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1. 发明授权

US07785697B2 Thin film device 有权
标题翻译：薄膜装置
公开(公告)号：US07785697B2
公开(公告)日：2010-08-31
申请号：US11819263
申请日：2007-06-26
申请人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
发明人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
IPC分类号： B32B3/02
CPC分类号： H01L23/5227 , H01F17/0033 , H01F41/042 , H01F2017/0073 , H01L2924/0002 , Y10T428/24521 , Y10T428/24612 , H01L2924/00
摘要： The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.
摘要翻译：本发明提供一种薄膜器件，其中树脂膜不容易分离。在薄膜器件中，在板状基体的一个主表面上形成导体图案，并且用树脂膜覆盖导体图案。该导体图案具有设置在基座的主表面上的底面，面向底面并远离基座的主表面的顶面以及连接底面和顶面的两个侧面。在这些侧面形成有凹部，绝缘膜延伸到凹部。

2. 发明申请

US20080003408A1 Thin film device 有权
标题翻译：薄膜装置
公开(公告)号：US20080003408A1
公开(公告)日：2008-01-03
申请号：US11819263
申请日：2007-06-26
申请人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
发明人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
IPC分类号： B32B3/02
CPC分类号： H01L23/5227 , H01F17/0033 , H01F41/042 , H01F2017/0073 , H01L2924/0002 , Y10T428/24521 , Y10T428/24612 , H01L2924/00
摘要： The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.
摘要翻译：本发明提供一种薄膜器件，其中树脂膜不容易分离。在薄膜器件中，在板状基体的一个主表面上形成导体图案，并且用树脂膜覆盖导体图案。该导体图案具有设置在基座的主表面上的底面，面向底面并远离基座的主表面的顶面以及连接底面和顶面的两个侧面。在这些侧面形成有凹部，绝缘膜延伸到凹部。

3. 发明授权

US07864017B2 Thin-film magnetic device, and electronic component module having same 有权
标题翻译：薄膜磁性装置和具有该薄膜磁性装置的电子部件模块
公开(公告)号：US07864017B2
公开(公告)日：2011-01-04
申请号：US12033422
申请日：2008-02-19
申请人： Toshiyasu Fujiwara , Kyung-Ku Choi
发明人： Toshiyasu Fujiwara , Kyung-Ku Choi
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F17/0013 , H01F27/346 , H01F2017/002 , H01F2017/0066 , H01F2017/008 , H01L2924/0002 , H01L2924/00
摘要： It is an object of the present invention to provide an electronic component module with which circuit malfunction can be adequately prevented. There are provided a base having wiring, and a thin-film magnetic device provided on one side of the base. The thin-film magnetic device comprises a first magnetic film disposed facing the base, a second magnetic film disposed on the opposite side of the first magnetic film with respect to the base, and a thin-film coil wound so as to encircle the second magnetic film a plurality of times. The thin-film coil has a plurality of first conductor pattern components provided between the first and second magnetic films, a plurality of second conductor pattern components provided on the opposite side of the second magnetic film with respect to the first magnetic film, and a plurality of connecting conductors that connect the first conductor pattern components and the second conductor pattern components in series. The relative magnetic permeability of the second magnetic film is greater than the relative magnetic permeability of the first magnetic film.
摘要翻译：本发明的目的是提供一种可以充分防止电路故障的电子部件模块。提供了具有布线的基座和设置在基座一侧的薄膜磁性装置。所述薄膜磁性装置包括面向所述基座的第一磁性膜，相对于所述基底设置在所述第一磁性膜的相反侧的第二磁性膜，以及环绕所述第二磁性体的环绕所述第二磁性膜的薄膜线圈多次拍摄。所述薄膜线圈具有设置在所述第一和第二磁性膜之间的多个第一导体图案部件，设置在所述第二磁性膜相对于所述第一磁性膜的相反侧的多个第二导体图案部件，以及多个连接导体，其连接第一导体图案部件和第二导体图案部件。第二磁性膜的相对导磁率大于第一磁性膜的相对导磁率。

