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1. 发明专利

JP2013008979A Semiconductor package 审中-公开
标题翻译：半导体封装
公开(公告)号：JP2013008979A
公开(公告)日：2013-01-10
申请号：JP2012172262
申请日：2012-08-02
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , EKOSHI HIDENORI , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TONEDACHI TATSURO , YAMAMOTO MASAMI
IPC分类号： H01L33/62 , H01L23/12 , H01L23/28 , H01L23/48 , H01L23/50 , H01L33/54
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package that is easily handled.SOLUTION: A semiconductor package 1 comprises: first and second lead frames 11 and 12 separated from each other; a semiconductor chip 14 disposed above the first and second lead frames 11 and 12 of which one terminal 14a is connected to the first lead frame 11 and other terminal 14b is connected to the second lead frame 12; and a resin body 17. The first and second lead frames 11 and 12 individually have: base portions 11a and 12a; and a plurality of suspension pins 11b through 11e and 12b through 12e that extend from the base portions 11a and 12a. The base portions 11a and 12a have: thin plate portions disposed at least at portions opposite to one another in the first and second lead frames 11 and 12; and projected portions 11g and 12g that project downward from the thin plate portions. Further, undersurfaces and lateral surfaces of the thin plate portions, lateral surfaces of the projected portions 11g and 12g and undersurfaces and lateral surfaces of the suspension pins 11b through 11e and 12b through 12e are covered with the resin body 17, and undersurfaces of the projected portions 11g and 12g and leading end surfaces of the suspension pins 11b through 11e and 12b through 12e are exposed from the resin body 17.
摘要翻译：要解决的问题：提供易于处理的半导体封装。解决方案：半导体封装1包括：彼此分离的第一引线框架11和第二引线框架12; 一个半导体芯片14设置在第一和第二引线框架11和12的上方，其中一个端子14a连接到第一引线框架11，而另一个端子14b连接到第二引线框架12; 第一引线框架11和第二引线框架12分别具有：基部11a和12a; 以及从基部11a，12a延伸的多个悬架销11b〜11e，12b〜12e。基部11a和12a具有：在第一和第二引线框架11和12中至少在彼此相对的部分处设置的薄板部分; 以及从薄板部向下方突出的突出部11g，12g。此外，薄板部分的下表面和侧表面，突出部分11g和12g的侧表面以及悬挂销11b至11e和12b至12e的下表面和侧表面被树脂体17覆盖，并且突出部分11g和12g的下表面部分11g和12g以及悬挂销11b至11e和12b至12e的前端表面从树脂体17露出。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012119376A Led package 审中-公开
标题翻译： LED封装
公开(公告)号：JP2012119376A
公开(公告)日：2012-06-21
申请号：JP2010265310
申请日：2010-11-29
申请人： Toshiba Corp , 株式会社東芝
发明人： KOMATSU TETSUO , SHIMIZU SATOSHI
IPC分类号： H01L33/48
CPC分类号： H01L25/167 , H01L24/73 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/32245 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2224/48091 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package which can be easily downsized.SOLUTION: An LED package 1 comprises: first to third lead frames; upper surface terminal type LED chips 21B and 21G which are mounted on the first lead frame 12, connected to the second lead frame at one side terminals, and connected to the third lead frame at the other side terminals; upper surface terminal type protection chips 22A and 22B which are mounted on the first lead frame, connected to the second lead frame at one side terminals, and connected to the third lead frame at the other side terminals; and a resinous body. The external shape of the resinous body forms the outer shape of the LED package.
