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11. 发明公开

EP2193911A2 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 失效转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A2
公开(公告)日：2010-06-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.
摘要翻译：制造微透镜装置，因此制造方法和提供一种相机模块用人微透镜的方法。第一模具（20）在对应制造的一个透镜元件的第一透镜轮廓。第二模具（30）在对应制造的与透镜元件的第二透镜轮廓。第二模具具有形成在其上的中空孔的透镜基片（110）的表面上对齐。材料用于透镜元件供给到透镜基板（110）的中空孔（115）。第一模具具有中空孔的透镜基片的另一表面上对齐，并且压缩以形成所述透镜元件的所述第一和第二简档。形成的透镜元件硬化。第一和第二模具由海誓山盟分离。因此，时间和用于制造微透镜成本的降低，和在第一和第二透镜轮廓之间的精确对准得以实现。

12. 发明授权

EP1750370B1 Monolithic duplexer and fabrication method thereof 有权
标题翻译：单片双工器和过程及其制备
公开(公告)号：EP1750370B1
公开(公告)日：2009-12-09
申请号：EP06253822.8
申请日：2006-07-20
申请人： Samsung Electronics Co., Ltd.
发明人： Sul, Sang-chul, 901-406 Byeokjeokgol , Kim, Chul-soo , Kim, Duck-hwan, 505-803 Hosu-maeul , Song, In-sang , Lee, Moon-chul , Jung, Kyu-dong , Shin, Jea-shik
IPC分类号： H03H9/10 , H03H3/02
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706

13. 发明公开

EP1434031A2 Mems gyroscope and fabrication method thereof 审中-公开
标题翻译： Mems-Kreisel und sein Herstellungsverfahren
公开(公告)号：EP1434031A2
公开(公告)日：2004-06-30
申请号：EP03258036.7
申请日：2003-12-19
申请人： Samsung Electronics Co., Ltd.
发明人： Kang, Seok-jin , Lee, Moon-chul , Chung, Seok-whan , Jung, Kyu-dong , Hong,, Seog-woo
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： G01C19/5762 , B81B3/0059 , B81B2201/0242 , B81B2203/051 , B81B2203/053
摘要： A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.
摘要翻译：通过水平驱动操作的垂直MEMS陀螺仪包括：基板，固定在基板区域的上表面上的支撑层，浮动在基板上方的驱动结构，并且具有固定到支撑层上表面的部分和另一部分与固定部分平行地，驱动结构具有能够在平行于基板的预定方向上振动的预定区域，在与驱动结构相同的平面上固定到驱动结构的检测结构，并且具有能够相对于基板在垂直方向上振动，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测检测结构在垂直方向的位移。

14. 发明授权

EP2570075B1 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075B1
公开(公告)日：2015-09-09
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00 , G02B3/14 , G01B11/22 , G02B5/00 , G02B21/00 , G01B9/02 , G02B26/00 , G02B26/10 , G02B26/02
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101

15. 发明公开

EP2570075A3 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075A3
公开(公告)日：2014-04-30
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00 , G02B3/14 , G01B11/22 , G02B5/00 , G02B21/00 , G01B9/02 , G02B26/00 , G02B26/10 , G02B26/02
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101
摘要： A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

16. 发明公开

EP2570075A2 Numerical aperture (na) controlling unit, variable optical probe including the na controlling unit, and depth scanning method using the na controlling unit 有权
标题翻译：数值开口（NA）控制单元，在使用NA-控制单元的NA-控制单元和深度扫描方法可变光学探头
公开(公告)号：EP2570075A2
公开(公告)日：2013-03-20
申请号：EP12184541.6
申请日：2012-09-14
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Seung-wan , Kim, Woon-bae , Lee, Eun-sung , Jung, Kyu-dong , Chang, Jong-hyeon
IPC分类号： A61B5/00
CPC分类号： A61B5/0066 , A61B5/444 , G01B9/02063 , G01B9/02091 , G01B11/22 , G02B3/14 , G02B5/005 , G02B21/006 , G02B26/005 , G02B26/101
摘要： A numerical aperture (NA) controlling unit and a variable optical probe including the same are provided. The NA controlling unit includes: an aperture adjustment unit which controls an aperture through which light is transmitted; and a focus control unit that is disposed in a predetermined position with respect to the aperture adjustment unit, that focuses light transmitted through the aperture, and that has an adjustable focal length. The variable optical probe includes: a light transmission unit; a collimator that collimates light transmitted through the light transmission unit into parallel light; an NA controlling unit that focuses light on a sample to be inspected; and a scanner that varies a path of light transmitted through the light transmission unit such that a predetermined region of the sample is scanned by light that passes through the NA controlling unit.

