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1. 发明专利

JP2012004596A Led package and method of manufacturing the same 审中-公开
标题翻译： LED封装及其制造方法
公开(公告)号：JP2012004596A
公开(公告)日：2012-01-05
申请号：JP2011206648
申请日：2011-09-21
申请人： Toshiba Corp , 株式会社東芝
发明人： USHIYAMA NAOYA , OSHIO HIROAKI , KOMATSU TETSUO , WATARI HAJIME , TONEDACHI TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , SHIMIZU SATOSHI
IPC分类号： H01L33/54 , H01L23/12 , H01L33/62
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85 , H01L2224/85051 , H01L2224/85186 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a highly durable LED package at a low cost, and to provide a method of manufacturing the same.SOLUTION: The LED package comprises first and second lead frames spaced apart from each other; an LED chip provided above the first and second lead frames and having one terminal connected with the first lead frame and the other terminal connected with the second lead frame; and a resin body which covers the top face and a part of the undersurface and the end face of each of the first and second lead frames, covers the LED chip and exposes the remainder of the undersurface and the remainder of the end face. The area of the top face of the resin body is smaller than the area of the undersurface thereof.
摘要翻译：要解决的问题：以低成本提供高耐用的LED封装，并提供其制造方法。解决方案：LED封装包括彼此间隔开的第一和第二引线框架; LED芯片，其设置在所述第一引线框架和所述第二引线框架之上，并且具有与所述第一引线框架连接的一个端子和与所述第二引线框架连接的所述另一个端子; 并且覆盖第一和第二引线框架的每一个的顶表面和下表面的一部分和端面的树脂体覆盖LED芯片并且暴露出下表面的其余部分和端面的其余部分。树脂体的顶面的面积小于其下表面的面积。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011205124A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011205124A
公开(公告)日：2011-10-13
申请号：JP2011126454
申请日：2011-06-06
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TOYAKAN TATSURO
IPC分类号： H01L33/48
CPC分类号： H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a high-durability and low-cost LED package.SOLUTION: The LED package includes a first and second lead frames spaced apart from each other; an LED chip mounted on the first lead frame with one terminal connected to the first lead frame and the other terminal connected to the second lead frame; a wire that connects the other terminal to the second lead frame; and a resin body that covers the first and second lead frames, the LED chip, and the wire. The second lead frame has a base section with a portion of the lower face, the upper face and an end face covered with the resin body, and with a remaining portion of the lower face exposed on the lower face of the resin body. The second lead frame, further, has a plurality of thin pieces, outwardly extending from the base section with the upper and lower faces covered with the resin body and tip faces, with each being exposed on a side face of the resin body.
摘要翻译：要解决的问题：提供高耐用性和低成本的LED封装。解决方案：LED封装包括彼此间隔开的第一和第二引线框架; 安装在第一引线框架上的LED芯片，一个端子连接到第一引线框架，而另一个端子连接到第二引线框架; 将另一端子连接到第二引线框架的导线; 以及覆盖第一引线框架和第二引线框架，LED芯片和电线的树脂体。第二引线框架具有基部，其具有下表面的一部分，上表面和用树脂体覆盖的端面，并且下表面的剩余部分暴露在树脂体的下表面上。此外，第二引线框架具有多个薄片，其从基部向外延伸，上表面和下表面被树脂体和尖端面覆盖，每个薄片暴露在树脂体的侧面。