摘要翻译：要解决的问题：提供可以容易地小型化的LED封装。 LED封装1包括：第一至第三引线框架; 安装在第一引线框架12上的上表面端子型LED芯片21B和21G，在一侧端子处连接到第二引线框架，并在另一侧端子处连接到第三引线框架; 安装在第一引线框架上的上表面端子型保护芯片22A和22B在一侧端子处连接到第二引线框架，并在另一侧端子处连接到第三引线框架; 和树脂体。树脂体的外形形成LED封装的外形。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012114311A Led module 审中-公开
标题翻译： LED模块
公开(公告)号：JP2012114311A
公开(公告)日：2012-06-14
申请号：JP2010263147
申请日：2010-11-26
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , TONEDACHI TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , KOMATSU TETSUO , WATARI HAJIME
IPC分类号： H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive LED module which has high durability.SOLUTION: According to the embodiment, an LED module comprises: a substrate; a wiring layer provided at the substrate; an LED package mounted on the wiring layer; and a reflector provided at a region of the substrate in which the LED package is not mounted. The LED package has first and second lead frames, an LED chip, and a resin body. An outer shape of the resin body forms an outer shape of the LED package.
摘要翻译：要解决的问题：提供具有高耐久性的便宜的LED模块。解决方案：根据实施例，LED模块包括：基板; 设置在基板上的布线层; 安装在布线层上的LED封装; 以及设置在其中未安装LED封装的基板的区域处的反射器。 LED封装具有第一和第二引线框架，LED芯片和树脂体。树脂体的外形形成LED封装的外形。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012074732A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2012074732A
公开(公告)日：2012-04-12
申请号：JP2011269829
申请日：2011-12-09
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TONEDACHI TATSURO
IPC分类号： H01L33/48
CPC分类号： H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package with high durability and low cost.SOLUTION: An LED package includes a first lead frame 11 and a second lead frame 12, which are separated from each other, an LED chip 14 which is provided above the first lead frame 11 and the second lead frame 12 and whose one terminal is connected to the first lead frame 11 and the other terminal is connected to the second lead frame 12, and a resin body 17 whose resin covers the parts of the first lead frame 11 and the second lead frame 12. The first lead frame 11 and the second lead frame 12 have base parts 11a and 12a, and a plurality of thin sections extending from the base parts 11a and 12a. The first lead frame 11 and the second lead frame 12 are exposed on the surfaces in the three directions of the resin body 17. And the distance between the end surface of the base parts 11a and 12a and the side face of the resin body 17 is 50% or more of the maximum thickness of the first lead frame 11 and the second lead frame 12.
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装。解决方案：LED封装包括彼此分离的第一引线框架11和第二引线框架12，设置在第一引线框架11和第二引线框架12上方的LED芯片14，端子连接到第一引线框架11，另一个端子连接到第二引线框架12，树脂体17覆盖第一引线框架11和第二引线框架12的部分。第一引线框架11 并且第二引线框架12具有基部11a和12a以及从基部11a和12a延伸的多个薄部。第一引线框架11和第二引线框架12在树脂体17的三个方向的表面上露出。基部11a和12a的端面与树脂体17的侧面之间的距离为第一引线框架11和第二引线框架12的最大厚度的50％以上。（C）2012，JPO＆INPIT

5. 发明专利

JP2011176364A Led package 审中-公开
标题翻译： LED封装
公开(公告)号：JP2011176364A
公开(公告)日：2011-09-08
申请号：JP2011116982
申请日：2011-05-25
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TOYAKAN TATSURO
IPC分类号： H01L33/62 , H01L23/50
CPC分类号： H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a durable and low-cost LED package. SOLUTION: The LED package includes: first and second mutually separated lead frames; and an LED chip that is provided at upper portions of the first and second lead frames, where one terminal is connected to the first lead frame and the other terminal is connected to the second lead frame. The first lead frame and the second lead frame each include a base section and a plurality of suspension pins extending from the base section. One portion of a lower surface of the base section and an end face, and a lower surface and a side face of the suspension pins are covered with resin, and the remainder of the lower surface of the base section and the tip surface of the suspension pins are not covered with resin. Then, the distance between the end face of the base section and the surface of the resin is not less than 50% of the maximum thickness of the first and second lead frames. