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    • 3. 发明授权
    • Process for preventing development defect and composition for use in the same
    • 用于预防发展缺陷和组合物的方法
    • US07799513B2
    • 2010-09-21
    • US10518105
    • 2003-06-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • G03F7/00
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • (1)C4〜C15全氟烷基羧酸,C4〜C10全氟烷基磺酸和全氟己二酸的铵盐,四烷基铵盐或C1〜C4烷醇胺盐的预防显影缺陷用组合物,或(2)氟化烷基季铵 无机酸的盐,其中所述表面活性剂以相对于酸与碱的比例为1:1-1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。
    • 4. 发明申请
    • Micropattern formation material and method of micropattern formation
    • 微图案形成材料和微图案形成方法
    • US20070059644A1
    • 2007-03-15
    • US10557926
    • 2004-06-04
    • Kiyohisa TakahashiYusuke Takano
    • Kiyohisa TakahashiYusuke Takano
    • G03C5/00
    • H01L21/0274G03F7/0035G03F7/40
    • The present invention provides a method of forming a fine pattern, comprising the steps of forming a resist pattern 3 made of a chemically amplified photoresist on a substrate 1 with a diameter of 6 inches or more, applying a fine pattern forming material containing a water-soluble resin, a water-soluble crosslinking agent and water or a mixed solvent of water and a water-soluble organic solvent to form a coated layer 4, baking the chemically amplified photoresist pattern and the coated layer, and developing the coated layer after baking, wherein the water-soluble resin in the fine pattern forming material is a water-soluble resin, the peak temperature of heat of fusion of which in a DSC curve is higher than the baking temperature in the above baking step and simultaneously higher than 130° C.
    • 本发明提供一种形成精细图案的方法,包括以下步骤:在直径为6英寸或更大的基底1上形成由化学放大光致抗蚀剂制成的抗蚀剂图案3,施加含有水溶性聚合物的精细图案形成材料, 可溶性树脂,水溶性交联剂和水或水和水溶性有机溶剂的混合溶剂形成涂层4,烘烤化学放大的光致抗蚀剂图案和涂层,并烘烤后显影涂层, 其中精细图案形成材料中的水溶性树脂是水溶性树脂,其DSC曲线中的熔化热的峰值温度高于上述烘烤步骤中的烘烤温度,同时高于130℃ 。
    • 6. 发明申请
    • Process for Preventing Development Defect and Composition for Use in the Same
    • 防止发展缺陷和组合使用的过程
    • US20100324330A1
    • 2010-12-23
    • US12853640
    • 2010-08-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • C07C309/02C07C53/21C07C55/14
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • (1)C4〜C15全氟烷基羧酸,C4〜C10全氟烷基磺酸和全氟己二酸的铵盐,四烷基铵盐或C1〜C4链烷醇胺盐,或(2)氟化烷基季铵 无机酸的盐,其中所述表面活性剂以相对于酸与碱的比例为1:1-1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。
    • 7. 发明授权
    • Method for fine pattern formation
    • 精细图案形成的方法
    • US07592132B2
    • 2009-09-22
    • US11660199
    • 2005-08-31
    • Kiyohisa TakahashiYusuke Takano
    • Kiyohisa TakahashiYusuke Takano
    • G03F7/00G03F7/004
    • G03F7/0035G03F7/40H01L21/0273Y10T428/10
    • In a method of effectively miniaturizing a resist pattern, a super fine pattern-forming method of restricting a film thickness of a crosslinked film and also preventing developing defects is provided using a super fine pattern-forming material which contains a solvent composed of a water-soluble resin, a water-soluble crosslinking agent, and water or a mixing solution of water and a water-soluble organic solvent, and an amine compound-containing developing solution. The amine compound-containing developing solution is preferably a primary amine compound such as polyallylamine, monomethanolamine, and monoethanolamine, a secondary amine compound such as dimethylamine, diethylamine, dimethanolamine, and diethanolamine, a tertiary amine compound such as trimethylamine, triethylamine, trimethanolamine, and triethanolamine, or a quartenary amine compound such as hydrated tetramethylamine.
    • 在有效地使抗蚀剂图案小型化的方法中,使用超细图案形成材料提供限制交联膜的膜厚度并且还防止显影缺陷的超细图案形成方法,该超细图案形成材料含有由水溶性聚合物 可溶性树脂,水溶性交联剂和水或水和水溶性有机溶剂的混合溶液,以及含胺化合物的显影液。 含胺化合物的显影液优选为聚亚烷基胺,单甲醇胺,单乙醇胺等伯胺化合物,二甲胺,二乙胺,二乙醇胺,二乙醇胺等仲胺化合物,三甲胺,三乙胺,三乙醇胺等叔胺化合物, 三乙醇胺,或季铵胺化合物如水合四甲胺。
    • 8. 发明申请
    • Method for Fine Pattern Formation
    • 精细图案形成方法
    • US20070248770A1
    • 2007-10-25
    • US11660199
    • 2005-08-31
    • Kiyohisa TakahashiYusuke Takano
    • Kiyohisa TakahashiYusuke Takano
    • H01L21/027
    • G03F7/0035G03F7/40H01L21/0273Y10T428/10
    • In a method of effectively miniaturizing a resist pattern, a super fine pattern-forming method of restricting a film thickness of a crosslinked film and also preventing developing defects is provided using a super fine pattern-forming material which contains a solvent composed of a water-soluble resin, a water-soluble crosslinking agent, and water or a mixing solution of water and a water-soluble organic solvent, and an amine compound-containing developing solution. The amine compound-containing developing solution is preferably a primary amine compound such as polyallylamine, monomethanolamine, and monoethanolamine, a secondary amine compound such as dimethylamine, diethylamine, dimethanolamine, and diethanolamine, a tertiary amine compound such as trimethylamine, triethylamine, trimethanolamine, and triethanolamine, or a quartenary amine compound such as hydrated tetramethylamine.
    • 在有效地使抗蚀剂图案小型化的方法中,使用超细图案形成材料提供限制交联膜的膜厚度并且还防止显影缺陷的超细图案形成方法,该超细图案形成材料含有由水溶性聚合物 可溶性树脂,水溶性交联剂和水或水和水溶性有机溶剂的混合溶液,以及含胺化合物的显影液。 含胺化合物的显影液优选为聚亚烷基胺,单甲醇胺,单乙醇胺等伯胺化合物,二甲胺,二乙胺,二乙醇胺,二乙醇胺等仲胺化合物,三甲胺,三乙胺,三乙醇胺等叔胺化合物, 三乙醇胺,或季铵胺化合物如水合四甲胺。
    • 9. 发明申请
    • Process for preventing development defect and composition for use in the same
    • 用于预防发展缺陷和组合物的方法
    • US20050221236A1
    • 2005-10-06
    • US10518105
    • 2003-06-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • G03F7/11G03F7/16G03F7/38H01L21/027G03F7/40
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • 用于防止含有(1)C 4的铵盐,四烷基铵盐或C 1〜C 4烷醇胺盐的显影缺陷的组合物 的全氟烷基羧酸,C 4〜C 10全氟烷基磺酸和全氟己二酸,或(2)氟代烷基季铵盐 无机酸,其中所述表面活性剂以相对于酸与碱的比例为1:1:1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。