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1. 发明授权

US08324509B2 Electronic component and manufacturing method thereof 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US08324509B2
公开(公告)日：2012-12-04
申请号：US12853629
申请日：2010-08-10
申请人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K1/16
CPC分类号： H01L28/60 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/86 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor 1, which is an electronic component, has: a first upper electrode 5a formed above a substrate 2; a first seat 10 and a second seat 11 which are formed adjacent to the first upper electrode 5a; passivation layers 6 and 8 that cover the first upper electrode 5a and the first and second seats 10 and 11; and a terminal electrode 9a formed above the first and second seats 10 and 11 and connected to the first upper electrode 5a via via-conductors Va and Vc which are formed through the passivation layers 6 and 8 respectively.
摘要翻译：本发明提供一种电子部件及其制造方法，其可以使电子部件以比以往更高的密度安装在外部基板上; 可以根据需要调整端子电极的高度（电平），从而解决在常规电子部件的检查中会发生的问题; 并且还可以提高电子部件的安装成品率，从而提高生产率。作为电子部件的电容器1具有：在基板2的上方形成的第一上部电极5a，与第一上部电极5a相邻形成的第一座椅10和第二座椅11; 覆盖第一上电极5a和第一座和第二座10和11的钝化层6和8; 以及形成在第一座椅10和第二座椅11上方的端子电极9a，并且分别经由通过钝化层6和8形成的通孔导体Va和Vc连接到第一上部电极5a。

2. 发明申请

US20110044011A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US20110044011A1
公开(公告)日：2011-02-24
申请号：US12853712
申请日：2010-08-10
申请人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K7/00 , B32B38/04
CPC分类号： H01L28/40 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/55 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , Y10T29/417 , Y10T156/1056 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1, has: a circuit element 5a formed on a substrate 2; an electrode layer 5b connected to the circuit element 5a; passivation layers 6 and 8 that cover the electrode layer 5b; and terminal electrodes 9a and 9b connected to the electrode layer 5b via via-conductors Va and Vb formed through the passivation layers 6 and 8, the terminal electrodes 9a and 9b being formed to cover the side wall of the passivation layers 6 and 8. Since the pad electrodes 9a and 9b are formed so as to cover the passivation layers 6 and 8 across their uppermost surfaces and side walls, the area of contact between the pad electrodes 9a and 9b and the solder for solder-mounting increases, and the capacitor 1 can consequently exhibit an improved adhesion strength.
摘要翻译：本发明提供一种电子部件及其制造方法，其能够在将电子部件焊接安装在外部基板上时实现提高的粘合强度，能够获得显着改善的电气性能和可靠性等。作为电子部件电容器1具有：形成在基板2上的电路元件5a; 连接到电路元件5a的电极层5b; 覆盖电极层5b的钝化层6和8; 以及通过经由钝化层6和8形成的通孔导体Va和Vb连接到电极层5b的端子电极9a和9b，端子电极9a和9b形成为覆盖钝化层6和8的侧壁。由于焊盘电极9a和9b形成为在其最上表面和侧壁上覆盖钝化层6和8，焊盘电极9a和9b与焊料焊接用焊料之间的接触面积增加，电容器1 因此可以显示出改进的粘合强度。

3. 发明申请

US20110042127A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US20110042127A1
公开(公告)日：2011-02-24
申请号：US12853629
申请日：2010-08-10
申请人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi OHTSUKA , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H05K1/03 , B05D5/12
CPC分类号： H01L28/60 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/86 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor 1, which is an electronic component, has: a first upper electrode 5a formed above a substrate 2; a first seat 10 and a second seat 11 which are formed adjacent to the first upper electrode 5a; passivation layers 6 and 8 that cover the first upper electrode 5a and the first and second seats 10 and 11; and a terminal electrode 9a formed above the first and second seats 10 and 11 and connected to the first upper electrode 5a via via-conductors Va and Vc which are formed through the passivation layers 6 and 8 respectively.
摘要翻译：本发明提供一种电子部件及其制造方法，其可以使电子部件以比以往更高的密度安装在外部基板上; 可以根据需要调整端子电极的高度（电平），从而解决在常规电子部件的检查中会发生的问题; 并且还可以提高电子部件的安装成品率，从而提高生产率。作为电子部件的电容器1具有：在基板2的上方形成的第一上部电极5a，与第一上部电极5a相邻形成的第一座椅10和第二座椅11; 覆盖第一上电极5a和第一座和第二座10和11的钝化层6和8; 以及形成在第一座椅10和第二座椅11上方的端子电极9a，并且分别经由通过钝化层6和8形成的通孔导体Va和Vc连接到第一上部电极5a。

