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1. 发明公开

EP2546188A1 Procédé de réalisation d'une structure a membrane suspendue et à électrode enterrée 有权
标题翻译：一种用于制备具有膜悬浮的结构过程中，和埋入电极
公开(公告)号：EP2546188A1
公开(公告)日：2013-01-16
申请号：EP12175751.2
申请日：2012-07-10
申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
发明人： Giroud, Sophie , Berthelot, Audrey , Larrey, Vincent , Polizzi, Jean-Philippe , Vaudaine, Marie-Hélène
IPC分类号： B81C1/00
CPC分类号： B81B3/00 , B81B2203/04 , B81B2207/07 , B81C1/00015 , B81C1/00095 , B81C1/00166
摘要： On décrit un dispositif de type Microsystèmes et/ou Nanosystèmes comportant :
- un premier substrat (100), ou substrat intermédiaire, comportant une partie mobile (120),
- un deuxième substrat (200), ou substrat support,
- au moins une première électrode, dite électrode inférieure (102), définie dans une couche d'électrode inférieure, et une couche diélectrique (101), disposées entre le premier et le deuxième substrat, la couche diélectrique étant disposée tout ou partie entre l'électrode inférieure et le premier substrat, une partie de la couche diélectrique (101) étant éliminée pour former une cavité sous la partie mobile du système, le fond de cette cavité étant en partie constitué par la surface supérieure d'une partie de l'électrode inférieure (102) qui fait face à au moins une partie de la partie mobile;
- le premier substrat (100) comportant (111) des via traversant remplis par un matériau conducteur en contact avec ladite électrode inférieure (102).
摘要翻译：该装置具有在中间的基板（100）包括可移动质量体（120），以及包括在一个底电极层所限定的下部电极（102）的支撑基板（200），和在基板之间放置电介质层（101）。该介电层的一部分被去除以形成在可动部质量，其中，所述腔的底部是由在面向所述可动块的一部分下电极的一部分的上表面构成的模腔。中间基板包括通过填充有与所述下部电极接触的导电材料（111）的贯通。中间衬底由半导体材料构成：如硅或硅锗（SiGe）或碳化硅（SiC）或硅 - 锗 - 碳（的SiGeC）或砷化镓（GaAs）或锗（Ge）。因此独立claimsoft包括用于制造微系统和/或纳米系统类型装置的方法。

2. 发明公开

EP2138450A2 Elektrodenstruktur für ein mikromechanisches Bauelement 失效
标题翻译： Bauelement的Elektrodenstrukturfürein mikromechanisches Bauelement
公开(公告)号：EP2138450A2
公开(公告)日：2009-12-30
申请号：EP09159221.2
申请日：2009-04-30
申请人： ROBERT BOSCH GMBH
发明人： Benzel, Hubert , Schelling, Christoph
IPC分类号： B81C1/00
CPC分类号： B81C1/00166 , B81B2201/0264 , B81B2203/0127 , B81B2203/04 , B81B2203/053
摘要： Die vorliegende Erfindung schafft ein mikromechanisches Bauelement und ein entsprechendes Herstellungsverfahren. Das mikromechanische Bauelement umfasst ein Substrat (1) mit einer Vorderseite (V) und einer Rückseite (R), welches auf der Vorderseite (V) einen von einer Membran (M; M') überspannten Hohlraum (10) aufweist; eine auf der Membran (M; M') verankerten ersten Elektrodenstruktur (7a; 7a'), welche eine Oberseite (O; O') und eine Unterseite (U; U') aufweist; eine auf dem Substrat (1) seitlich zur Membran (M; M') versetzt verankerten zweiten Elektrodenstruktur (7b, 7c; 7b', 7c'). Eine Auslenkung der Membran (M; M') bewirkt durch die Verschiebung der beiden Elektrodenstrukturen gegeneinander eine Veränderung der Kapazität zwischen der ersten Elektrodenstruktur (7a, 7a') und der zweiten Elektrodenstruktur (7b, 7c; 7b', 7c'), wodurch beispielsweise eine Druckänderung erfassbar ist.
摘要翻译：该微机械元件具有前侧（V）和后侧（R）的衬底（1），在隔膜（M）的前侧具有跨接腔（10）。在隔膜上设置电极结构（7a），其具有顶侧（O）和下表面（U）。另一电极结构（7b，7c）被横向转移到隔膜。前一电极结构相对于后一电极结构的偏移导致膜片垂直于两个电极结构的水平面的偏转，这导致两个电极结构之间的容量变化。包括用于制造微机械元件的方法的独立权利要求。

