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1. 发明专利

JP2014241341A 半導体発光装置审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2014241341A
公开(公告)日：2014-12-25
申请号：JP2013123196
申请日：2013-06-11
申请人：株式会社東芝 , Toshiba Corp
发明人： USHIYAMA NAOYA , INOUE KAZUHIRO , SHIMOMURA KENJI , KOMATSU TETSUO , KUROKI TOSHIHIRO , YONEYA TOSHIHIRO , TAMURA KAZUHIRO , TSUBOI YOSHIHARU , TAKEUCHI TERUO , IWASHITA KAZUHISA
IPC分类号： H01L33/54 , H01L33/50
CPC分类号： H01L33/56 , H01L25/167 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要：【課題】光取り出し効率の向上を可能とする半導体発光装置を提供する。【解決手段】半導体装置1aは、設置部上に設けられた発光素子10と、発光素子上に設けられた蛍光体含有樹脂15と、発光素子と蛍光体含有樹脂との間に設けられ、蛍光体含有樹脂の下面全体と接する透明樹脂と、を有する。半導体装置は、設置部と、上面及び側面が光反射材に覆われたシリコン基板と、シリコン基板上に光反射材を介して設けられた発光部とを有し、設置部上に設けられた発光素子と、を有する。【選択図】図1
摘要翻译：要解决的问题：提供可以提高光提取效率的半导体发光器件。解决方案：半导体器件1a包括：安装部分; 设置在安装部上的发光元件10; 设置在发光元件上的含磷光体树脂15; 以及设置在发光元件和含荧光体树脂之间并与含荧光体树脂的整个下表面接触的透明树脂。设置在安装部上的发光元件包括：上表面和侧面被光反射材料覆盖的硅基板; 以及经由所述光反射材料设置在所述硅基板上的发光部。