4. 发明授权

US06876536B2 Thin film capacitor and method for fabricating the same 有权
标题翻译：薄膜电容器及其制造方法
公开(公告)号：US06876536B2
公开(公告)日：2005-04-05
申请号：US10331140
申请日：2002-12-27
申请人： Yukio Sakashita , Kyung-Ku Choi
发明人： Yukio Sakashita , Kyung-Ku Choi
IPC分类号： H01G4/10 , H01G4/12 , H01G4/228 , H01G4/32 , H01G4/33 , H01L21/02 , H01L27/01 , H01L29/76
CPC分类号： H01G4/33 , H01G4/10 , H01G4/228 , H01L27/016 , H01L28/57 , H01L28/65
摘要： A thin film capacitor including a first electrode structural body, a second electrode structural body and a dielectric thin film provided between the first and second electrode structural bodies and containing a bismuth layer structured compound. The surface of the first electrode structural body in contact with the dielectric thin film is oriented in the [001] direction. As a result, the dielectric thin film is naturally oriented so that its c axis is substantially perpendicular to the electrode structural bodies. When a voltage is applied between the first and second electrode structural bodies, since the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound, the bismuth layer structured compound can be prevented from exhibiting the ferroelectric property and made to sufficiently exhibit the paraelectric property. Further, a bismuth oxide layer (Bi2O2)2+ functions as an insulating layer, thereby improves the insulation property of the dielectric thin film while makes the thin film much thinner.
摘要翻译：一种薄膜电容器，包括第一电极结构体，第二电极结构体和设置在第一和第二电极结构体之间并且包含铋层结构化合物的电介质薄膜。与电介质薄膜接触的第一电极结构体的表面在[001]方向上取向。结果，电介质薄膜被天然地取向为使其c轴基本垂直于电极结构体。当在第一和第二电极结构体之间施加电压时，由于电场方向基本上与铋层结构化合物的c轴重合，所以可以防止铋层结构化合物表现出铁电性质，充分展现了顺电特性。此外，氧化铋层（Bi 2 O 2）2+充当绝缘层，从而提高电介质薄膜的绝缘性，同时使薄膜更薄。

5. 发明授权

US07864017B2 Thin-film magnetic device, and electronic component module having same 有权
标题翻译：薄膜磁性装置和具有该薄膜磁性装置的电子部件模块
公开(公告)号：US07864017B2
公开(公告)日：2011-01-04
申请号：US12033422
申请日：2008-02-19
申请人： Toshiyasu Fujiwara , Kyung-Ku Choi
发明人： Toshiyasu Fujiwara , Kyung-Ku Choi
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F17/0013 , H01F27/346 , H01F2017/002 , H01F2017/0066 , H01F2017/008 , H01L2924/0002 , H01L2924/00
摘要： It is an object of the present invention to provide an electronic component module with which circuit malfunction can be adequately prevented. There are provided a base having wiring, and a thin-film magnetic device provided on one side of the base. The thin-film magnetic device comprises a first magnetic film disposed facing the base, a second magnetic film disposed on the opposite side of the first magnetic film with respect to the base, and a thin-film coil wound so as to encircle the second magnetic film a plurality of times. The thin-film coil has a plurality of first conductor pattern components provided between the first and second magnetic films, a plurality of second conductor pattern components provided on the opposite side of the second magnetic film with respect to the first magnetic film, and a plurality of connecting conductors that connect the first conductor pattern components and the second conductor pattern components in series. The relative magnetic permeability of the second magnetic film is greater than the relative magnetic permeability of the first magnetic film.
摘要翻译：本发明的目的是提供一种可以充分防止电路故障的电子部件模块。提供了具有布线的基座和设置在基座一侧的薄膜磁性装置。所述薄膜磁性装置包括面向所述基座的第一磁性膜，相对于所述基底设置在所述第一磁性膜的相反侧的第二磁性膜，以及环绕所述第二磁性体的环绕所述第二磁性膜的薄膜线圈多次拍摄。所述薄膜线圈具有设置在所述第一和第二磁性膜之间的多个第一导体图案部件，设置在所述第二磁性膜相对于所述第一磁性膜的相反侧的多个第二导体图案部件，以及多个连接导体，其连接第一导体图案部件和第二导体图案部件。第二磁性膜的相对导磁率大于第一磁性膜的相对导磁率。