4. 发明申请

US20070230049A1 Thin film device 审中-公开
标题翻译：薄膜装置
公开(公告)号：US20070230049A1
公开(公告)日：2007-10-04
申请号：US11725444
申请日：2007-03-20
申请人： Toshiyasu Fujiwara , Kyung-Ku Choi
发明人： Toshiyasu Fujiwara , Kyung-Ku Choi
IPC分类号： G11B5/147 , G11B5/17
CPC分类号： H01F17/0013 , G11B5/17 , H01F2017/0066
摘要： A thin film device is provided which is capable of improving a Q value when employing a thin film coil wound on a magnetic film. In the thin film coil wound on an upper magnetic film, the thickness (TA) of lower coil portions in between a lower magnetic film and the upper magnetic film is larger than the thickness (TB) of upper coil portions not in between the lower and upper magnetic films (the thickness ratio TB/TA
摘要翻译：提供一种薄膜器件，其能够在使用缠绕在磁性膜上的薄膜线圈时提高Q值。在缠绕在上磁性薄膜上的薄膜线圈中，下部磁性膜与上部磁性膜之间的下部线圈部分的厚度（TA）大于上部线圈部分的厚度（TB），不在下部和上磁膜（厚度比TB / TA <1）。与第一和第二磁性膜之间的第一线圈部分交叉的交叉磁通可以比下部线圈部分的厚度（TA）小于或等于上部的厚度（TB）的情况下减小线圈部分（厚度比TB / TA> = 1）。

5. 发明授权

US07498919B2 Thin film device 有权
标题翻译：薄膜装置
公开(公告)号：US07498919B2
公开(公告)日：2009-03-03
申请号：US11723128
申请日：2007-03-16
申请人： Toshiyasu Fujiwara , Kyung-Ku Choi
发明人： Toshiyasu Fujiwara , Kyung-Ku Choi
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F2017/0066
摘要： A thin film device, which can maintain desirable performance characteristics by reducing parasitic capacitance and increasing the Q factor even when a thin film coil of a solenoid type is equipped, is provided. The thin film coil of a solenoid type has a cross sectional width which varies with position along a film thickness direction.
摘要翻译：提供了一种薄膜器件，其通过减少寄生电容并且即使在配备有螺线管型薄膜线圈的情况下也可以提高Q因数来保持期望的性能特性。螺线管型薄膜线圈的横截面宽度随膜厚方向的位置而变化。

6. 发明申请

US20070222550A1 Thin film device 有权
标题翻译：薄膜装置
公开(公告)号：US20070222550A1
公开(公告)日：2007-09-27
申请号：US11723128
申请日：2007-03-16
申请人： Toshiyasu Fujiwara , Kyung-Ku Choi
发明人： Toshiyasu Fujiwara , Kyung-Ku Choi
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F2017/0066
摘要： A thin film device, which can maintain desirable performance characteristics by reducing parasitic capacitance and increasing the Q factor even when a thin film coil of a solenoid type is equipped, is provided. The thin film coil of a solenoid type has a cross sectional width which varies with position along a film thickness direction.
摘要翻译：提供了一种薄膜器件，其通过减少寄生电容并且即使在配备有螺线管型薄膜线圈的情况下也可以提高Q因数来保持期望的性能特性。螺线管型薄膜线圈的横截面宽度随膜厚方向的位置而变化。

7. 发明授权

US08324509B2 Electronic component and manufacturing method thereof 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US08324509B2
公开(公告)日：2012-12-04
申请号：US12853629
申请日：2010-08-10
申请人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K1/16
CPC分类号： H01L28/60 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/86 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor 1, which is an electronic component, has: a first upper electrode 5a formed above a substrate 2; a first seat 10 and a second seat 11 which are formed adjacent to the first upper electrode 5a; passivation layers 6 and 8 that cover the first upper electrode 5a and the first and second seats 10 and 11; and a terminal electrode 9a formed above the first and second seats 10 and 11 and connected to the first upper electrode 5a via via-conductors Va and Vc which are formed through the passivation layers 6 and 8 respectively.
摘要翻译：本发明提供一种电子部件及其制造方法，其可以使电子部件以比以往更高的密度安装在外部基板上; 可以根据需要调整端子电极的高度（电平），从而解决在常规电子部件的检查中会发生的问题; 并且还可以提高电子部件的安装成品率，从而提高生产率。作为电子部件的电容器1具有：在基板2的上方形成的第一上部电极5a，与第一上部电极5a相邻形成的第一座椅10和第二座椅11; 覆盖第一上电极5a和第一座和第二座10和11的钝化层6和8; 以及形成在第一座椅10和第二座椅11上方的端子电极9a，并且分别经由通过钝化层6和8形成的通孔导体Va和Vc连接到第一上部电极5a。

