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    • 2. 发明授权
    • Dual resonant antenna circuit for RF tags
    • 用于RF标签的双谐振天线电路
    • US5317330A
    • 1994-05-31
    • US957119
    • 1992-10-07
    • David F. EverettDaniel C. Buck
    • David F. EverettDaniel C. Buck
    • H04B5/02G01S13/75G06K17/00G06K19/07H01Q21/00G08B13/24
    • G01S13/753G01S13/758G06K19/0723
    • A two-way communication system is provided having a stationary device and a portable passive device. The portable passive device has circuitry for storing and transmitting coded information. The stationary member transmits a signal at a first frequency via magnetic field and the portable passive device transmits coded information stored on circuitry provided therein at a second frequency also via a magnetic field. An antenna circuit is provided in the portable passive device having a parallel resonant circuit and a series resonant circuit. The parallel resonant circuit derives operating power from the signal at a first frequency for use in the circuitry provided in the portable passive device. The series resonant circuit transmits coded information at a second frequency.
    • 提供了具有固定装置和便携式无源装置的双向通信系统。 便携式无源设备具有用于存储和发送编码信息的电路。 固定构件通过磁场发送第一频率的信号,并且便携式无源装置也通过磁场以第二频率发送存储在其中提供的电路上的编码信息。 在具有并联谐振电路和串联谐振电路的便携式无源器件中设置有天线电路。 并联谐振电路从在第一频率的信号中导出工作功率,用于在便携式无源器件中提供的电路中使用。 串联谐振电路以第二频率发送编码信息。
    • 3. 发明授权
    • Low-loss semiconductor device and backside etching method for
manufacturing same
    • 低损耗半导体器件及其制造的背面蚀刻方法
    • US5252842A
    • 1993-10-12
    • US736670
    • 1991-07-26
    • Daniel C. BuckJames E. DegenfordSoong H. LeeScott A. ImhoffDale E. Dawson
    • Daniel C. BuckJames E. DegenfordSoong H. LeeScott A. ImhoffDale E. Dawson
    • H01L21/338H01L29/417H01L29/812H01L29/80H01L29/06H01L29/205H01L29/64
    • H01L29/66863H01L29/41733H01L29/8124H01L29/8126
    • A semiconductor device has material removed from the back of the substrate and a manufacturing process is provided for manufacturing these devices. In the exemplary embodiment, a GaAs FET chip is formed by a process including the step of etching the GaAs substrate from the back of the chip in a defined removal region to reduce the dielectric constant in the region of the source-to-drain path. A buffer layer of differing material provided between the active layers and the substrate prevents etching of the active layers during the removal process. To allow simplified etching patterns, the source-to-drain path may be laid out on the surface of the chip in a variety of patterns, including "packed" patterns concentrating a large path area in a small surface area of the chip. Optionally, this buffer layer may also be etched away in a further processing step. An insulating layer of material may be added to the back side of the chip in the etched region to increase structural strength, and a pressure relief ventilation path may be provided connecting the removal region to the outside at an edge or at the surface of the chip.
    • 半导体器件具有从衬底的背面去除的材料,并且提供制造这些器件的制造工艺。 在示例性实施例中,通过包括在限定的去除区域中从芯片背面蚀刻GaAs衬底以降低源极 - 漏极路径区域中的介电常数的步骤的方法形成GaAs FET芯片。 提供在有源层和衬底之间的不同材料的缓冲层防止在去除过程期间蚀刻活性层。 为了允许简化的蚀刻图案,源到漏极路径可以以各种图案布置在芯片的表面上,包括将芯片的小表面区域中的大路径区域集中的“封装”图案。 任选地,该缓冲层也可以在另外的处理步骤中被蚀刻掉。 可以在蚀刻区域中的芯片的背面添加绝缘层材料,以增加结构强度,并且可以提供在芯片的边缘或表面处将去除区域连接到外部的减压通气路径 。
    • 7. 发明授权
    • Low inductance cantilever switch
    • 低电感悬臂开关
    • US5258591A
    • 1993-11-02
    • US780690
    • 1991-10-18
    • Daniel C. Buck
    • Daniel C. Buck
    • H01H1/00H01H59/00H01H57/00
    • H01H1/0036H01H59/0009
    • An apparatus is disclosed for providing an electrostatically actuated mechanical switch utilizing a cantilever beam element fabricated by solid-state microfabrication techniques. The apparatus reduces the required pull down voltage and lowers the switch inductance by separating the pull down electrode and contact pad. The pull down electrode is placed further away from the fulcrum of the cantilever beam then the contact pad to optimize the mechanical advantages which allow for a reduced pull down voltage. The contact pad is placed closer to the cantilever fulcrum to reduce the associated switch inductance. The gap between the contact pad and the cantilever beam is less then the gap between the pull down electrode and the cantilever beam to insure that the cantilever makes first contact with the contact pad.
    • 公开了一种用于提供使用通过固态微细加工技术制造的悬臂梁元件的静电致动的机械开关的装置。 该装置通过分离下拉电极和接触垫来降低所需的下拉电压并降低开关电感。 下拉电极被放置得更远离悬臂梁的支点然后是接触垫,以优化允许降低下拉电压的机械优点。 接触垫放置得更靠近悬臂支点,以减少相关的开关电感。 接触垫和悬臂梁之间的间隙小于下拉电极和悬臂梁之间的间隙,以确保悬臂与接触垫第一次接触。
    • 9. 发明授权
    • Reflection mode notch filter
    • 反射模式陷波滤波器
    • US4207547A
    • 1980-06-10
    • US956705
    • 1978-11-01
    • Daniel C. Buck
    • Daniel C. Buck
    • H01P1/20H03H7/14
    • H01P1/20
    • A two stage transmission notch filter characteristic is achieved with one stage of microwave circuitry. Elimination of the second stage is accomplished by reflecting the microwave power back through a single stage device. Structurally, the adjacent ports of two 3 dB directional couplers are directly connected by delay lines of unequal delay times. The opposite adjacent ports of one coupler comprise the device input and output while the opposite adjacent ports of the other coupler are terminated in a manner that reflects microwave power back through the device. A phase shifter is inserted into one delay line for tuning and a non-reciprocal phase element is used to prevent reflected signals from emerging from the input port.
    • 通过一级微波电路实现两级传输陷波滤波器特性。 通过将微波功率反射回单级设备来实现第二级的消除。 在结构上,两个3 dB定向耦合器的相邻端口通过不等延迟时间的延迟线直接连接。 一个耦合器的相对的相邻端口包括设备输入和输出,而另一个耦合器的相对的相邻端口以反射微波功率的方式终止。 一个移相器被插入一个延迟线进行调谐,并且使用不可逆相位元件来防止反射信号从输入端口出现。