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1. 发明专利

JP2013084989A Semiconductor light-emitting device and light-emitting device 有权
标题翻译：半导体发光器件和发光器件
公开(公告)号：JP2013084989A
公开(公告)日：2013-05-09
申请号：JP2013002814
申请日：2013-01-10
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , ISHIKAWA MASAYUKI , TAMURA HIDEO , KOMATSU TETSUO , KOJIMA AKIHIRO
IPC分类号： H01L33/62
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and a light-emitting device that are capable of being easily downsized and have improved mass productivity.SOLUTION: A semiconductor light-emitting device has a first surface and a second surface on the opposite side of the first surface, and includes a stack on the first surface side that does not include a substrate and has a light-emitting layer; a p-side electrode and an n-side electrode that are provided on the stack; a p-side extraction electrode that is provided on the second surface side, has an end portion capable of external connection, and is connected to the p-side electrode; an n-side extraction electrode that is provided on the second surface side, has an end portion capable of external connection, and is connected to the n-side electrode; an insulating film that is provided so as to contact side surfaces of the p-side extraction electrode and side surfaces of the n-side extraction electrode, and constitutes a support with the p-side extraction electrode and the n-side extraction electrode; and a resin layer that is provided on the first surface side of the stack without interposing the substrate therebetween.
摘要翻译：解决的问题：提供能够容易地小型化并且具有提高的批量生产率的半导体发光器件和发光器件。解决方案：半导体发光器件具有在第一表面的相对侧上的第一表面和第二表面，并且在第一表面侧上包括不包括衬底并具有发光层的叠层 ; 设置在所述堆叠上的p侧电极和n侧电极; 设置在第二表面侧的p侧引出电极具有能够外部连接的端部，并连接到p侧电极; 设置在第二表面侧的n侧引出电极具有能够外部连接的端部，并且连接到n侧电极; 设置为接触p侧引出电极和n侧引出电极的侧表面的绝缘膜，并且与p侧引出电极和n侧引出电极构成支撑体; 以及树脂层，其设置在堆叠的第一表面侧，而不在其间插入基板。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011249501A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2011249501A
公开(公告)日：2011-12-08
申请号：JP2010120260
申请日：2010-05-26
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , KOJIMA AKIHIRO , ISHIKAWA MASAYUKI , TAMURA HIDEO , KOMATSU TETSUO
IPC分类号： H01L33/64 , H01L33/62
CPC分类号： H01L33/647 , H01L27/153 , H01L33/62 , H01L2224/16 , H01L2933/0066
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device with excellent heat dissipation properties.SOLUTION: According to an embodiment, a light-emitting device comprises a light-emitting chip, an external terminal composed of a metallic material, and a wiring board on which the light-emitting chip is mounted via the external terminal. The light-emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulator layer, a first wiring layer, a second wiring layer, a first metal pillar, a second metal pillar, and a resin layer. The wiring board includes a wiring that is connected to the first metal pillar and the second metal pillar via the external terminal, and a heat dissipation material that is provided in contact with the wiring under the wiring.
摘要翻译：要解决的问题：提供具有优异散热性能的发光装置。 <解决方案>根据实施例，发光装置包括发光芯片，由金属材料构成的外部端子和经由外部端子安装有发光芯片的布线板。发光芯片包括半导体层，第一电极，第二电极，绝缘体层，第一布线层，第二布线层，第一金属柱，第二金属柱和树脂层。布线板包括经由外部端子与第一金属柱和第二金属柱连接的布线，以及与布线下方的布线接触的散热材料。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011199193A Light emitting device and method of manufacturing the same 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：JP2011199193A
公开(公告)日：2011-10-06
申请号：JP2010066925
申请日：2010-03-23
申请人： Toshiba Corp , 株式会社東芝
发明人： KOJIMA AKIHIRO , SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , TAMURA HIDEO , KOMATSU TETSUO , ISHIKAWA MASAYUKI
IPC分类号： H01L33/62 , H01L33/50
CPC分类号： H01L33/0079 , H01L33/38 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device easy in downsizing and improved in mass-productivity, and a method of manufacturing the same.SOLUTION: In the method of manufacturing the semiconductor device and the semiconductor device, a laminate having a light emitting layer is formed so that its first surface is adjacent to a first surface of a translucent substrate, an insulating film with first and second openings is formed on a p-side electrode and an N-side electrode disposed on the second surface side opposite to the first surface of the laminate on the second surface side, a seed metal is formed to cover the insulating film and the first and second openings, a p-side metal wiring layer and an n-side metal wiring layer are formed on the seed metal, a p-side metal pillar and an n-side metal pillar are respectively formed on the p-side metal wiring layer and the n-side metal wiring layer, the seed metal exposed between the p-side metal wiring layer and the n-side metal wiring layer is removed to separate it into a p-side seed metal and an n-side seed metal, a resin is at least partially formed in a space with the seed metal removed, and a phosphor layer is formed on the first surface side of the laminate with the light emitting layer.