6. 发明授权

US07785697B2 Thin film device 有权
标题翻译：薄膜装置
公开(公告)号：US07785697B2
公开(公告)日：2010-08-31
申请号：US11819263
申请日：2007-06-26
申请人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
发明人： Taku Masai , Hitoshi Sakuma , Kyung-Ku Choi , Toshiyasu Fujiwara
IPC分类号： B32B3/02
CPC分类号： H01L23/5227 , H01F17/0033 , H01F41/042 , H01F2017/0073 , H01L2924/0002 , Y10T428/24521 , Y10T428/24612 , H01L2924/00
摘要： The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.
摘要翻译：本发明提供一种薄膜器件，其中树脂膜不容易分离。在薄膜器件中，在板状基体的一个主表面上形成导体图案，并且用树脂膜覆盖导体图案。该导体图案具有设置在基座的主表面上的底面，面向底面并远离基座的主表面的顶面以及连接底面和顶面的两个侧面。在这些侧面形成有凹部，绝缘膜延伸到凹部。

7. 发明授权

US07224254B2 High-frequency magnetic thin film, composite magnetic thin film, and magnetic device using same 有权
标题翻译：高频磁性薄膜，复合磁性薄膜及使用其的磁性装置
公开(公告)号：US07224254B2
公开(公告)日：2007-05-29
申请号：US10502490
申请日：2003-01-10
申请人： Kyung-Ku Choi , Taku Murase , Yohtaro Yamazaki
发明人： Kyung-Ku Choi , Taku Murase , Yohtaro Yamazaki
IPC分类号： H01F5/00
CPC分类号： H01L27/08 , B82Y25/00 , H01F1/15358 , H01F5/00 , H01F10/132 , H01F10/14 , H01F10/3204 , H01F17/0006 , H01F17/0013 , H01F17/04 , H01F41/0226 , H01F41/046
摘要： A high frequency magnetic thin film characterized by comprising a first layer made of a T-L composition (here, T is Fe or FeCo, and L is one or more of C, B, and N) and a second layer comprising a Co-based amorphous alloy arranged on either of the surfaces of the first layer. The high frequency magnetic thin film is a multilayer film of a plurality of the first layers and a plurality of the second layers or desirably is a multilayer film of alternately laminated first and second layers. The high frequency magnetic thin film of the present invention exhibits the properties such that the real part (μ′) of the complex permeability is 400 or more at 1 GHz, a quality factor Q (Q=μ′/μ″) is 4 or more, and a saturation magnetization is 14 kG (1.4T) or more.
摘要翻译：一种高频磁性薄膜，其特征在于包括由TL组合物制成的第一层（这里，T是Fe或FeCo，L是C，B和N中的一种或多种），第二层包含Co基非晶合金布置在第一层的任一表面上。高频磁性薄膜是多个第一层和多个第二层的多层膜，或期望地是交替层叠的第一层和第二层的多层膜。本发明的高频磁性薄膜的特征在于，1GHz时的复磁导率的实数（μ'）为400以上，品质因数Q（Q = mu'/ mu“）为4 以上，饱和磁化强度为14kG（1.4T）以上。

8. 发明授权

US08351185B2 Electronic component and manufacturing method thereof 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：US08351185B2
公开(公告)日：2013-01-08
申请号：US12853712
申请日：2010-08-10
申请人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
发明人： Takashi Ohtsuka , Kyung-Ku Choi , Tatsuo Namikawa , Hitoshi Yamaguchi
IPC分类号： H01G9/00
CPC分类号： H01L28/40 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L28/55 , H01L2224/04042 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/30107 , Y10T29/417 , Y10T156/1056 , H01L2924/00
摘要： The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1, has: a circuit element 5a formed on a substrate 2; an electrode layer 5b connected to the circuit element 5a; passivation layers 6 and 8 that cover the electrode layer 5b; and terminal electrodes 9a and 9b connected to the electrode layer 5b via via-conductors Va and Vb formed through the passivation layers 6 and 8, the terminal electrodes 9a and 9b being formed to cover the side wall of the passivation layers 6 and 8. Since the pad electrodes 9a and 9b are formed so as to cover the passivation layers 6 and 8 across their uppermost surfaces and side walls, the area of contact between the pad electrodes 9a and 9b and the solder for solder-mounting increases, and the capacitor 1 can consequently exhibit an improved adhesion strength.
摘要翻译：本发明提供一种电子部件及其制造方法，其能够在将电子部件焊接安装在外部基板上时实现提高的粘合强度，能够获得显着改善的电气特性和可靠性等。电子部件为电容器1具有：形成在基板2上的电路元件5a; 连接到电路元件5a的电极层5b; 覆盖电极层5b的钝化层6和8; 以及通过经由钝化层6和8形成的通孔导体Va和Vb连接到电极层5b的端子电极9a和9b，端子电极9a和9b形成为覆盖钝化层6和8的侧壁。由于焊盘电极9a和9b形成为在其最上表面和侧壁上覆盖钝化层6和8，焊盘电极9a和9b与焊料焊接用焊料之间的接触面积增加，电容器1 因此可以显示出改进的粘合强度。

