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    • 2. 发明公开
    • PROCESS FOR PRODUCING COMPOUND SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE
    • VERFAHREN ZUR HERSTELLUNG DES VERBUNDHALBLEITERSUBSTRATS UND HALBLEITERBAUELEMENT
    • EP3029716A1
    • 2016-06-08
    • EP15196973.0
    • 2008-09-12
    • Asahi Kasei EMD Corporation
    • Shibata, YoshihikoMiyahara, MasatoshiIkeda, TakashiKunimi, Yoshihisa
    • H01L21/02H01L21/203H01L21/205H01L29/26H01L43/06H01L29/267C30B25/18C30B29/40
    • H01L29/267C30B25/18C30B29/40H01L21/02381H01L21/02546H01L21/02658H01L43/065
    • The present invention relates to a compound semiconductor substrate having a reduced dislocation (defect) density at an interface between a Si substrate and a compound semiconductor layer, and a method for producing the compound semiconductor substrate. Contaminants, such as organic matter and metal, on a surface of a Si substrate were removed by subjecting the Si substrate sequentially to organic washing, acid washing and alkaline washing, whereby a flat oxide film (not shown) was formed (S31). The oxide film on the surface was removed by using an aqueous hydrogen fluoride solution having a concentration of 1.0% by weight, whereby hydrogen termination treatment was performed (S32). The Si substrate immediately after being subjected to the hydrogen termination treatment was placed in a vacuum apparatus, and then the temperature of the Si substrate was raised in a vacuum apparatus (S33). If the substrate temperature is raised without any operation, the termination hydrogen is released. Before the hydrogen was released, pre-irradiation with As was performed (S34). Thus, an interface between the Si substrate and the compound semiconductor layer was prepared. Several minutes later, irradiation with Ga and As was performed (S35). Thereby, the compound semiconductor was formed (S36).
    • 本发明涉及在Si衬底和化合物半导体层之间的界面处具有减少的位错(缺陷)密度的化合物半导体衬底及其制造方法。 通过使Si衬底依次进行有机洗涤,酸洗和碱洗,除去形成平坦氧化物膜(未图示)的Si衬底表面上的有机物和金属等污染物(S31)。 使用浓度为1.0重量%的氟化氢水溶液除去表面的氧化膜,由此进行氢终止处理(S32)。 将刚刚进行氢终止处理后的Si衬底置于真空装置中,然后在真空装置中升温Si衬底的温度(S33)。 如果衬底温度升高而没有任何操作,则释放终止氢。 在释放氢之前,进行As的预照射(S34)。 因此,制备了Si衬底和化合物半导体层之间的界面。 几分钟后,进行Ga和As的照射(S35)。 由此形成化合物半导体(S36)。
    • 4. 发明公开
    • MAGNETIC SENSOR AND METHOD FOR FABRICATING THE SAME
    • VERFAHREN ZUR HERSTELLUNG DAVON的MAGNETSENSOR
    • EP2960667A1
    • 2015-12-30
    • EP15177698.6
    • 2007-03-28
    • Asahi Kasei EMD Corporation
    • KATAOKA, MakotoKAKUTA, KatsumiYAMAGATA, YoKANAYAMA, Yuichi
    • G01R33/07H01L43/06
    • G01R33/07G01R33/0011H01L27/22H01L43/06
    • The present invention relates to a magnetic sensor with which magnetic characteristics are made extremely stable by consideration of an area of contact of a base layer of a magnetic substance and a semiconductor substrate. On a semiconductor substrate (111) a plurality of Hall elements (112a, 112b) are embedded so as to be coplanar to a top surface of the semiconductor substrate while being mutually spaced apart by a predetermined distance, and above the Hall elements and the semiconductor substrate, a base layer (114), having coefficient of thermal expansion differing from that of the Hall elements and partially covers a region of each Hall elements, is formed via a protective layer (113), and a magnetic flux concentrator (115), having an area larger than the base layer and with magnetic amplification, is formed on the base layer. An area of contact of the base layer of the magnetic substance and the semiconductor substrate is made small to lessen the generation of an offset voltage.
    • 磁传感器技术领域本发明涉及考虑到磁性物质的基底层与半导体基板的接触面积而使磁特性非常稳定的磁传感器。 在半导体衬底(111)上嵌入多个霍尔元件(112a,112b),以便与半导体衬底的顶表面共面一个预定距离相互间隔开,并且在霍尔元件和半导体 通过保护层(113)和磁通集中器(115)形成具有与霍尔元件的热膨胀系数不同的部分的基底层(114),并部分地覆盖每个霍尔元件的区域, 在基底层上形成具有大于基底层并且具有磁放大的面积的区域。 使磁性物质的基底层与半导体基板的接触面积小,以减少偏移电压的产生。