摘要翻译：要解决的问题：提供容易小型化并提高批量生产率的发光装置及其制造方法。解决方案：在半导体器件和半导体器件的制造方法中，具有发光的层压体层形成为使得其第一表面与透光性基板的第一表面相邻，在p侧电极和N侧电极上形成具有第一和第二开口的绝缘膜，该N侧电极设置在与第在第二表面侧的层叠体的第一表面，形成种子金属以覆盖绝缘膜和第一和第二开口，在种子金属上形成p侧金属布线层和n侧金属布线层，分别在p侧金属布线层和n侧金属布线层上形成p侧金属柱和n侧金属柱，露出在p侧金属布线层和n侧金属布线层之间的种子金属金属除去接合层以将其分离成p侧种子金属和n侧籽晶，在除去种子金属的空间中至少部分地形成树脂，并且在第一表面侧形成荧光体层具有发光层的层压体。

4. 发明专利

JP2010251807A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2010251807A
公开(公告)日：2010-11-04
申请号：JP2010178962
申请日：2010-08-09
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , ISHIKAWA MASAYUKI , TAMURA HIDEO , KOMATSU TETSUO , KOJIMA AKIHIRO
IPC分类号： H01L33/38 , H01L33/50
CPC分类号： H01L2924/01015
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device which is easy to miniaturize and is improved in mass-productivity. SOLUTION: The light-emitting device includes a multilayer body having a first surface and a second surface opposite the first surface, and having a luminescent layer; a p-side electrode and an n-side electrode provided on the second surface of the multilayer body; a p-side extraction electrode having a p-side metal wiring layer provided on the p-side electrode and a p-side metal pillar provided on the p-side metal wiring layer; an n-side extraction electrode, having an n-side metal wiring layer provided on the n-side electrode and an n-side metal pillar provided on the n-side metal wiring layer; and a resin layer filled in between the p-side metal pillar and the n-side metal pillar and surrounding the p-side metal pillar and the n-side metal pillar, thus constituting a support body, together with the p-side metal pillar and the n-side metal pillar. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种易于小型化并提高批量生产率的发光装置。解决方案：发光器件包括具有第一表面和与第一表面相对的第二表面的多层体，并且具有发光层; 设置在所述多层体的第二面上的p侧电极和n侧电极; 具有设置在p侧电极上的p侧金属布线层和设置在p侧金属布线层上的p侧金属柱的p侧引出电极; 具有设置在n侧电极上的n侧金属布线层和设置在n侧金属布线层上的n侧金属柱的n侧引出电极; 以及填充在p侧金属柱和n侧金属柱之间并围绕p侧金属柱和n侧金属柱的树脂层，从而构成支撑体与p侧金属柱和n侧金属支柱。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008090298A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2008090298A
公开(公告)日：2008-04-17
申请号：JP2007234738
申请日：2007-09-10
申请人： Toshiba Corp , 株式会社東芝
发明人： KAWAMOTO SATOSHI , ISHIKAWA MASAYUKI , UMEJI TADASHI , KONNO KUNIAKI , NITTA KOICHI , OKAZAKI HARUHIKO
IPC分类号： G09F9/00 , F21V9/16 , F21Y101/02 , G02F1/13357 , H01L33/32 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device suitable for various applications. SOLUTION: Ultraviolet light emitted from a light source part 20 provided with a light emitting element is transmitted through a dimming part 30e including a liquid crystal layer 36 and polarizing plates 31 and 39 holding the liquid crystal layer 36 between themselves and then is subjected to wavelength conversion into wavelength areas of red, green, and blue by a wavelength conversion part 40b including phosphors 44a, 44b, and 44c. An ultraviolet light absorbing filter 46 layered on the wavelength conversion part prevents leakage to the outside, of the ultraviolet light emitted from the light emitting element. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供适用于各种应用的发光装置。解决方案：从设置有发光元件的光源部分20发射的紫外光透过包括液晶层36的调光部分30e和将液晶层36保持在它们之间的偏振片31和39，然后是通过包括磷光体44a，44b和44c的波长转换部分40b将波长转换成红色，绿色和蓝色的波长区域。层叠在波长转换部上的紫外线吸收滤光器46防止从发光元件发出的紫外线向外部泄漏。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007251209A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007251209A
公开(公告)日：2007-09-27
申请号：JP2007160783
申请日：2007-06-18