3. 发明公开

EP3402393A1 PAPER BASED ELECTRONICS PLATFORM 有权
公开(公告)号：EP3402393A1
公开(公告)日：2018-11-21
申请号：EP17705487.1
申请日：2017-01-13
申请人： King Abdullah University of Science and Technology
发明人： NASSAR, Joanna Mohammad , SEVILLA, Galo Andres Torres , HUSSAIN, Muhammad Mustafa
IPC分类号： A61B5/01 , B81C1/00 , G01P15/08
CPC分类号： A61B5/01 , A61B2562/0219 , A61B2562/0247 , A61B2562/0257 , A61B2562/0271 , A61B2562/028 , A61B2562/029 , A61B2562/125 , B01L3/502707 , B01L2300/0663 , B01L2300/126 , B01L2400/0406 , B81B2201/0214 , B81B2201/0264 , B81B2201/0278 , B81C1/00166 , G01D21/00 , G01L1/142 , G01N27/12 , G01N27/223 , H03K17/955 , H03K17/962 , H03K2217/960755
摘要： A flexible and non-functionalized low cost paper-based electronic system platform fabricated from common paper, such as paper based sensors, and methods of producing paper based sensors, and methods of sensing using the paper based sensors are provided. A method of producing a paper based sensor can include the steps of: a) providing a conventional paper product to serve as a substrate for the sensor or as an active material for the sensor or both, the paper product not further treated or functionalized; and b) applying a sensing element to the paper substrate, the sensing element selected from the group consisting of a conductive material, the conductive material providing contacts and interconnects, sensitive material film that exhibits sensitivity to pH levels, a compressible and/or porous material disposed between a pair of opposed conductive elements, or a combination of two of more said sensing elements. The method of sensing can further include measuring, using the sensing element, a change in resistance, a change in voltage, a change in current, a change in capacitance, or a combination of any two or more thereof.

4. 发明公开

EP3053181A1 CURVED RF ELECTRODE FOR IMPROVED CMAX 有权
标题翻译： GEKRÜMMTEHF-ELEKTRODEFÜRCMAX-VERBESSERUNG
公开(公告)号：EP3053181A1
公开(公告)日：2016-08-10
申请号：EP14781789.4
申请日：2014-09-24
申请人： Cavendish Kinetics, Inc.
发明人： RENAULT, Mickael , JOSHI, Vikram , VAN KAMPEN, Robertus Petrus , MAGUIRE, Thomas L. , KNIPE, Richard L.
IPC分类号： H01H59/00 , H01G5/16
CPC分类号： H01G5/16 , B81B3/0086 , B81B2201/0221 , B81B2203/04 , B81C1/00166 , B81C2201/0104 , B81C2201/0109 , H01G5/011 , H01H59/0009
摘要： The present invention generally relates to a MEMS device and a method of manufacture thereof. The RF electrode, and hence, the dielectric layer thereover, has a curved upper surface that substantially matches the contact area of the bottom surface of the movable plate. As such, the movable plate is able to have good contact with the dielectric layer and thus, good capacitance is achieved.
摘要翻译：本发明一般涉及MEMS器件及其制造方法。 RF电极以及因此其上的电介质层具有基本上与可移动板的底表面的接触面积匹配的弯曲的上表面。因此，可移动板能够与电介质层良好的接触，从而实现良好的电容。

5. 发明授权

EP1293478B1 Method of sealing electrodes 有权
标题翻译：一种用于密封电极法
公开(公告)号：EP1293478B1
公开(公告)日：2016-03-09
申请号：EP02256290.4
申请日：2002-09-11
申请人： Randox Laboratories Ltd.
发明人： Gamble, Harold S. , Mitchell, Neil S. J. , Rainey, Paul Victor , Fitzgerald, Stephen Peter c/o Randox Lab. Ltd.
IPC分类号： B81C1/00
CPC分类号： B81C1/00301 , B81B2203/04 , B81C1/00166

6. 发明公开

EP2265543A2 VERFAHREN ZUR HERSTELLUNG VON SILIZIUMHALTIGEN KERAMISCHEN STRUKTUREN 审中-公开
标题翻译：用于生产含有硅的陶瓷结构
公开(公告)号：EP2265543A2
公开(公告)日：2010-12-29
申请号：EP09731058.5
申请日：2009-03-31
申请人： Robert Bosch GmbH
发明人： KOEHNE, Martin , BEKKER, Viacheslav , OBERLE, Juergen
IPC分类号： B81C1/00
CPC分类号： B81C1/00166 , B81B2207/07 , C04B35/589 , Y10T428/265
摘要： The invention relates to a method for producing ceramic structures (3) containing silicon. In said method, structures of a ceramic precursor polymer (1) selected from the group comprising polysiloxanes, polycarbosilanes, polysilazanes, and/or polyureasilazanes are provided on the surface of a substrate (2), and the ceramic precursor structures (1) on the substrate (2) are ceramized. In the method according to the invention, the structures (1) of the ceramic precursor polymer have a height of ≤ 20 μm and a width of ≤ 500 μm perpendicular to the longitudinal axis (a, a') thereof. The invention further relates to a ceramic structure (3) that contains silicon and can be obtained according to the invention as well as a sensor comprising such a structure.

