding strength of frequency component; and determining a polishing end point of the substrate based on a point of time when the determined thickness of the silicon layer has reached a predetermined target value.
摘要翻译：本发明提供一种研磨方法，该研磨方法能够在研磨基板时得到正确的硅层厚度，并且基于所得到的硅层的厚度来确定基板的精密研磨终点。该方法包括：通过将测量的红外线的强度除以预定的参考强度来计算相对反射率; 产生代表红外线的相对反射率和波长之间关系的光谱波形; 对所述频谱波形执行傅里叶变换处理以确定所述硅层的厚度和相应的频率分量的强度; 以及基于所确定的硅层的厚度已经达到预定目标值的时间点来确定衬底的抛光终点。

8. 发明公开

EP2586568A2 Polishing method and polishing apparatus 审中-公开
标题翻译： Polierverfahren und Poliervorrichtung
公开(公告)号：EP2586568A2
公开(公告)日：2013-05-01
申请号：EP12007343.2
申请日：2012-10-25
申请人： EBARA CORPORATION
发明人： Kimba, Toshifumi
IPC分类号： B24B49/12 , B24B37/013
CPC分类号： H01L22/26 , B24B37/013 , B24B37/20 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： A polishing method capable of obtaining an accurate thickness of a silicon layer during polishing of a substrate and determining an accurate polishing end point of the substrate based on the thickness of the silicon layer obtained. The method includes: calculating relative reflectance by dividing the measured intensity of the infrared ray by predetermined reference intensity; producing spectral waveform representing relationship between the relative reflectance and wavelength of the infrared ray; performing a Fourier transform process on the spectral waveform to determine a thickness of the silicon layer and a corresponding strength of frequency component; and determining a polishing end point of the substrate based on a point of time when the determined thickness of the silicon layer has reached a predetermined target value.
摘要翻译：一种抛光方法，其能够在抛光基板期间获得准确的硅层厚度，并且基于获得的硅层的厚度确定基板的精确抛光终点。该方法包括：通过将测量的红外线强度除以预定参考强度来计算相对反射率; 产生表示红外线的相对反射率和波长之间的关系的光谱波形; 对光谱波形执行傅立叶变换处理以确定硅层的厚度和相应的频率分量强度; 并且基于所确定的硅层的厚度达到预定目标值的时间点来确定衬底的抛光终点。

9. 发明公开

EP2365512A3 Inspection system by charged particle beam 审中-公开
标题翻译：与带电粒子束的检查装置
公开(公告)号：EP2365512A3
公开(公告)日：2012-01-04
申请号：EP11004165.4
申请日：2001-06-27
申请人： EBARA CORPORATION , Kabushiki Kaisha Toshiba
发明人： Nakasuji, Mamoru , Noji, Nobuharu , Satake, Toru , Hatakeyama, Masahiro , Kimba, Toshifumi , Sobukawa, Hirosi , Yoshikawa, Shoji , Murakami, Takeshi , Watanabe, Kenji , Karimata, Tsutomu , Oowada, Shin , Saito, Mutsumi , Yamazaki, Yuichiro , Nagai, Takamitsu , Nagahama, Ichirota
IPC分类号： H01J37/063 , H01J37/29 , H01L21/027 , H01L21/66 , H01L21/677 , G01N23/225 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01L21/67
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; ; and a loader 60 for transferring the object to the stage system through the loading chambers.

10. 发明授权

EP1108979B1 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus 有权
标题翻译：方法和装置用于层厚度测量和衬底处理
公开(公告)号：EP1108979B1
公开(公告)日：2006-06-14
申请号：EP00127374.7
申请日：2000-12-13
申请人： EBARA CORPORATION
发明人： Kimba, Toshifumi , Nakai, Shunsuke
IPC分类号： B24B37/04 , B24B49/12 , H01L21/66 , G01B11/06 , B24D7/12
CPC分类号： B24B37/013 , B08B1/04 , B24B49/12 , G01B11/0625 , G01B11/0683

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式