9. 发明授权

US07588840B2 Magnetic thin film and method of forming the same, magnetic device and inductor, and method of manufacturing magnetic device 有权
标题翻译：磁性薄膜及其形成方法，磁性器件和电感器以及制造磁性器件的方法
公开(公告)号：US07588840B2
公开(公告)日：2009-09-15
申请号：US11287322
申请日：2005-11-28
申请人： Kyung-Ku Choi
发明人： Kyung-Ku Choi
IPC分类号： H01F1/12 , H01F17/00
CPC分类号： B82Y25/00 , H01F10/007 , H01F17/0006 , H01F41/14 , Y10T428/115 , Y10T428/12465 , Y10T428/12771 , Y10T428/12986 , Y10T428/32
摘要： A magnetic thin film with a high resonant frequency and superior high-frequency characteristics, and a magnetic device and an inductor with superior high-frequency characteristics are provided. A planar coil and a magnetic thin film are disposed on a substrate, and an inductor is formed between connection terminals. An obliquely-grown magnetic layer in the magnetic thin film is crystal-grown in an oblique direction with respect to a surface of the substrate (an obliquely-grown magnetic body). In order to make the obliquely-grown magnetic body exhibit soft magnetism in the obliquely-grown magnetic layer, an insulator is mixed into the obliquely-grown magnetic body. The obliquely-grown magnetic layer shows in-plane magnetocrystalline anisotropy, and the in-plane magnetocrystalline anisotropy is increased, and an anisotropic magnetic field is increased. The anisotropic magnetic field can be changed only by a crystal growth direction of the obliquely-grown magnetic layer, so without reducing saturation magnetization, the anisotropic magnetic field can be increased, and the resonant frequency of the magnetic thin film can be improved.
摘要翻译：提供了具有高谐振频率和优异的高频特性的磁性薄膜，以及具有优异的高频特性的磁性器件和电感器。平面线圈和磁性薄膜设置在基板上，并且在连接端子之间形成电感器。磁性薄膜中的倾斜生长磁性层相对于基板（倾斜生长的磁性体）的表面在倾斜方向上晶体生长。为了使倾斜生长的磁性体在倾斜生长的磁性层中呈现柔软的磁性，将绝缘体混入倾斜生长的磁性体中。倾斜生长的磁性层显示平面内的晶体各向异性，面内磁晶各向异性增大，各向异性磁场增加。各向异性磁场只能通过倾斜生长磁性层的晶体生长方向进行改变，因此不会降低饱和磁化强度，能够提高各向异性磁场，提高磁性薄膜的共振频率。

10. 发明申请

US20080292876A1 Soft Magnetic Member and Magnetic Device Including the Same 审中-公开
标题翻译：软磁构件及其磁性装置
公开(公告)号：US20080292876A1
公开(公告)日：2008-11-27
申请号：US10543863
申请日：2003-12-16
申请人： Kyung-Ku Choi , Taku Murase
发明人： Kyung-Ku Choi , Taku Murase
IPC分类号： B32B5/00 , B32B15/18
CPC分类号： H01F10/131 , H01F10/132 , H01F10/265 , H01F17/0006 , H01F2017/0066 , H01L23/5227 , H01L2924/0002 , Y10T428/265 , Y10T428/31678 , H01L2924/00
摘要： There is provided a soft magnetic member comprising a resin film 11 and a soft magnetic layer formed on the resin film 11, the soft magnetic layer comprising a T-L composition layer 7, wherein T is Fe or FeCO, and L is at least one element selected from the group consisting of C, B and N, and a Co based amorphous alloy layer 3 formed on either of the surfaces of the T-L composition layer 7. The Co based amorphous alloy layer 3 is combined with the T-L composition layer 7 to give a magnetic thin film for high frequency simultaneously exhibiting a high permeability and a high saturated magnetization. The magnetic thin film for high frequency can be formed on the resin film 11 because the magnetic thin film can exhibit excellent properties without a high-temperature heat treatment.
摘要翻译：提供了一种软磁性构件，其包括树脂膜11和形成在树脂膜11上的软磁性层，软磁性层包括TL组成层7，其中T是Fe或FeCO，L是选择的至少一种元素来自由C，B和N组成的组，以及形成在TL组合物层7的任一表面上的Co基非晶合金层3.将Co基非晶合金层3与TL组合物层7组合，得到同时表现出高磁导率和高饱和磁化强度的高频磁性薄膜。可以在树脂膜11上形成用于高频的磁性薄膜，因为磁性薄膜可以在没有高温热处理的情况下表现出优异的性能。

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