2. 发明专利

JP2012113919A Lighting device 审中-公开
标题翻译：照明设备
公开(公告)号：JP2012113919A
公开(公告)日：2012-06-14
申请号：JP2010260928
申请日：2010-11-24
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , INOUE KAZUHIRO
IPC分类号： F21S2/00 , F21V3/00 , F21V3/04 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/48
CPC分类号： G02F1/133603 , G02B6/0031 , G02B6/0055 , G02B6/0068 , G02B6/0073 , G02B6/0091 , G02F1/133615 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： PROBLEM TO BE SOLVED: To provide a lighting device, in which use efficiency of light emitted from an LED package is improved.SOLUTION: The lighting device includes an LED module, a light guide plate, and a support body. The LED module has a substrate, a wiring layer arranged on the substrate, and the LED package mounted on the wiring layer. A reflective surface with reflectivity with respect to light emitted from the LED package is arranged between a portion supporting the LED module and a portion supporting the light guide plate on the support body. The LED module is relatively tilted to the reflective surface by making an LED package mounting surface face to the reflective surface, and an angle between the LED module and the reflective surface is less than 90°.
摘要翻译：解决的问题：提供一种照明装置，其中提高了从LED封装发射的光的使用效率。解决方案：照明装置包括LED模块，导光板和支撑体。 LED模块具有衬底，布置在衬底上的布线层和安装在布线层上的LED封装。相对于从LED封装发射的光的反射率的反射面布置在支撑LED模块的部分和支撑导体板之间的支撑体上。 LED模块通过使LED封装安装表面朝向反射表面而相对于反射表面倾斜，并且LED模块和反射表面之间的角度小于90°。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011176271A Led package, and method for manufacturing the same 有权
标题翻译： LED封装及其制造方法
公开(公告)号：JP2011176271A
公开(公告)日：2011-09-08
申请号：JP2010186505
申请日：2010-08-23
申请人： Toshiba Corp , 株式会社東芝
发明人： EKOSHI HIDENORI , OSHIO HIROAKI , TAKEUCHI TERUO , MATSUMOTO IWAO , INOUE KAZUHIRO , SHIMIZU SATOSHI
IPC分类号： H01L33/54 , H01L33/30 , H01L33/56 , H01L33/62
CPC分类号： H01L24/97 , H01L24/45 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2224/85 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package and a method for manufacturing the LED package high in durability and reduced in cost. SOLUTION: The LED package includes first and second lead frames separated from each other, an LED chip, and a resin body. The LED chip is provided above the first and second lead frames, and includes a semiconductor layer containing at least indium, gallium and aluminum. One terminal of the LED chip is connected to the first lead frame, and the another terminal is connected to the second lead frame. The resin body covers the whole upper face, a part of a lower face and a part of an end face of each of the first and second lead frames, covers the LED chip, and exposes the rest of the lower face and the rest of the end face. The external form of the resin body forms the external form of the LED package. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种LED封装和用于制造LED封装的方法，其耐用性高，成本降低。解决方案：LED封装包括彼此分离的第一和第二引线框架，LED芯片和树脂体。 LED芯片设置在第一和第二引线框架的上方，并且包括至少含有铟，镓和铝的半导体层。 LED芯片的一个端子连接到第一引线框架，另一个端子连接到第二引线框架。树脂体覆盖整个上表面，下表面的一部分和每个第一引线框架和第二引线框架的端面的一部分覆盖LED芯片，并且暴露下表面的其余部分和其余部分端面。树脂体的外形形成LED封装的外部形式。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011176256A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011176256A
公开(公告)日：2011-09-08
申请号：JP2010103411
申请日：2010-04-28
申请人： Toshiba Corp , 株式会社東芝
发明人： SHIMIZU SATOSHI , TOYAKAN TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , OSHIO HIROAKI , KOMATSU TETSUO , WATARI HAJIME , INOUE KAZUHIRO , USHIYAMA NAOYA
IPC分类号： H01L33/62 , H01L33/52
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package having high durability and low cost, and to provide a method of manufacturing the same. SOLUTION: The LED package includes: first and second leadframes, which are disposed on the same plane, and are separated from each other; an LED chip, which is provided above the first and the second leadframes, has one terminal connected to the first leadframe, and the other terminal connected to the second leadframe; and a resin material. The resin material covers the LED chip, and also part of the upper, lower, and edges of respective first and second leadframes, and exposes the rest of the lower surface and the rest of the edge. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装，并提供其制造方法。解决方案：LED封装包括：第一和第二引线框架，它们设置在同一平面上并彼此分离; 设置在第一引线框架和第二引线框架上方的LED芯片具有连接到第一引线框架的一个端子，和连接到第二引线框架的另一个端子; 和树脂材料。树脂材料覆盖LED芯片，并且还覆盖相应的第一引线框架和第二引线框架的上，下和边缘的一部分，并且暴露下表面和边缘的其余部分。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2009290687A Antenna device and radio communication device 审中-公开
标题翻译：天线设备和无线电通信设备
公开(公告)号：JP2009290687A
公开(公告)日：2009-12-10
申请号：JP2008142663
申请日：2008-05-30
申请人： Toshiba Corp , 株式会社東芝
发明人： HIGAKI MAKOTO , INOUE KAZUHIRO , SUETSUNA NORIHIRO
IPC分类号： H01Q9/20 , H01Q1/38
CPC分类号： H01Q9/285 , H01Q1/243 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide an antenna device capable of wide band and highly efficient communication even when a thin magnetic body or a magnetic body onto the surface of which a conductor is difficult to package is used.
