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71. 发明公开

EP3378086A1 CURRENT HANDLING IN LEGS AND ANCHORS OF RF-SWITCH 有权转让
公开(公告)号：EP3378086A1
公开(公告)日：2018-09-26
申请号：EP16804969.0
申请日：2016-11-14
申请人： Cavendish Kinetics, Inc.
发明人： VAN KAMPEN, Robertus Petrus , KNIPE, Richard L.
IPC分类号： H01H59/00 , H01G5/16 , H01G5/38 , H01H1/00 , B81B7/00
CPC分类号： H01H59/0009 , B81B7/00 , B81B7/0006 , B81B2201/01 , B81B2203/0307 , B81B2203/04 , B81B2207/07 , B81C1/00166 , H01G5/16 , H01G5/38 , H01H2001/0084 , H01H2203/026
摘要： The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling.

72. 发明授权

EP2541222B1 Dispositif de mesure de pression a sensibilite optimisee 有权
标题翻译：具有优化灵敏度的压力传感器
公开(公告)号：EP2541222B1
公开(公告)日：2018-02-21
申请号：EP12174451.0
申请日：2012-06-29
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： Robert, Philippe , Jourdan, Guillaume
IPC分类号： G01L9/00
CPC分类号： G01L9/0052 , B81B2203/0127 , B81B2203/0154 , B81B2203/0307 , B81B2203/053 , G01L9/001 , G01L9/0019 , G01L9/006 , G01L9/0073

73. 发明公开

EP3034461A1 Fabrication d'un composant horloger multi-niveaux 有权
标题翻译： Herstellung einer mehrstufigen Uhrenkomponente
公开(公告)号：EP3034461A1
公开(公告)日：2016-06-22
申请号：EP14199218.0
申请日：2014-12-19
申请人： ROLEX SA
发明人： Calame, Florian
IPC分类号： B81C99/00 , G04B15/14
CPC分类号： G03F7/0035 , B32B3/30 , B32B15/01 , B81B2203/0307 , B81C99/008 , G04B15/14
摘要： Procédé de fabrication d'un composant horloger, notamment à plusieurs niveaux, comprenant une étape de fabrication d'au moins une couche métallique (13) du composant horloger présentant une surface supérieure (15), caractérisé en ce qu'il comprend les étapes suivantes :
- E3 : Former au moins une cavité (14) dans la surface supérieure (15) de la couche métallique (13) du composant horloger ;
- E5 : Former une autre couche métallique (23) au moins partiellement superposée à ladite surface supérieure (15) comprenant une cavité (14), par un dépôt galvanique d'un métal ou d'un alliage, remplissant au moins ladite cavité (14).
摘要翻译：一种用于制造钟表部件，特别是多级钟表部件的方法，包括制造具有上表面（15）的钟表部件的至少一个金属层（13）的步骤，其中包括以下步骤：E3 ：在钟表部件的金属层（13）的上表面（15）中形成至少一个空腔（14）; E5：通过电沉积金属或合金形成至少部分地重叠在所述上表面（15）上的另一金属层（23），所述上表面包括空腔（14），填充至少所述空腔（14）。

74. 发明授权

EP2776364B1 PROCEDE AMELIORE DE REALISATION D'UN DISPOSITIF A CAVITES FORMEES ENTRE UN ELEMENT SUSPENDU REPOSANT SUR DES PLOTS ISOLANTS SEMI-ENTERRES DANS UN SUBSTRAT ET CE SUBSTRAT 有权
标题翻译：制造器件的BETWEEN孔洞改进方法悬浮元件在衬底HALBVERGRABENEN INSULATING垫和该基板
公开(公告)号：EP2776364B1
公开(公告)日：2016-01-13
申请号：EP12786958.4
申请日：2012-11-08
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： LARREY, Vincent , POLIZZI, Jean-Philippe
IPC分类号： B81C1/00 , B06B1/02
CPC分类号： B81C1/00158 , B06B1/0292 , B81B2203/0307 , B81C1/00039 , B81C2201/01 , G01D5/02

75. 发明公开

EP2953890A1 MIKROMECHANISCHES BAUELEMENT MIT EINER MEMBRANSTRUKTUR 有权
标题翻译：与膜结构的微机械结构
公开(公告)号：EP2953890A1
公开(公告)日：2015-12-16
申请号：EP14700563.1
申请日：2014-01-03
申请人： Robert Bosch GmbH
发明人： ZOELLIN, Jochen , SCHELLING, Christoph
IPC分类号： B81B3/00
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04
摘要： The invention relates to a concept for implementing micromechanical components having a substantially stress-free membrane structure comprising an edge anchoring, which can be implemented in a cost-effective manner by standard procedures of semiconductor processing. Thus, the membrane structure of such a micromechanical component (100) is implemented in a layered structure on a substrate (1), wherein the membrane structure comprises a membrane (11) which is incorporated into the layer structure via at least one spring element (12), wherein a cavern (16) is spanned by the membrane (11), such that at least one section of the membrane edge extends beyond the edge region of the cavern (16), and wherein in the overlapping region between the membrane (11) and the cavern edge region at least one anchor structure is formed. According to the invention, the anchor structure comprises at least one anchor element (21) and a through-opening (20) for the anchor element (21), wherein the anchor element (21) is structured from the layered structure above the cavern edge region and the through-opening (20) for the anchor element (21) is formed in the edge region of the membrane (11), such that a play between anchor element (21) and through-opening (20) exists, which allows for a mechanical stress relaxation of the membrane (11).