申请人： Toshiba Corp , 株式会社東芝
发明人： KAWAMOTO SATOSHI , ISHIKAWA MASAYUKI , UMEJI TADASHI , KONNO KUNIAKI , NITTA KOICHI , OKAZAKI HARUHIKO
IPC分类号： G09F9/33 , H01L33/20 , H01L33/32 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device suitable for a light source of a picture display device in which miniaturization and weight reduction are easily realized, the visual field angle is wide, the display quality is high, and reliability is high, and for other various uses. SOLUTION: A plurality of light-emitting diodes having different wavelength is laminated so that light-emission is blocked when viewed from a light-extraction direction. The light-emitting devices are configured so that each of the light-emission from the plurality of the light-emitting diodes is extracted in the light-extraction direction. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于容易实现小型化和轻量化的图像显示装置的光源的发光装置，视场角度大，显示质量高，可靠性高高，用于其他各种用途。解决方案：多个具有不同波长的发光二极管被层压，使得当从光提取方向观察时发光被阻挡。发光装置被配置为使得来自多个发光二极管的发光中的每一个在光提取方向上被提取。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005095905A Cladding-by-welding diffusion repairing device, and method therefor 审中-公开
标题翻译：焊接扩散修补装置及其方法
公开(公告)号：JP2005095905A
公开(公告)日：2005-04-14
申请号：JP2003329862
申请日：2003-09-22
申请人： Toshiba Corp , 株式会社東芝
发明人： ISHIKAWA MASAYUKI , FUSE TOSHIAKI , NAKABASHI MASAKO , KITAYAMA KAZUHIRO
IPC分类号： F01D25/00 , B23K20/00 , B23K20/26 , F02C7/00
摘要： PROBLEM TO BE SOLVED: To provide a cladding-by-welding diffusion repairing device capable of preventing burn through of cladding-by-welding diffusion repairing materials even when a repair surface of a member to be repaired is erected upright, and performing multiple simultaneous repair.
SOLUTION: A member 11 having two surfaces facing each other as repair parts is disposed on a surface inclined by a predetermined angle from the horizon, and a pair of holding plates 15a and 15b hold cladding-by-welding diffusion repairing materials 14a and 14b facing each other disposed on the repair parts 13a and 13b, respectively. A pressing mechanism part 18 presses and holds the cladding-by-welding diffusion repairing materials 14a and 14b facing each other via the pair of holding plates 15a and 15b with the pressure not more than the deformation stresses in a diffusion heat treatment temperature zone of the cladding-by-welding diffusion repairing materials 14a and 14b. Burn through of the cladding-by-welding diffusion repairing materials 14a and 14b mounted on the repair parts 13a and 13b is prevented during a repairing step.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使当要修理的构件的修理面竖直竖立时，提供能够防止包覆焊接扩散修复材料的烧穿的包覆焊接扩散修复装置，并且执行多次同时修复。解决方案：将具有彼此面对的两个表面作为修复部分的构件11设置在从地平线倾斜预定角度的表面上，并且一对保持板15a和15b保持焊接扩散修复材料14a 和14b分别设置在修理部分13a和13b上。按压机构部18通过一对保持板15a，15b将彼此面对的焊接扩散修复材料14a和14b按压并保持在不大于扩散热处理温度区域内的变形应力的压力焊接扩散修复材料14a和14b。在修理步骤期间，防止安装在修理部分13a和13b上的焊接扩散修复材料14a和14b的烧穿。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004122221A Manufacturing method for part having cooling path 审中-公开
公开(公告)号：JP2004122221A
公开(公告)日：2004-04-22
申请号：JP2002293643
申请日：2002-10-07
申请人： Toshiba Corp , 株式会社東芝
发明人： FUSE TOSHIAKI , ISHIKAWA MASAYUKI , SHIBUYA SUMIICHI
IPC分类号： B23K20/12
摘要： PROBLEM TO BE SOLVED: To manufacture a part having a high-quality cooling path high in machining percision and high in quality without causing contamination of use environment with a high production yield and at a low production cost.