SOLUTION: The antenna device includes a first dielectric plate, a radiation element formed on the surface of the first dielectric plate, a second dielectric plate, a first conductor plate formed on the surface of the second dielectric plate, and a magnetic plate provided between the backside of the first dielectric plate and the backside of the second dielectric.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够进行宽带和高效率通信的天线装置，即使使用难以封装导体的表面上的薄磁体或磁体。解决方案：天线装置包括第一电介质板，形成在第一电介质板的表面上的辐射元件，第二电介质板，形成在第二电介质板的表面上的第一导体板和磁性板设置在第一电介质板的背面和第二电介质的背面之间。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009135797A Antenna apparatus 审中-公开
标题翻译：天线装置
公开(公告)号：JP2009135797A
公开(公告)日：2009-06-18
申请号：JP2007311069
申请日：2007-11-30
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , HIGAKI MAKOTO , SEKINE SHUICHI
IPC分类号： H01Q9/30 , H01Q19/10 , H01Q21/28 , H01Q21/30
CPC分类号： H01Q9/42 , H01Q1/243 , H01Q15/008
摘要： PROBLEM TO BE SOLVED: To bring a monopole antenna as closer as possible to an EBG substrate while suppressing the deterioration of antenna characteristics as much as possible.
SOLUTION: An antenna apparatus of one embodiment is equipped with a finite ground plane; a plurality of first planar elements arranged along and on both sides of a first gap line or a second gap line that is orthogonal to the first gap line; a plurality of first linear elements for connecting the finite ground plane with the first planar elements; a second linear element arranged in the first gap line or the second gap line; an antenna element including a third linear element arranged such that one end thereof is connected to one end of the second linear element and the other end thereof faces the finite ground plane; and a first feeding point for supplying electric power from the other end side of the third linear element to the antenna element. A connection point between the second and third linear elements is positioned in an intersection area of the first and second gap lines, and the first feeding point is provided in the vicinity of an edge of the finite ground plane.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了尽可能地抑制天线特性的恶化，使单极天线尽可能靠近EBG基板。解决方案：一个实施例的天线装置配备有有限的接地平面; 沿着与第一间隙线正交的第一间隙线或第二间隙线的两侧布置的多个第一平面元件; 用于将有限接地平面与第一平面元件连接的多个第一线性元件; 布置在第一间隙线或第二间隙线中的第二线性元件; 天线元件，包括第三线性元件，其布置成使得其一端连接到所述第二线性元件的一端并且其另一端面向所述有限接地平面; 以及用于从第三线性元件的另一端侧将电力提供给天线元件的第一馈电点。第二和第三线性元件之间的连接点位于第一和第二间隙线的交叉区域中，并且第一馈电点设置在有限接地平面的边缘附近。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008198892A Optical coupling apparatus 审中-公开
标题翻译：光耦合器
公开(公告)号：JP2008198892A
公开(公告)日：2008-08-28
申请号：JP2007034345
申请日：2007-02-15
申请人： Toshiba Corp , 株式会社東芝
发明人： OKAZAKI HARUHIKO , INOUE KAZUHIRO
IPC分类号： H01L31/12 , H01L23/02
CPC分类号： H01L2224/48091 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an optical coupling apparatus which can be miniaturized while securing reliability. SOLUTION: The optical coupling apparatus includes: a first substrate provided with a recessed part on a first main surface; a first wiring pattern, a second wiring pattern, a third wiring pattern and a fourth wiring pattern provided on the first main surface of the first substrate; a second substrate bonded to the first main surface; a first light emitting element provided in an internal space formed by bonding the first main surface and the second substrate and electrically connected with the first and second wiring patterns, for emitting the light of a wavelength to be light-shielded by the first and second substrates; and a light receiving element provided in the internal space and electrically connected with the third and fourth wiring patterns, for receiving the light emitted from the first light emitting element. At least a part of the light emitted from the first light emitting element is reflected by the second substrate and is made incident on the light receiving element. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以在确保可靠性的同时小型化的光耦合装置。光耦合装置包括：在第一主表面上设置有凹部的第一基板; 设置在第一基板的第一主表面上的第一布线图案，第二布线图案，第三布线图案和第四布线图案; 与第一主表面接合的第二基板; 第一发光元件，其设置在通过接合第一主表面和第二基板形成并与第一和第二布线图形电连接形成的内部空间中，用于发射由第一和第二基板遮光的波长的光 ; 以及设置在所述内部空间中并与所述第三和第四布线图案电连接的光接收元件，用于接收从所述第一发光元件发射的光。从第一发光元件发出的光的至少一部分被第二基板反射并入射到光接收元件上。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2014060628A Communication device 有权
标题翻译：通信设备
公开(公告)号：JP2014060628A
公开(公告)日：2014-04-03
申请号：JP2012205056
申请日：2012-09-18
申请人： Toshiba Corp , 株式会社東芝
发明人： OISHI TAKAFUMI , INOUE KAZUHIRO , OBAYASHI SHUICHI
IPC分类号： H04B13/00
CPC分类号： H04B13/005
摘要： PROBLEM TO BE SOLVED: To provide a communication device which improves the communication quality when an electric potential difference between electrodes is transmitted by a coupling phenomenon.SOLUTION: A communication device according to one embodiment of this invention includes: a substrate having ground; a communication circuit provided on one surface of the substrate; a first signal line which is connected with the communication circuit; an insulator which is provided so as to enclose the substrate; and a first conductor which is provided so as to enclose the insulator. Through holes are provided at the insulator and the first conductor so as to penetrate therethrough. Outer surfaces of the first signal line and the first conductor are electrically connected with each other.
摘要翻译：要解决的问题：提供一种当通过耦合现象传输电极之间的电位差时提高通信质量的通信设备。解决方案：根据本发明的一个实施例的通信设备包括：具有接地的基板; 设置在所述基板的一个表面上的通信电路; 与所述通信电路连接的第一信号线; 绝缘体，其设置成包围基板; 以及设置成包围绝缘体的第一导体。在绝缘体和第一导体上设置穿透孔，以穿过其中。第一信号线和第一导体的外表面彼此电连接。