3. 发明专利

JP2011176270A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2011176270A
公开(公告)日：2011-09-08
申请号：JP2010186398
申请日：2010-08-23
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TOYAKAN TATSURO
IPC分类号： H01L33/52 , H01L33/62
CPC分类号： H01L24/49 , H01L24/45 , H01L24/73 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/05599 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a durable and low-cost LED package. SOLUTION: The LED package 1 includes: first and second mutually separated lead frames 11, 12; an LED chip 14 that is provided at upper portions of the first and second lead frames, where one terminal is connected to the first lead frame and the other terminal is connected to the second lead frame; a wire 15 for connecting one terminal to the first lead frame; and a resin body 17 for covering the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base unit, where one portion of a lower surface and an upper surface and an end face are covered with the resin body, and the remainder of the lower surface is exposed on the resin body; and a plurality of suspension pins that extend from the base unit, where lower and upper surfaces are covered with the resin body and a tip surface is exposed on a side face of the resin body. An outer shape of the resin body 17 forms an outer shape of the LED package. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供耐用和低成本的LED封装。解决方案：LED封装1包括：第一和第二相互分离的引线框架11,12; 设置在第一引线框架和第二引线框架的上部的LED芯片14，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架; 用于将一个端子连接到第一引线框架的导线15; 以及用于覆盖第一和第二引线框，LED芯片和电线的树脂体17。第一引线框架包括基部单元，其中下表面的一部分和上表面以及端面被树脂体覆盖，并且下表面的其余部分暴露在树脂体上; 以及多个悬挂销，其从所述基座单元延伸，其中，所述下表面和所述上表面被所述树脂体覆盖，并且尖端表面暴露在所述树脂体的侧面上。树脂体17的外形形成LED封装的外形。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009152447A Optical coupler, and manufacturing method thereof 审中-公开
标题翻译：光耦合器及其制造方法
公开(公告)号：JP2009152447A
公开(公告)日：2009-07-09
申请号：JP2007330160
申请日：2007-12-21
申请人： Toshiba Corp , 株式会社東芝
发明人： TAKEUCHI TERUO
IPC分类号： H01L31/12 , H01L23/28
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a compact and highly reliable optical coupler, and to provide a manufacturing method thereof. SOLUTION: The optical coupler includes a first optical semiconductor element 12 placed on one part of a substrate 11 to emit or receive light; a second optical semiconductor element 13 placed on the other part of the substrate 11 separatedly from the first optical semiconductor element 12 to emit or receive light; a light-shielding material 14 placed on the substrate 11 between the first optical semiconductor element 12 and the second optical semiconductor element 13 and having a height H2 above the substrate 11 greater than the heights of the first and second optical semiconductor elements 12 and 13; and translucent resin 15 formed by integrally molding the substrate 11, light-shielding material 14, first optical semiconductor element 12, and second optical semiconductor element 13 and having a height H3 above the substrate 11 greater than the height of the light-shielding material 14. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种紧凑且高可靠性的光耦合器，并提供其制造方法。解决方案：光耦合器包括放置在基板11的一部分上以发射或接收光的第一光学半导体元件12; 放置在与第一光半导体元件12分离的衬底11的另一部分上以发射或接收光的第二光学半导体元件13; 放置在第一光半导体元件12和第二光半导体元件13之间的衬底11上并且具有高于第一和第二光半导体元件12和13的高度的衬底11上方的高度H2的光屏蔽材料14; 和通过将基板11，遮光材料14，第一光学半导体元件12和第二光学半导体元件13整体成型并且在基板11上方具有高于遮光材料14的高度的高度H3而形成的半透明树脂15 版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2004158739A Resin sealed semiconductor device and manufacturing method therefor 审中-公开
公开(公告)号：JP2004158739A
公开(公告)日：2004-06-03
申请号：JP2002324712
申请日：2002-11-08
申请人： Toshiba Corp , 株式会社東芝
发明人： MATSUSHIMA KOMEI , ARAKI KOJI , TAKEUCHI TERUO , SHIMIZU YOSHIYUKI
IPC分类号： H01L23/12 , H01L21/301 , H01L21/56
CPC分类号： H01L24/97 , H01L2224/16225 , H01L2924/15787 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the moisture resistance of a thin resin sealed semiconductor device. SOLUTION: The thin resin sealed semiconductor device is adapted such that the sides and the surface of a semiconductor chip 3 and the surface of a support substrate 1 are covered with resin 5, the back surface of the exposed semiconductor chip 3 and the resin 5 on the opposite sides are covered with a metal layer 7, and hence the semiconductor chip 3 does not expose any surface thereof. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2013239644A Semiconductor light emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：JP2013239644A
公开(公告)日：2013-11-28
申请号：JP2012112747
申请日：2012-05-16
申请人： Toshiba Corp , 株式会社東芝
发明人： YAMAMOTO MASAMI , INOUE KAZUHIRO , NAGAHATA YASUNORI , TAKEUCHI TERUO , EKOSHI HIDENORI
IPC分类号： H01L33/62 , H01L33/52
CPC分类号： H01L33/62 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/0095 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73265 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device including a package which improves the productivity and reduces the costs.SOLUTION: A semiconductor light emitting device according to one embodiment includes an insulative base having a side surface contacting with a first surface and a second surface, the insulative base where a recessed part allowing the first surface to communicate with the second surface is provided on the side surface. The base includes: a first metal layer provided on the first surface and closing an opening of the recessed part; a second metal layer provided on an inner surface of the recessed part; and a third metal layer provided on the second surface and electrically connected with the first metal layer through the second metal layer. The semiconductor light emitting device further includes a semiconductor light emitting element fastened onto the first surface, and a resin that covers the first surface and seals the semiconductor light emitting element, the resin transmitting at least a part of light emitted from the semiconductor light emitting element.
摘要翻译：要解决的问题：提供一种包括提高生产率并降低成本的封装的半导体发光器件。解决方案：根据一个实施例的半导体发光器件包括具有与第一表面接触的侧表面的绝缘基底和第二表面，在侧表面上设置有允许第一表面与第二表面连通的凹部的绝缘底座。底座包括：第一金属层，设置在第一表面上并封闭凹部的开口; 设置在所述凹部的内表面上的第二金属层; 以及设置在所述第二表面上并通过所述第二金属层与所述第一金属层电连接的第三金属层。半导体发光器件还包括紧固在第一表面上的半导体发光元件和覆盖第一表面并密封半导体发光元件的树脂，树脂透射从半导体发光元件发射的光的至少一部分。