7. 发明公开

EP3382402A1 PHYSICAL QUANTITY SENSOR MANUFACTURING METHOD, PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND VEHICLE 审中-公开
公开(公告)号：EP3382402A1
公开(公告)日：2018-10-03
申请号：EP18163897.4
申请日：2018-03-26
申请人： Seiko Epson Corporation
发明人： TANAKA, Satoru
IPC分类号： G01P15/125 , G01P15/08
CPC分类号： B81C1/00166 , B60R16/0231 , B60R25/24 , B81B3/0008 , B81B2201/0235 , B81B2201/0242 , B81B2203/04 , B81B2207/07 , B81C2201/0133 , B81C2201/0187 , G01P15/125 , G01P2015/0831
摘要： A manufacturing method of a physical quantity sensor includes forming a first fixed electrode, a second fixed electrode, and a dummy electrode on a substrate; and a movable body forming. The electrode forming includes forming a first mask layer on the substrate, forming a first electrode material layer by forming a first conductive layer on the substrate and the first mask layer, forming a second conductive layer on the substrate and the first electrode material layer, forming a second mask layer by forming a mask material layer on the second conductive layer, and removing a part of a section of the mask material layer not overlapping the first electrode material layer in plan view, and forming a second electrode material layer by etching the second conductive layer, with the second mask layer as a mask such that the second conductive layer is provided on the first electrode material layer and on the substrate.

8. 发明公开

EP3248936A4 MEMS PRESSURE SENSOR AND MEMS INERTIAL SENSOR INTEGRATION STRUCTURE 有权转让
公开(公告)号：EP3248936A4
公开(公告)日：2018-04-25
申请号：EP15894015
申请日：2015-12-14
申请人： GOERTEK INC
发明人： ZHENG GUOGUANG
IPC分类号： B81B7/02 , G01L9/12
CPC分类号： B81B7/02 , B81B3/0021 , B81B7/0061 , B81B2201/0228 , B81B2201/0235 , B81B2201/0264 , B81B2203/04 , B81C1/00166 , B81C1/00269 , G01L9/12 , G01L19/04 , G01P15/125
摘要： The present invention discloses a integrated structure of an MEMS pressure sensor and an MEMS inertia sensor, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate. The integrated structure according to the present invention integrates the MEMS inertia sensor and the MEMS pressure sensor on the same substrate, which may effectively reduce the area of the chip, so as to reduce the cost of the chip. Single packaging may complete the packaging of the entire chip and reduce the cost of the chip packaging.

9. 发明公开

EP3036188A1 MEMS DEVICES UTILIZING A THICK METAL LAYER OF AN INTERCONNECT METAL FILM STACK 有权
标题翻译：具有金属连接的金属层堆叠了一层厚厚的MEMS器件
公开(公告)号：EP3036188A1
公开(公告)日：2016-06-29
申请号：EP13891862.8
申请日：2013-08-23
申请人： Intel Corporation
发明人： MAHAMEED, Rashed , DORSEY, Kristen, L. , M M ABDELMEJEED, Mamdouh, O. , ABDELMONEUM, Mohamed, A.
IPC分类号： B81B7/00 , B81C1/00 , G01C19/56 , G01P15/14
CPC分类号： B81B3/0051 , B81B3/0021 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2203/0145 , B81C1/00166 , B81C1/00246 , B81C1/00531 , B81C2203/0714 , B81C2203/0742 , G01C19/5733 , G01P15/125 , G01P2015/0814
摘要： A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.

10. 发明公开

EP2138450A3 Elektrodenstruktur für ein mikromechanisches Bauelement 失效
标题翻译：电极结构为微机械部件
公开(公告)号：EP2138450A3
公开(公告)日：2013-11-20
申请号：EP09159221.2
申请日：2009-04-30
申请人： ROBERT BOSCH GMBH
发明人： Benzel, Hubert , Schelling, Christoph
IPC分类号： B81C1/00
CPC分类号： B81C1/00166 , B81B2201/0264 , B81B2203/0127 , B81B2203/04 , B81B2203/053
摘要： Die vorliegende Erfindung schafft ein mikromechanisches Bauelement und ein entsprechendes Herstellungsverfahren. Das mikromechanische Bauelement umfasst ein Substrat (1) mit einer Vorderseite (V) und einer Rückseite (R), welches auf der Vorderseite (V) einen von einer Membran (M; M') überspannten Hohlraum (10) aufweist; eine auf der Membran (M; M') verankerten ersten Elektrodenstruktur (7a; 7a'), welche eine Oberseite (O; O') und eine Unterseite (U; U') aufweist; eine auf dem Substrat (1) seitlich zur Membran (M; M') versetzt verankerten zweiten Elektrodenstruktur (7b, 7c; 7b', 7c'). Eine Auslenkung der Membran (M; M') bewirkt durch die Verschiebung der beiden Elektrodenstrukturen gegeneinander eine Veränderung der Kapazität zwischen der ersten Elektrodenstruktur (7a, 7a') und der zweiten Elektrodenstruktur (7b, 7c; 7b', 7c'), wodurch beispielsweise eine Druckänderung erfassbar ist.

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