SOLUTION: The part having the cooling path is constituted by combining a solid material with a base shape material which has a void space for circulating a cooling medium. The base shape material and the solid material are integrally joined by a friction stir welding method.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2011135113A Method for manufacturing light emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：JP2011135113A
公开(公告)日：2011-07-07
申请号：JP2011086003
申请日：2011-04-08
申请人： Toshiba Corp , 株式会社東芝
发明人： SUGIZAKI YOSHIAKI , SHIBATA HIDEKI , ISHIKAWA MASAYUKI , TAMURA HIDEO , KOMATSU TETSUO , KOJIMA AKIHIRO
IPC分类号： H01L33/48
CPC分类号： H01L2224/11 , H01L2924/01015
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting device that facilitates miniaturization, and has improved mass productivity. SOLUTION: A multilayer structure includes a substrate, a laminate including a light emitting layer, p-side electrodes and n-side electrodes, an insulating film, a p-side metal wiring layer, and an n-side metal wiring layer. The multilayer structure is supported by a support including p-side metal pillars, n-side metal pillars, and a packed layer packed in a space between the p-side metal wiring layer and the n-side metal wiring layer and a space between the p-side metal pillar and the n-side metal pillar, and the support serves as an external surface of the device in a surface of the opposite side to the substrate. In this state, the substrate is removed from the laminate. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造便于小型化的发光装置的方法，并且具有提高的批量生产率。解决方案：多层结构包括基板，包括发光层，p侧电极和n侧电极的层叠体，绝缘膜，p侧金属布线层和n侧金属布线层。多层结构由包括p侧金属柱，n侧金属柱和在p侧金属布线层和n侧金属布线层之间的空间中填充的填充层的支撑体支撑， p侧金属柱和n侧金属柱，并且支撑体在与基板相对的一侧的表面中用作该器件的外表面。在该状态下，将基板从层叠体上除去。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2007180583A Image display and light emitting device 审中-公开
标题翻译：图像显示和发光装置
公开(公告)号：JP2007180583A
公开(公告)日：2007-07-12
申请号：JP2007068309
申请日：2007-03-16
申请人： Toshiba Corp , 株式会社東芝
发明人： KAWAMOTO SATOSHI , ISHIKAWA MASAYUKI , UMEJI TADASHI , KONNO KUNIAKI , NITTA KOICHI , OKAZAKI HARUHIKO
IPC分类号： H01L33/32 , G02F1/13357 , G09F9/30 , H01L33/34 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/49113 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an image display which is easily made small-sized and lightweight, and has a large viewing angle, high display quality, and high reliability, and to provide a light emitting device which is suitable for use as a light source of such image display, or for other various uses. SOLUTION: This image display is constituted by combining materials having a wavelength conversion function, a dimming mechanism for adjusting the intensity of transmitted light, and a semiconductor light emitting element in various forms. A phosphor etc. is used for wavelength conversion. Liquid crystal etc. can be used as a dimming function. Moreover, by combining the semiconductor light emitting element and the wavelength conversion materials, such as the phosphors, in the various forms, the light emitting device is provided, which has a small size and a plurality of wavelengths, and high brightness. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种易于制造小型轻量化并具有大视角，高显示质量和高可靠性的图像显示器，并提供适合使用的发光装置作为这种图像显示的光源，或用于其他各种用途。解决方案：该图像显示是通过组合具有波长转换功能的材料，用于调节透射光强度的调光机构和各种形式的半导体发光元件构成的。荧光体等用于波长转换。液晶等可用作调光功能。此外，通过以各种形式组合半导体发光元件和诸如荧光体的波长转换材料，提供具有小尺寸和多个波长以及高亮度的发光器件。版权所有（C）2007，JPO＆INPIT

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