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供耐用和低成本的LED封装。解决方案：LED封装包括：第一和第二相互分离的引线框架; 以及设置在第一引线框架和第二引线框架的上部的LED芯片，其中一个端子连接到第一引线框架，而另一个端子连接到第二引线框架。第一引线框架和第二引线框架各自包括基部和从基部延伸的多个悬挂销。基部的下表面的一部分和端面以及悬挂销的下表面和侧面被树脂覆盖，并且基部的下表面的其余部分和悬架的顶表面针不被树脂覆盖。然后，基部的端面与树脂的表面之间的距离不小于第一和第二引线框的最大厚度的50％。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011176306A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011176306A
公开(公告)日：2011-09-08
申请号：JP2011024619
申请日：2011-02-08
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMIZU SATOSHI , TOYAKAN TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , OSHIO HIROAKI , KOMATSU TETSUO , WATARI HAJIME , INOUE KAZUHIRO , USHIYAMA NAOYA
IPC分类号： H01L33/62 , H01L33/54
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package having high durability and low cost. SOLUTION: The LED package includes: first and second leadframes which are separated from each other; and an LED chip which is formed above the first and second leadframes, and has one terminal connected to the first leadframe and the other terminal connected to the second leadframe. The first and second leadframes each have a base, and a plurality of hanging pins extending from the base. A part of the lower surface and the side surface of the base and the lower and side surfaces of each of the hanging pins are covered with a resin, and the rest of the lower surface of the base and a front end surface of each of the hanging pins are not covered with the resin. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装。解决方案：LED封装包括：彼此分离的第一和第二引线框架; 以及LED芯片，其形成在第一引线框架和第二引线框架上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。第一和第二引线框架各自具有基部和从基部延伸的多个悬挂销。基部的下表面和侧表面的一部分以及每个悬挂销的下表面和侧表面被树脂覆盖，并且底部的下表面的其余部分和每个的垂直销的前端表面悬挂销未被树脂覆盖。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011159768A Led package and method for manufacturing the led package 有权
标题翻译： LED封装和制造LED封装的方法
公开(公告)号：JP2011159768A
公开(公告)日：2011-08-18
申请号：JP2010019780
申请日：2010-01-29
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , EKOSHI HIDENORI , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TOYAKAN TATSURO , YAMAMOTO MASAMI
IPC分类号： H01L33/54 , H01L33/62
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an LED package that is easy to handle, a method for manufacturing the LED package, and a packaging material for the LED package. SOLUTION: The LED package 1 is provided with: mutually isolated lead frames 11 and 12; an LED chip 14 provided above the lead frames 11 and 12 and having one terminal 14a connected to the lead frame 11 and the other terminal 14b connected to the lead frame 12; and a transparent resin body 17 in which the lead frames 11 and 12 and the LED chip 14 are embedded. Then the upper surface of the transparent resin body 17 has surface roughness of ≥0.15 μm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供易于处理的LED封装，制造LED封装的方法和用于LED封装的封装材料。解决方案：LED封装1设置有：相互隔离的引线框架11和12; 设置在引线框架11和12上方并具有连接到引线框架11的一个端子14a和连接到引线框架12的另一个端子14b的LED芯片14; 以及嵌入引线框架11,12和LED芯片14的透明树脂体17。然后，透明树脂体17的上表面的表面粗糙度≥0.15μm。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2005167159A Laminated semiconductor device 审中-公开
标题翻译：层压半导体器件
公开(公告)号：JP2005167159A
公开(公告)日：2005-06-23
申请号：JP2003407887
申请日：2003-12-05
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMOKAWA KAZUO , KOMATSU TETSUO
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
CPC分类号： H01L24/01 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a laminated semiconductor device, which can be manufactured at low cost, is small, and improves the heat dissipation efficiency of a logic IC even if the semiconductor device is formed by laminating a memory IC and the logic IC three-dimensionally.