9. 发明专利

JP2013239644A Semiconductor light emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2013239644A
公开(公告)日：2013-11-28
申请号：JP2012112747
申请日：2012-05-16
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO MASAMI , INOUE KAZUHIRO , NAGAHATA YASUNORI , TAKEUCHI TERUO , EKOSHI HIDENORI
IPC分类号： H01L33/62 , H01L33/52
CPC分类号： H01L33/62 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/0095 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73265 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device including a package which improves the productivity and reduces the costs.SOLUTION: A semiconductor light emitting device according to one embodiment includes an insulative base having a side surface contacting with a first surface and a second surface, the insulative base where a recessed part allowing the first surface to communicate with the second surface is provided on the side surface. The base includes: a first metal layer provided on the first surface and closing an opening of the recessed part; a second metal layer provided on an inner surface of the recessed part; and a third metal layer provided on the second surface and electrically connected with the first metal layer through the second metal layer. The semiconductor light emitting device further includes a semiconductor light emitting element fastened onto the first surface, and a resin that covers the first surface and seals the semiconductor light emitting element, the resin transmitting at least a part of light emitted from the semiconductor light emitting element.
摘要翻译：要解决的问题：提供一种包括提高生产率并降低成本的封装的半导体发光器件。解决方案：根据一个实施例的半导体发光器件包括具有与第一表面接触的侧表面的绝缘基底和第二表面，在侧表面上设置有允许第一表面与第二表面连通的凹部的绝缘底座。底座包括：第一金属层，设置在第一表面上并封闭凹部的开口; 设置在所述凹部的内表面上的第二金属层; 以及设置在所述第二表面上并通过所述第二金属层与所述第一金属层电连接的第三金属层。半导体发光器件还包括紧固在第一表面上的半导体发光元件和覆盖第一表面并密封半导体发光元件的树脂，树脂透射从半导体发光元件发射的光的至少一部分。

10. 发明专利

JP2013197119A Semiconductor light-emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2013197119A
公开(公告)日：2013-09-30
申请号：JP2012059344
申请日：2012-03-15
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , IWASHITA KAZUHISA
IPC分类号： H01L33/62
CPC分类号： H01L2224/32245 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device with high power and high reliability.SOLUTION: A semiconductor light-emitting device comprises: a substrate having a first principal surface, and a second principal surface on an opposite side to the first principal surface, and having a groove provided to any one of the first principal surface and the second principal surface; and a plurality of semiconductor light sources mounted on the first principal surface of the substrate. Each of the plurality of semiconductor light sources has: a first lead frame; a semiconductor light-emitting element fixed onto an upper surface of the first lead frame; a second lead frame juxtaposed to the first lead frame and electrically connected to the semiconductor element via a metal wire; and a transparent resin encapsulating the first lead frame, the semiconductor light-emitting element, and the second lead frame.
摘要翻译：要解决的问题：提供具有高功率和高可靠性的半导体发光器件。解决方案：一种半导体发光器件，包括：具有第一主表面的衬底和与第一主表面相反的一侧的第二主表面主表面，并且具有设置在第一主表面和第二主表面中的任一个上的凹槽; 以及安装在基板的第一主表面上的多个半导体光源。多个半导体光源中的每一个具有：第一引线框; 固定在所述第一引线框架的上表面上的半导体发光元件; 第二引线框架并置到所述第一引线框架并且经由金属线电连接到所述半导体元件; 以及封装第一引线框，半导体发光元件和第二引线框架的透明树脂。

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