8. 发明申请

US20110044011A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US20110044011A1
公开(公告)日：2011-02-24
申请号：US12853712
申请日：2010-08-10
申请人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K7/00 , B32B38/04
CPC分类号： H01L28/40 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/55 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , Y10T29/417 , Y10T156/1056 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1, has: a circuit element 5a formed on a substrate 2; an electrode layer 5b connected to the circuit element 5a; passivation layers 6 and 8 that cover the electrode layer 5b; and terminal electrodes 9a and 9b connected to the electrode layer 5b via via-conductors Va and Vb formed through the passivation layers 6 and 8, the terminal electrodes 9a and 9b being formed to cover the side wall of the passivation layers 6 and 8. Since the pad electrodes 9a and 9b are formed so as to cover the passivation layers 6 and 8 across their uppermost surfaces and side walls, the area of contact between the pad electrodes 9a and 9b and the solder for solder-mounting increases, and the capacitor 1 can consequently exhibit an improved adhesion strength.
摘要翻译：本发明提供一种电子部件及其制造方法，其能够在将电子部件焊接安装在外部基板上时实现提高的粘合强度，能够获得显着改善的电气性能和可靠性等。作为电子部件电容器1具有：形成在基板2上的电路元件5a; 连接到电路元件5a的电极层5b; 覆盖电极层5b的钝化层6和8; 以及通过经由钝化层6和8形成的通孔导体Va和Vb连接到电极层5b的端子电极9a和9b，端子电极9a和9b形成为覆盖钝化层6和8的侧壁。由于焊盘电极9a和9b形成为在其最上表面和侧壁上覆盖钝化层6和8，焊盘电极9a和9b与焊料焊接用焊料之间的接触面积增加，电容器1 因此可以显示出改进的粘合强度。

9. 发明申请

US20110042127A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US20110042127A1
公开(公告)日：2011-02-24
申请号：US12853629
申请日：2010-08-10
申请人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K1/03 , B05D5/12
CPC分类号： H01L28/60 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/86 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor 1, which is an electronic component, has: a first upper electrode 5a formed above a substrate 2; a first seat 10 and a second seat 11 which are formed adjacent to the first upper electrode 5a; passivation layers 6 and 8 that cover the first upper electrode 5a and the first and second seats 10 and 11; and a terminal electrode 9a formed above the first and second seats 10 and 11 and connected to the first upper electrode 5a via via-conductors Va and Vc which are formed through the passivation layers 6 and 8 respectively.
摘要翻译：本发明提供一种电子部件及其制造方法，其可以使电子部件以比以往更高的密度安装在外部基板上; 可以根据需要调整端子电极的高度（电平），从而解决在常规电子部件的检查中会发生的问题; 并且还可以提高电子部件的安装成品率，从而提高生产率。作为电子部件的电容器1具有：在基板2的上方形成的第一上部电极5a，与第一上部电极5a相邻形成的第一座椅10和第二座椅11; 覆盖第一上电极5a和第一座和第二座10和11的钝化层6和8; 以及形成在第一座椅10和第二座椅11上方的端子电极9a，并且分别经由通过钝化层6和8形成的通孔导体Va和Vc连接到第一上部电极5a。

10. 发明授权

US06876536B2 Thin film capacitor and method for fabricating the same 有权
标题翻译：薄膜电容器及其制造方法
公开(公告)号：US06876536B2
公开(公告)日：2005-04-05
申请号：US10331140
申请日：2002-12-27
申请人： Yukio Sakashita , Kyung-Ku Choi
发明人： Yukio Sakashita , Kyung-Ku Choi
IPC分类号： H01G4/10 , H01G4/12 , H01G4/228 , H01G4/32 , H01G4/33 , H01L21/02 , H01L27/01 , H01L29/76
CPC分类号： H01G4/33 , H01G4/10 , H01G4/228 , H01L27/016 , H01L28/57 , H01L28/65
摘要： A thin film capacitor including a first electrode structural body, a second electrode structural body and a dielectric thin film provided between the first and second electrode structural bodies and containing a bismuth layer structured compound. The surface of the first electrode structural body in contact with the dielectric thin film is oriented in the [001] direction. As a result, the dielectric thin film is naturally oriented so that its c axis is substantially perpendicular to the electrode structural bodies. When a voltage is applied between the first and second electrode structural bodies, since the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound, the bismuth layer structured compound can be prevented from exhibiting the ferroelectric property and made to sufficiently exhibit the paraelectric property. Further, a bismuth oxide layer (Bi2O2)2+ functions as an insulating layer, thereby improves the insulation property of the dielectric thin film while makes the thin film much thinner.
摘要翻译：一种薄膜电容器，包括第一电极结构体，第二电极结构体和设置在第一和第二电极结构体之间并且包含铋层结构化合物的电介质薄膜。与电介质薄膜接触的第一电极结构体的表面在[001]方向上取向。结果，电介质薄膜被天然地取向为使其c轴基本垂直于电极结构体。当在第一和第二电极结构体之间施加电压时，由于电场方向基本上与铋层结构化合物的c轴重合，所以可以防止铋层结构化合物表现出铁电性质，充分展现了顺电特性。此外，氧化铋层（Bi 2 O 2）2+充当绝缘层，从而提高电介质薄膜的绝缘性，同时使薄膜更薄。

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