17. 发明公开

EP2193911A3 Micro lens, method and apparatus for manufacturing micro lens, and camera module including micro lens 失效转让
标题翻译：用于制造使用微透镜的微透镜和相机模块的微透镜的方法和装置
公开(公告)号：EP2193911A3
公开(公告)日：2012-05-09
申请号：EP09170750.5
申请日：2009-09-18
申请人： Samsung Electronics Co., Ltd.
发明人： Choi, Min-seog , Lee, Eun-sung , Jung, Kyu-dong
IPC分类号： B29D11/00 , B29C33/30
CPC分类号： B29D11/00375 , B29C33/305 , B29D11/0048 , B29L2011/0016
摘要： Method of manufacturing a micro lens apparatus, and manufacturing method therefore and a camera module employing the micro lens are provided. First mold (20) is manufactured in correspondence with a first lens profile of a lens element. Second mold (30) is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate (110) having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole (115) of the lens substrate (110). First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

18. 发明公开

EP1750370A3 Monolithic duplexer and fabrication method thereof 有权
标题翻译：单片双工器和过程及其制备
公开(公告)号：EP1750370A3
公开(公告)日：2008-09-17
申请号：EP06253822.8
申请日：2006-07-20
申请人： Samsung Electronics Co., Ltd.
发明人： Sul, Sang-chul, 901-406 Byeokjeokgol , Kim, Chul-soo , Kim, Duck-hwan, 505-803 Hosu-maeul , Song, In-sang , Lee, Moon-chul , Jung, Kyu-dong , Shin, Jea-shik
IPC分类号： H03H9/10 , H03H3/02
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706
摘要： A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer (10), a plurality of elements (1a,1b,1c,1d) distanced from each other on a top portion of a device wafer, first sealing parts (30) formed on the top portion of the device wafer, and a plurality of first ground planes (20) formed between the plurality of elements. A cap wafer (40) is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts (42), and cavities. Second sealing parts (48) are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes (46) cover the plurality of ground posts. Via holes (50) vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals (60) are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.

19. 发明授权

EP1411025B1 Metal wiring method for an undercut 有权
标题翻译：底切孔金属布线方法
公开(公告)号：EP1411025B1
公开(公告)日：2007-09-19
申请号：EP03256418.9
申请日：2003-10-10
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Shong, Ci-moo , Chung, Seok-whan , Kang, Seok-jin , Lee, Moon-chul , Jung, Kyu-dong , Kim, Jong-seok , Jun, Chan-bong , Hong, Seog-woo , Kang, Jung-ho
IPC分类号： B81C1/00 , B81B7/00 , B81B1/00
CPC分类号： B81B7/0006 , H01L21/76877 , H01L23/5226 , H01L2924/0002 , H01L2924/00

20. 发明公开

EP1750370A2 Monolithic duplexer and fabrication method thereof 有权
标题翻译： Monolithischer Duplexer和Verfahren zu seiner Herstellung
公开(公告)号：EP1750370A2
公开(公告)日：2007-02-07
申请号：EP06253822.8
申请日：2006-07-20
申请人： Samsung Electronics Co., Ltd.
发明人： Sul, Sang-chul, 901-406 Byeokjeokgol , Kim, Chul-soo , Kim, Duck-hwan, 505-803 Hosu-maeul , Song, In-sang , Lee, Moon-chul , Jung, Kyu-dong , Shin, Jea-shik
IPC分类号： H03H9/10 , H03H3/02
CPC分类号： H03H3/02 , H03H9/0571 , H03H9/706
摘要： A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer (10), a plurality of elements (1a,1b,1c,1d) distanced from each other on a top portion of a device wafer, first sealing parts (30) formed on the top portion of the device wafer, and a plurality of first ground planes (20) formed between the plurality of elements. A cap wafer (40) is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts (42), and cavities. Second sealing parts (48) are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes (46) cover the plurality of ground posts. Via holes (50) vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals (60) are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.
摘要翻译：一种单片双工器及其制造方法。单片双工器包括器件晶片（10），在器件晶片的顶部彼此远离的多个元件（1a，1b，1c，1d），形成在器件晶片的顶部上的第一密封部分（30）器件晶片和形成在多个元件之间的多个第一接地平面（20）。还提供了具有用于封装器件晶片，多个突出部分，多个接地柱（42）和空腔的蚀刻区域的盖片（40）。第二密封部（48）形成在突出部的底部，多个第二接地面（46）覆盖多个接地柱。通孔（50）垂直地穿过盖晶片以连接到多个第二接地平面，并且接地端子（60）形成在通孔的顶部上。第一密封部件和第一接地平面分别附接到第二密封部件和第二接地平面。

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