7. 发明专利

JP2013008979A Semiconductor package 审中-公开
标题翻译：半导体封装
公开(公告)号：JP2013008979A
公开(公告)日：2013-01-10
申请号：JP2012172262
申请日：2012-08-02
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , EKOSHI HIDENORI , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TONEDACHI TATSURO , YAMAMOTO MASAMI
IPC分类号： H01L33/62 , H01L23/12 , H01L23/28 , H01L23/48 , H01L23/50 , H01L33/54
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package that is easily handled.SOLUTION: A semiconductor package 1 comprises: first and second lead frames 11 and 12 separated from each other; a semiconductor chip 14 disposed above the first and second lead frames 11 and 12 of which one terminal 14a is connected to the first lead frame 11 and other terminal 14b is connected to the second lead frame 12; and a resin body 17. The first and second lead frames 11 and 12 individually have: base portions 11a and 12a; and a plurality of suspension pins 11b through 11e and 12b through 12e that extend from the base portions 11a and 12a. The base portions 11a and 12a have: thin plate portions disposed at least at portions opposite to one another in the first and second lead frames 11 and 12; and projected portions 11g and 12g that project downward from the thin plate portions. Further, undersurfaces and lateral surfaces of the thin plate portions, lateral surfaces of the projected portions 11g and 12g and undersurfaces and lateral surfaces of the suspension pins 11b through 11e and 12b through 12e are covered with the resin body 17, and undersurfaces of the projected portions 11g and 12g and leading end surfaces of the suspension pins 11b through 11e and 12b through 12e are exposed from the resin body 17.
摘要翻译：要解决的问题：提供易于处理的半导体封装。解决方案：半导体封装1包括：彼此分离的第一引线框架11和第二引线框架12; 一个半导体芯片14设置在第一和第二引线框架11和12的上方，其中一个端子14a连接到第一引线框架11，而另一个端子14b连接到第二引线框架12; 第一引线框架11和第二引线框架12分别具有：基部11a和12a; 以及从基部11a，12a延伸的多个悬架销11b〜11e，12b〜12e。基部11a和12a具有：在第一和第二引线框架11和12中至少在彼此相对的部分处设置的薄板部分; 以及从薄板部向下方突出的突出部11g，12g。此外，薄板部分的下表面和侧表面，突出部分11g和12g的侧表面以及悬挂销11b至11e和12b至12e的下表面和侧表面被树脂体17覆盖，并且突出部分11g和12g的下表面部分11g和12g以及悬挂销11b至11e和12b至12e的前端表面从树脂体17露出。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2012114311A Led module 审中-公开
标题翻译： LED模块
公开(公告)号：JP2012114311A
公开(公告)日：2012-06-14
申请号：JP2010263147
申请日：2010-11-26
申请人： Toshiba Corp , 株式会社東芝
发明人： INOUE KAZUHIRO , TONEDACHI TATSURO , IWASHITA KAZUHISA , TAKEUCHI TERUO , KOMATSU TETSUO , WATARI HAJIME
IPC分类号： H01L33/54 , H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive LED module which has high durability.SOLUTION: According to the embodiment, an LED module comprises: a substrate; a wiring layer provided at the substrate; an LED package mounted on the wiring layer; and a reflector provided at a region of the substrate in which the LED package is not mounted. The LED package has first and second lead frames, an LED chip, and a resin body. An outer shape of the resin body forms an outer shape of the LED package.
摘要翻译：要解决的问题：提供具有高耐久性的便宜的LED模块。解决方案：根据实施例，LED模块包括：基板; 设置在基板上的布线层; 安装在布线层上的LED封装; 以及设置在其中未安装LED封装的基板的区域处的反射器。 LED封装具有第一和第二引线框架，LED芯片和树脂体。树脂体的外形形成LED封装的外形。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2012074732A Led package 有权
标题翻译： LED封装
公开(公告)号：JP2012074732A
公开(公告)日：2012-04-12
申请号：JP2011269829
申请日：2011-12-09
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TONEDACHI TATSURO
IPC分类号： H01L33/48
CPC分类号： H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide an LED package with high durability and low cost.SOLUTION: An LED package includes a first lead frame 11 and a second lead frame 12, which are separated from each other, an LED chip 14 which is provided above the first lead frame 11 and the second lead frame 12 and whose one terminal is connected to the first lead frame 11 and the other terminal is connected to the second lead frame 12, and a resin body 17 whose resin covers the parts of the first lead frame 11 and the second lead frame 12. The first lead frame 11 and the second lead frame 12 have base parts 11a and 12a, and a plurality of thin sections extending from the base parts 11a and 12a. The first lead frame 11 and the second lead frame 12 are exposed on the surfaces in the three directions of the resin body 17. And the distance between the end surface of the base parts 11a and 12a and the side face of the resin body 17 is 50% or more of the maximum thickness of the first lead frame 11 and the second lead frame 12.
摘要翻译：要解决的问题：提供具有高耐久性和低成本的LED封装。解决方案：LED封装包括彼此分离的第一引线框架11和第二引线框架12，设置在第一引线框架11和第二引线框架12上方的LED芯片14，端子连接到第一引线框架11，另一个端子连接到第二引线框架12，树脂体17覆盖第一引线框架11和第二引线框架12的部分。第一引线框架11 并且第二引线框架12具有基部11a和12a以及从基部11a和12a延伸的多个薄部。第一引线框架11和第二引线框架12在树脂体17的三个方向的表面上露出。基部11a和12a的端面与树脂体17的侧面之间的距离为第一引线框架11和第二引线框架12的最大厚度的50％以上。（C）2012，JPO＆INPIT