SOLUTION: The laminated semiconductor device comprises memory-type semiconductor packages 101, 120, which have wiring boards 111, 121 on which memory ICs 115, 125 are mounted, a logic-type semiconductor package 130, which has a wiring board 135 on which a logic IC 135 is mounted, and a base board 101 on which the memory-type semiconductor packages 101, 120 and the logic-type semiconductor package 130 are mounted in a laminated arrangement. The logic-type semiconductor package 130 forms the top layer of the lamination to be farthest from the base board 101.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可以以低成本制造的层叠半导体器件小，并且提高逻辑IC的散热效率，即使半导体器件通过层叠存储器IC和逻辑IC三维。解决方案：层叠半导体器件包括存储器型半导体封装101,120，其具有安装有存储器IC 115,125的布线板111,121，逻辑型半导体封装130，其具有布线板135 其上安装有逻辑IC 135，以及基板101，存储型半导体封装101,120和逻辑型半导体封装130以层叠的方式安装在基板101上。逻辑型半导体封装130形成层叠的顶层距离基板101最远。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2014241341A 半導体発光装置审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2014241341A
公开(公告)日：2014-12-25
申请号：JP2013123196
申请日：2013-06-11
申请人：株式会社東芝 , Toshiba Corp
发明人： USHIYAMA NAOYA , INOUE KAZUHIRO , SHIMOMURA KENJI , KOMATSU TETSUO , KUROKI TOSHIHIRO , YONEYA TOSHIHIRO , TAMURA KAZUHIRO , TSUBOI YOSHIHARU , TAKEUCHI TERUO , IWASHITA KAZUHISA
IPC分类号： H01L33/54 , H01L33/50
CPC分类号： H01L33/56 , H01L25/167 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要：【課題】光取り出し効率の向上を可能とする半導体発光装置を提供する。【解決手段】半導体装置1aは、設置部上に設けられた発光素子10と、発光素子上に設けられた蛍光体含有樹脂15と、発光素子と蛍光体含有樹脂との間に設けられ、蛍光体含有樹脂の下面全体と接する透明樹脂と、を有する。半導体装置は、設置部と、上面及び側面が光反射材に覆われたシリコン基板と、シリコン基板上に光反射材を介して設けられた発光部とを有し、設置部上に設けられた発光素子と、を有する。【選択図】図1
摘要翻译：要解决的问题：提供可以提高光提取效率的半导体发光器件。解决方案：半导体器件1a包括：安装部分; 设置在安装部上的发光元件10; 设置在发光元件上的含磷光体树脂15; 以及设置在发光元件和含荧光体树脂之间并与含荧光体树脂的整个下表面接触的透明树脂。设置在安装部上的发光元件包括：上表面和侧面被光反射材料覆盖的硅基板; 以及经由所述光反射材料设置在所述硅基板上的发光部。

10. 发明专利

JP2014116614A Semiconductor light-emitting device and light-emitting device 有权
标题翻译：半导体发光器件和发光器件
公开(公告)号：JP2014116614A
公开(公告)日：2014-06-26
申请号：JP2014003362
申请日：2014-01-10
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , ISHIKAWA MASAYUKI , TAMURA HIDEO , KOMATSU TETSUO , KOJIMA AKIHIRO
IPC分类号： H01L33/62 , F21S2/00 , F21Y101/02 , H01L33/38
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and a light-emitting device which can be easily downsized and have improved mass productivity.SOLUTION: A semiconductor light-emitting device comprises: a laminate which has a first surface and a second surface opposite to the first surface, and has a luminescent layer; a p-side electrode and an n-side electrode which are arranged on the laminate; a p-side extraction electrode which is arranged on the second surface side and connected to the p-side electrode; an n-side extraction electrode which is arranged on the second surface side and connected to the n-side electrode; and an insulation film arranged between the p-side extraction electrode and the n-side extraction electrode. A part which separates the p-side extraction electrode and the n-side extraction electrode is winding when viewed from the second surface side.
摘要翻译：要解决的问题：提供一种可以容易地小型化并且具有提高的批量生产率的半导体发光器件和发光器件。解决方案：一种半导体发光器件包括：具有第一表面和第二表面的层压体表面与第一表面相反，并具有发光层; 布置在层压板上的p侧电极和n侧电极; p侧引出电极，其设置在第二表面侧并与p侧电极连接; n侧引出电极，配置在第二面侧并与n侧电极连接; 以及布置在p侧引出电极和n侧引出电极之间的绝缘膜。从第二面侧观察，分离p侧引出电极和n侧引出电极的部分是卷绕的。

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