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    • 5. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110133178A1
    • 2011-06-09
    • US12957434
    • 2010-12-01
    • Shunpei YAMAZAKIDaisuke KAWAEHiromichi GODO
    • Shunpei YAMAZAKIDaisuke KAWAEHiromichi GODO
    • H01L27/092H01L29/12
    • H01L29/45H01L27/1225H01L29/7869
    • One object is to provide a p-channel transistor including an oxide semiconductor. Another object is to provide a complementary metal oxide semiconductor (CMOS) structure of an n-channel transistor including an oxide semiconductor and a p-channel transistor including an oxide semiconductor. A p-channel transistor including an oxide semiconductor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, and a source and drain electrode layers in contact with the oxide semiconductor layer. When the electron affinity and the band gap of an oxide semiconductor used for the oxide semiconductor layer in the semiconductor device, respectively, are χ (eV) and Eg (eV), the work function (φm) of the conductor used for the source electrode layer and the drain electrode layer satisfies φm>χ+Eg/2 and the barrier for holes (φBp) represented by (χ+Eg−φm) is less than 0.25 eV.
    • 一个目的是提供一种包括氧化物半导体的p沟道晶体管。 另一个目的是提供包括氧化物半导体的n沟道晶体管和包括氧化物半导体的p沟道晶体管的互补金属氧化物半导体(CMOS)结构。 包括氧化物半导体的p沟道晶体管包括与氧化物半导体层接触的栅极电极层,栅极绝缘层,氧化物半导体层以及源极和漏极电极层。 当半导体器件中用于氧化物半导体层的氧化物半导体的电子亲和力和带隙分别为χ(eV)和Eg(eV)时,用于该半导体器件的导体的功函数(&phgr; m) 源电极层和漏电极层满足< m +χ+ Eg / 2,并且由(χ+ Eg-&phgr; m)表示的空穴屏障(&phgr; Bp)小于0.25eV。
    • 6. 发明申请
    • THIN FILM TRANSISTOR AND DISPLAY DEVICE
    • 薄膜晶体管和显示器件
    • US20100148175A1
    • 2010-06-17
    • US12633067
    • 2009-12-08
    • Hiromichi GODOSatoshi KOBAYASHIHidekazu MIYAIRIToshiyuki ISAShunpei YAMAZAKI
    • Hiromichi GODOSatoshi KOBAYASHIHidekazu MIYAIRIToshiyuki ISAShunpei YAMAZAKI
    • H01L29/786
    • H01L29/78696H01L27/12H01L29/04
    • Off current of a bottom gate thin film transistor in which a semiconductor layer is shielded from light by a gate electrode is reduced. A thin film transistor includes a gate electrode layer; a first semiconductor layer; a second semiconductor layer, provided on and in contact with the first semiconductor layer; a gate insulating layer between and in contact with the gate electrode layer and the first semiconductor layer; impurity semiconductor layers in contact with the second semiconductor layer; and source and drain electrode layers partially in contact with the impurity semiconductor layers and the first and second semiconductor layers. The entire surface of the first semiconductor layer on the gate electrode layer side is covered by the gate electrode layer; and a potential barrier at a portion where the first semiconductor layer is in contact with the source or drain electrode layer is 0.5 eV or more.
    • 其中半导体层被栅极电极遮挡光的底栅薄膜晶体管的截止电流减小。 薄膜晶体管包括栅电极层; 第一半导体层; 第二半导体层,设置在第一半导体层上并与第一半导体层接触; 在栅极电极层和第一半导体层之间并与之接触的栅极绝缘层; 与第二半导体层接触的杂质半导体层; 以及与杂质半导体层和第一和第二半导体层部分接触的源极和漏极电极层。 栅极电极层侧的第一半导体层的整个表面被栅电极层覆盖; 并且在第一半导体层与源极或漏极电极层接触的部分处的势垒为0.5eV以上。