76. 发明公开

EP2822892A2 ATOMIC LAYER DEPOSITION STRENGTHENING MEMBERS AND METHOD OF MANUFACTURE 有权转让
标题翻译：加固进行核位置分离及方法元素及其制造
公开(公告)号：EP2822892A2
公开(公告)日：2015-01-14
申请号：EP13711519.2
申请日：2013-03-08
申请人： Robert Bosch GmbH , Yama, Gary , Purkl, Fabian , Liger, Matthieu , Illing, Matthias
发明人： YAMA, Gary , PURKL, Fabian , LIGER, Matthieu , ILLING, Matthias
IPC分类号： B81C1/00 , G01J5/02 , G01J5/20 , H01L27/146 , B81B3/00
CPC分类号： B81C1/00039 , B81B3/007 , B81B2201/0207 , B81B2203/0307 , B81C2201/0181 , G01J5/023 , H01L27/14649 , H01L27/14683
摘要： In one embodiment, a method of forming a semiconductor device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a first trench in the sacrificial layer, forming a first sidewall layer with a thickness of less than about 50 nm on a first sidewall of the first trench using atomic layer deposition (ALD), and removing the sacrificial layer.

77. 发明公开

EP2776364A1 PROCEDE AMELIORE DE REALISATION D'UN DISPOSITIF A CAVITES FORMEES ENTRE UN ELEMENT SUSPENDU REPOSANT SUR DES PLOTS ISOLANTS SEMI-ENTERRES DANS UN SUBSTRAT ET CE SUBSTRAT 有权
标题翻译：制造器件的BETWEEN孔洞改进方法悬浮元件在衬底HALBVERGRABENEN INSULATING垫和该基板
公开(公告)号：EP2776364A1
公开(公告)日：2014-09-17
申请号：EP12786958.4
申请日：2012-11-08
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： LARREY, Vincent , POLIZZI, Jean-Philippe
IPC分类号： B81C1/00 , B06B1/02
CPC分类号： B81C1/00158 , B06B1/0292 , B81B2203/0307 , B81C1/00039 , B81C2201/01 , G01D5/02
摘要： The invention relates to an improved process for producing a device comprising a plurality of cavities (150a, 150b) defined between a substrate (100) based on at least one given semiconductor material and a membrane (140) resting on the tops of insulating pads (104a, 104b, 104c) that protrude from the substrate, the process allowing the height of the one or more cavities to be adjusted independently of that of the insulating pads and cavities of different heights to be produced.

78. 发明公开

EP2168673A4 MICRO-PASSAGE CHIP 有权
标题翻译： MIKRODURCHGANGCHIP
公开(公告)号：EP2168673A4
公开(公告)日：2013-12-04
申请号：EP08777189
申请日：2008-06-13
申请人： HIPEP LAB , NIPPON LIGHT METAL CO
发明人： NOKIHARA KIYOSHI , OKA YASUO
IPC分类号： B01J19/00 , B01L3/00 , B81B1/00 , B81C3/00 , C07C1/32 , C07C15/12 , C07C17/26 , C07C22/08 , C07C25/22 , C07C41/30 , C07C43/225 , C12M1/00 , C12N15/09 , C40B60/02 , G01N37/00
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00819 , B01J2219/00831 , B01J2219/0086 , B01J2219/00873 , B01L3/502707 , B01L2200/0689 , B01L2300/0883 , B01L2300/12 , B81B2201/051 , B81B2201/058 , B81B2203/0307 , B81C3/001 , B81C2203/0109 , B81C2203/032
摘要： Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.

79. 发明公开

EP2495212A3 Mems devices having support structures and methods of fabricating the same 审中-公开
标题翻译：与支撑结构及其制造方法的MEMS装置
公开(公告)号：EP2495212A3
公开(公告)日：2012-10-31
申请号：EP12170329.2
申请日：2006-07-20
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Chui, Clarence , Chung, Wonsuk , Ganti, Surya Prakash , Kothari, Manish , Miles, Mark W. , Sampsell, Jeffrey Brian , Sasagawa, Teruo
IPC分类号： B81B3/00 , B81C1/00 , G02B26/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/0072 , B81B2201/047 , B81B2203/0163 , B81B2203/019 , B81B2203/0307 , B81B2203/053 , B81C1/00142 , B81C1/00666 , B81C2201/0167 , G02B26/001 , Y10S359/90
摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

80. 发明公开

EP1779413A4 MEMS DEVICE AND INTERPOSER AND METHOD FOR INTEGRATING MEMS DEVICE AND INTERPOSER 审中-公开
标题翻译： MEMS器件和集成的MEMS器件和插入插入件和方法
公开(公告)号：EP1779413A4
公开(公告)日：2012-10-31
申请号：EP05857281
申请日：2005-07-13
申请人： DRAPER LAB CHARLES S
发明人： SAWYER WILLIAM D
IPC分类号： H01L21/58 , B81B7/00 , H01L21/00 , H01L29/84
CPC分类号： B81B7/0048 , B81B2203/0307

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