10. 发明专利

JP2011176364A Led package 审中-公开
标题翻译： LED封装
公开(公告)号：JP2011176364A
公开(公告)日：2011-09-08
申请号：JP2011116982
申请日：2011-05-25
申请人： Toshiba Corp , 株式会社東芝
发明人： WATARI HAJIME , MATSUMOTO IWAO , KOMATSU TETSUO , OSHIO HIROAKI , SHIMIZU SATOSHI , TAKEUCHI TERUO , IWASHITA KAZUHISA , TOYAKAN TATSURO
IPC分类号： H01L33/62 , H01L23/50
CPC分类号： H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a durable and low-cost LED package. SOLUTION: The LED package includes: first and second mutually separated lead frames; and an LED chip that is provided at upper portions of the first and second lead frames, where one terminal is connected to the first lead frame and the other terminal is connected to the second lead frame. The first lead frame and the second lead frame each include a base section and a plurality of suspension pins extending from the base section. One portion of a lower surface of the base section and an end face, and a lower surface and a side face of the suspension pins are covered with resin, and the remainder of the lower surface of the base section and the tip surface of the suspension pins are not covered with resin. Then, the distance between the end face of the base section and the surface of the resin is not less than 50% of the maximum thickness of the first and second lead frames. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供耐用和低成本的LED封装。解决方案：LED封装包括：第一和第二相互分离的引线框架; 以及设置在第一引线框架和第二引线框架的上部的LED芯片，其中一个端子连接到第一引线框架，而另一个端子连接到第二引线框架。第一引线框架和第二引线框架各自包括基部和从基部延伸的多个悬挂销。基部的下表面的一部分和端面以及悬挂销的下表面和侧面被树脂覆盖，并且基部的下表面的其余部分和悬架的顶表面针不被树脂覆盖。然后，基部的端面与树脂的表面之间的距离不小于第一和第二引线框的最大厚度的50％。版权所有（C）2011，JPO＆INPIT

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